公开(公告)号：US20050265670A1

公开(公告)日：2005-12-01

申请号：US11135835

申请日：2005-05-23

申请人： Gary Sasser ,  Chris Togami ,  David Allouche

发明人： Gary Sasser ,  Chris Togami ,  David Allouche

IPC分类号： G02B6/36 ,  G02B6/42

CPC分类号： G02B6/4201 ,  G02B6/4246 ,  G02B6/4292

摘要： Embodiments of the present invention are directed to a modular optical device with a component insert for sending and/or receiving optical signals. A first fabricated package includes a light source for generating optical signals and/or a light detector for detecting received optical signals. A second fabricated package includes an opening for accepting circuitry. A lead frame mechanically connects the first fabricated package to the second fabricated package and electrically connects the light source and/or the light detector in the first fabricated package to contacts exposed in the opening of the second fabricated package. A component insert is mechanically coupled to the second fabricated package and electrically coupled to the exposed contacts for electrical interoperation with the light source and/or the light detector to transfer optical signals. The modular optical device can be coupled to a substrate configured to be received within a standard host system slot.

摘要翻译： 本发明的实施例涉及一种具有用于发送和/或接收光信号的部件插入件的模块化光学装置。 第一制造的封装包括用于产生光信号的光源和/或用于检测接收到的光信号的光检测器。 第二制造包装包括用于接受电路的开口。 引线框架将第一制造的封装机械地连接到第二制造封装，并将第一制造封装中的光源和/或光检测器电连接到暴露在第二制造封装的开口中的触点。 部件插入件机械耦合到第二制造的封装并电耦合到暴露的触点，用于与光源和/或光检测器的电互操作以传送光信号。 模块化光学设备可以耦合到被配置为被接收在标准主机系统时隙内的基板。

公开(公告)号：US20050286906A1

公开(公告)日：2005-12-29

申请号：US11145268

申请日：2005-06-02

申请人： Chris Togami ,  Paul Rosenberg ,  Gary Sasser

发明人： Chris Togami ,  Paul Rosenberg ,  Gary Sasser

IPC分类号： H04B10/00

CPC分类号： G02B6/4292 ,  G02B6/4246 ,  G02B6/4277

摘要： Embodiments of the present invention are directed to high density arrays of optical transceiver modules. A first fabricated package includes a light source and/or light detector, a first surface with at least one opening for transferring optical signals, and a second opposing surface. A second fabricated package has an opening for accepting a component insert and is oriented such that the length of the second fabricated package is essentially perpendicular to the second opposing surface. A lead frame mechanically connects the first fabricated package and the second fabricated package and electrically connects the light source and/or light detector in the first fabricated package to contacts exposed in the opening of the second fabricated package. A component insert is mechanically coupled to the second fabricated package and electrically coupled to the exposed contacts such that components of the component insert can electrically interoperate with the light source and/or light detector.

摘要翻译： 本发明的实施例涉及光收发器模块的高密度阵列。 第一制造的封装包括光源和/或光检测器，具有用于传送光信号的至少一个开口的第一表面和第二相对表面。 第二制造包装具有用于接纳部件插入件的开口，并且被定向成使得第二制造包装的长度基本上垂直于第二相对表面。 引线框架机械连接第一制造封装和第二制造封装，并将第一制造封装中的光源和/或光检测器电连接到暴露在第二制造封装的开口中的触点。 部件插入件机械地耦合到第二制造的封装并且电耦合到暴露的触点，使得部件插件的部件可以与光源和/或光检测器电互操作。

公开(公告)号：US20050286901A1

公开(公告)日：2005-12-29

申请号：US11146432

申请日：2005-06-06

申请人： Gary Sasser ,  Chris Togami ,  Peter Campbell

发明人： Gary Sasser ,  Chris Togami ,  Peter Campbell

IPC分类号： G02B6/42 ,  H04B10/00

CPC分类号： G02B6/4206 ,  G02B6/4246 ,  G02B6/4292

摘要： Embodiments of the present invention are directed to modular optical devices compatible with multiple fiber connectors. A lens block is configured such that one or more lens pins can mechanically couple to the lens block and such that the lens block can mechanically couple to a fabricated package that includes light transmitting and/or detecting components. At least one lens pin has a fiber stop configured to accept a fiber end prepared for use with a first type of fiber connector. A fiber stop disk alters the configuration of the lens pin such that the lens pin can compatibly accept a fiber end prepared for use with a second different type of fiber connector not withstanding that the fiber stop is configured to accept a fiber end prepared for use with the first type of fiber connector.

摘要翻译： 本发明的实施例涉及与多个光纤连接器兼容的模块化光学装置。 透镜块被配置为使得一个或多个透镜引脚可以机械地耦合到透镜块，并且使得透镜块可以机械地耦合到包括光透射和/或检测部件的制造的封装。 至少一个透镜销具有被配置为接受准备用于第一类型的光纤连接器的光纤端的光纤停止件。 光纤停止盘改变透镜销的配置，使得透镜销可以兼容地接受准备用于与第二种不同类型的光纤连接器一起使用的光纤端，而不是将光纤停止件配置为接受准备用于与 第一种类型的光纤连接器。

公开(公告)号：US06953289B2

公开(公告)日：2005-10-11

申请号：US10947015

申请日：2004-09-22

申请人： Chris Togami ,  Gary Sasser ,  Kai Ng

发明人： Chris Togami ,  Gary Sasser ,  Kai Ng

IPC分类号： G02B6/42 ,  G02B6/36

CPC分类号： G02B6/4277 ,  G02B6/4201 ,  G02B6/4245 ,  G02B6/4246 ,  G02B6/4256 ,  G02B6/428 ,  G02B6/4292 ,  H05K9/0058

摘要： This disclosure is generally concerned with optical modules. In one example, an optical module provided that includes a pair of optical subassemblies, each of which includes a port housing within which a corresponding optical component is disposed. The optical module further includes a pair of electrically conductive elements configured to facilitate control of EMI. Each of the electrically conductive elements is disposed on a respective port housing such that a gap is present between the first and second electrically conductive elements and the first and second electrically conductive elements do not contact each other.

摘要翻译： 本公开通常涉及光学模块。 在一个示例中，提供的光学模块包括一对光学子组件，每个光学子组件包括端口壳体，其中设置相应的光学部件。 光学模块还包括一对导电元件，其被配置为便于EMI的控制。 每个导电元件设置在相应的端口壳体上，使得在第一和第二导电元件之间存在间隙，并且第一和第二导电元件不彼此接触。

公开(公告)号：US20050036747A1

公开(公告)日：2005-02-17

申请号：US10947015

申请日：2004-09-22

申请人： Chris Togami ,  Gary Sasser ,  Kai Ng

发明人： Chris Togami ,  Gary Sasser ,  Kai Ng

IPC分类号： G02B6/42 ,  G02B6/36

CPC分类号： G02B6/4277 ,  G02B6/4201 ,  G02B6/4245 ,  G02B6/4246 ,  G02B6/4256 ,  G02B6/428 ,  G02B6/4292 ,  H05K9/0058

摘要： This disclosure is generally concerned with optical modules. In one example, an optical module provided that includes a pair of optical subassemblies, each of which includes a port housing within which a corresponding optical component is disposed. The optical module further includes a pair of electrically conductive elements configured to facilitate control of EMI. Each of the electrically conductive elements is disposed on a respective port housing such that a gap is present between the first and second electrically conductive elements and the first and second electrically conductive elements do not contact each other.

公开(公告)号：US07229317B2

公开(公告)日：2007-06-12

申请号：US11405950

申请日：2006-04-17

申请人： Chris Togami ,  Gary Sasser ,  Andreas Weber

发明人： Chris Togami ,  Gary Sasser ,  Andreas Weber

IPC分类号： H01R13/648

CPC分类号： G02B6/4292 ,  G02B6/4277 ,  H01R13/6582 ,  H05K9/0058

摘要： An EMI shielding mechanism for use with an electronic module, such as an opto-electronic transceiver module, is disclosed. The EMI shielding mechanism includes a plurality of shielding tabs disposed on an outside face of the module. When the module is fully disposed in a port of a host device, the shielding tabs contact an edge of the port, thus reducing the amount of EMI radiation emitted form that edge. The shielding tabs are angled so that when the module is fully disposed in the port, a portion of the shielding tabs is inside the port and a portion is outside of the port. The angled shielding tabs provide a spring force which assists a user to extract the module from the port.

摘要翻译： 公开了一种用于诸如光电收发器模块的电子模块的EMI屏蔽机构。 EMI屏蔽机构包括设置在模块的外表面上的多个屏蔽片。 当模块完全设置在主机设备的端口中时，屏蔽接头接触端口的边缘，从而减少从该边缘发射的EMI辐射的量。 屏蔽突片成角度，使得当模块完全设置在端口中时，屏蔽突片的一部分在端口内部，并且一部分在端口外部。 成角度的屏蔽突片提供弹簧力，其有助于用户从端口提取模块。

公开(公告)号：US20060153507A1

公开(公告)日：2006-07-13

申请号：US11134530

申请日：2005-05-20

申请人： Chris Togami ,  Gary Sasser

发明人： Chris Togami ,  Gary Sasser

IPC分类号： G02B6/36

CPC分类号： G02B6/4204 ,  G02B6/423 ,  G02B6/4246

摘要： The present invention relates to modular optical devices compatible with legacy form factors, for example, SFF, SFP, and XFP form factors. A housing contains optical components including a lens block, a fabricated package, at least one lens pin, and a substrate. The lens block is configured to receive one or more lens pins. The fabricated package is mechanically coupled to the lens block and includes a light source and/or a light detector and a connector for coupling the fabricated package to the substrate. The at least one lens pin is mechanically coupled to the lens block for directing optical signals between the light source and/or light detector and external components. The substrate is mechanically coupled to the fabricated package and the housing and electrically connected to the light source and/or light detector such that substrate circuitry can electrically interoperate with the light source and/or light detector.

摘要翻译： 本发明涉及与传统形式因素兼容的模块化光学装置，例如SFF，SFP和XFP形状因子。 壳体包含光学部件，其包括透镜块，制造的封装，至少一个透镜销和基板。 透镜块被配置为接收一个或多个透镜引脚。 制造的封装机械地耦合到透镜块，并且包括光源和/或光检测器和用于将制造的封装耦合到衬底的连接器。 至少一个透镜销被机械耦合到透镜块，用于在光源和/或光检测器和外部部件之间引导光信号。 衬底机械耦合到制造的封装和壳体并电连接到光源和/或光检测器，使得衬底电路可以与光源和/或光检测器电互操作。

公开(公告)号：US20050244110A1

公开(公告)日：2005-11-03

申请号：US11116693

申请日：2005-04-27

申请人： Chris Togami ,  Gary Sasser

发明人： Chris Togami ,  Gary Sasser

IPC分类号： G02B6/36 ,  G02B6/42

CPC分类号： G02B6/4292 ,  G02B6/4204 ,  G02B6/4246

摘要： Embodiments of the present invention are directed to a modular optical device for sending and/or receiving optical signals. A lens block is configured to mechanically couple to one or more lens pins and to a molded package. A molded package, including at least one of a light source and a light detector and including a connection portion manufactured for direct mechanical and electrical coupling of the molded package to a substrate, is mechanically coupled to the lens block. At least one lens pin for directing an optical signal between a light source or light detector and corresponding external components is coupled to the lens block. The modular optical device can be coupled to a substrate configured to be received within a standard slot of a host system, such as a PCI or PCMCIA slot. Thus, one or more optical connections are integrated within the host device or system.

摘要翻译： 本发明的实施例涉及用于发送和/或接收光信号的模块化光学装置。 透镜块被配置为机械地耦合到一个或多个透镜销和模制封装。 包括光源和光检测器中的至少一个并且包括制造用于将模制封装与基板直接机械和电耦合的连接部分的模制封装机械地耦合到透镜块。 用于在光源或光检测器和对应的外部部件之间引导光信号的至少一个透镜销耦合到透镜块。 模块化光学器件可以耦合到被配置为被接收在诸如PCI或PCMCIA插槽的主机系统的标准槽内的衬底。 因此，一个或多个光学连接被集成在主机设备或系统内。

公开(公告)号：US07435014B2

公开(公告)日：2008-10-14

申请号：US10924135

申请日：2004-08-23

申请人： Paul K. Rosenberg ,  Gary Sasser ,  Chris Togami ,  Donald A. Ice

发明人： Paul K. Rosenberg ,  Gary Sasser ,  Chris Togami ,  Donald A. Ice

IPC分类号： G02B6/36

CPC分类号： G02B6/4292 ,  G02B6/42 ,  G02B6/4246

摘要： Methods for assembly of optical transceivers. In one example, the method is performed in connection with an optical transceiver that includes a transmitter optical subassembly and a receiver optical subassembly, as well as structure that defines a pair of ports with which the transmitter optical subassembly and receiver optical subassembly, respectively, are to be aligned. This example of the method involves positioning the transmitter optical subassembly and the receiver optical subassembly in a desired position relative to each other. The transmitter optical subassembly and the receiver optical subassembly are then fixed in the desired position. Next, the transmitter optical subassembly is aligned with one of the ports, and the receiver optical subassembly is aligned with the other port. The alignment of both the transmitter optical subassembly and the receiver optical subassembly with their respective ports is performed in a single operation.

摘要翻译： 装配光收发器的方法。 在一个示例中，该方法与包括发射机光学子组件和接收机光学子组件的光收发器相关联地执行，以及限定一对端口的结构，发射机光学子组件和接收机光学子组件分别与哪个端口 要对齐 该方法的该示例涉及将发射器光学子组件和接收器光学子组件相对于彼此定位在期望位置。 然后将发射机光学子组件和接收器光学子组件固定在期望的位置。 接下来，发射机光学子组件与其中一个端口对准，并且接收机光学子组件与另一个端口对准。 发射器光学子组件和接收器光学子组件与它们各自的端口的对准在一个操作中执行。

公开(公告)号：US20050271391A1

公开(公告)日：2005-12-08

申请号：US11134532

申请日：2005-05-20

申请人： Chris Togami ,  Gary Sasser

发明人： Chris Togami ,  Gary Sasser

IPC分类号： G02B6/38 ,  H04B10/00 ,  H04B10/24

CPC分类号： H04B10/40 ,  G02B6/3897

摘要： Embodiments of the present invention are directed to a dual stage modular optical device for sending and/or receiving optical signals. A first fabricated package includes a light source for generating optical signals and/or a light detector for detecting received optical signals. A second fabricated package includes an opening for accepting circuitry that is to electrically interoperate with the light source and/or light detector to transfer optical signals. A lead frame mechanically connects the first fabricated package to the second fabricated package and electrically connects the light source and/or light detector to contacts exposed in the opening. The dual stage modular optical device can be coupled to a substrate configured to be received within a standard slot of a host system, such as a PCI or PCMCIA slot. Thus, one or more optical connections are integrated within the host device or system.

摘要翻译： 本发明的实施例涉及用于发送和/或接收光信号的双级模块化光学装置。 第一制造的封装包括用于产生光信号的光源和/或用于检测接收到的光信号的光检测器。 第二制造的封装包括用于接受与光源和/或光检测器电互操作以传送光信号的电路的开口。 引线框架将第一制造的封装机械地连接到第二制造的封装并将光源和/或光检测器电连接到暴露在开口中的触点。 双级模块化光学器件可以耦合到被配置为被接收在诸如PCI或PCMCIA插槽的主机系统的标准槽内的衬底。 因此，一个或多个光学连接被集成在主机设备或系统内。