Heat dissipation device
    11.
    发明授权
    Heat dissipation device 失效
    散热装置

    公开(公告)号:US07447025B2

    公开(公告)日:2008-11-04

    申请号:US11163820

    申请日:2005-11-01

    IPC分类号: H05K7/20 F28F7/00

    摘要: A heat dissipation device (1) includes a heat sink (10), a fan (20), and an air cooling member (30). Airflow produced by the fan is led to the heat sink after passing through the air cooling member. The air cooling member can lower the temperature of the airflow below an average temperature of an atmosphere surrounding the heat dissipation device.

    摘要翻译: 散热装置(1)包括散热器(10),风扇(20)和空气冷却部件(30)。 通过风扇产生的气流在通过空气冷却部件之后被引导到散热器。 空气冷却部件可以将气流的温度降低到散热装置周围的气氛的平均温度以下。

    HEAT DISSIPATION DEVICE HAVING PHASE-CHANGEABLE MEDIUM THEREIN
    12.
    发明申请
    HEAT DISSIPATION DEVICE HAVING PHASE-CHANGEABLE MEDIUM THEREIN 失效
    具有相变介质的热释放装置

    公开(公告)号:US20070159798A1

    公开(公告)日:2007-07-12

    申请号:US11306700

    申请日:2006-01-09

    IPC分类号: H05K7/20

    摘要: A heat dissipation device includes a heat dissipation body and a heat conducting body thermally combined with the heat dissipation device. The heat dissipation body includes a central portion defining a through hole therein and a plurality of fin extending from a periphery of the central portion. Each of the fins branches a plurality of portions at an end thereof. The heat conducting body includes a column thermally fitted in the through hole of the central portion of the heat dissipation body. A cavity is defined between the column and the central portion of the heat dissipation body. The cavity contains a phase-changeable medium therein, which becomes vapor once the column absorbs heat from a heat-generating electronic device.

    摘要翻译: 散热装置包括散热体和与散热装置热结合的​​导热体。 散热体包括在其中限定通孔的中心部分和从中心部分的周边延伸的多个翅片。 每个翅片在其一端分支多个部分。 导热体包括热嵌合在散热体的中心部分的通孔中的柱。 在该散热体的中心部分之间限定空腔。 空腔中含有相变介质,一旦该塔从发热电子设备中吸收热量,该腔就变成蒸汽。

    Clip for heat dissipation device
    14.
    发明授权
    Clip for heat dissipation device 失效
    夹具用于散热装置

    公开(公告)号:US07397663B2

    公开(公告)日:2008-07-08

    申请号:US11309345

    申请日:2006-07-28

    IPC分类号: H05K7/20

    摘要: A clip includes a body, an actuating member, a first hook plate and a second hook plate. The body includes a supporting portion and a pair of spaced arms extending from opposite sides of the supporting portion. The actuating member includes a cam supported on the supporting portion. The first hook plate is detachably coupled to a distal end of the arms of the body. The second hook plate extends through the supporting portion and is pivotally coupled to the cam of the actuating member. The actuating member is turnable relative to the second hook plate between a locked position and an unlocked position.

    摘要翻译: 夹具包括主体,致动构件,第一钩板和第二钩板。 主体包括支撑部分和从支撑部分的相对侧延伸的一对间隔开的臂。 致动构件包括支撑在支撑部上的凸轮。 第一钩板可拆卸地联接到主体的臂的远端。 第二钩板延伸穿过支撑部分并且枢转地联接到致动构件的凸轮。 致动构件可相对于第二钩板在锁定位置和解锁位置之间转动。

    Heat sink assembly
    15.
    发明授权
    Heat sink assembly 有权
    散热器组件

    公开(公告)号:US07342795B2

    公开(公告)日:2008-03-11

    申请号:US11244916

    申请日:2005-10-05

    IPC分类号: H05K7/20 F28F7/00

    摘要: A heat sink assembly includes a heat spreader (10), a plurality of fins (12) extending from the spreader, fasteners (20) and securement sleeves (30) fixed to the fasteners. The fastener includes a head (200) and a shaft (204) having a threaded bottom end (208). The sleeve comprises a cylindrical wall (302), an upper open end (304) and a lower open end (306). The sleeve further has an annular pedestal (308) perpendicularly connected with the wall and extending in the lower open end. The head is received in the wall and contacts the pedestal. The shaft extends through the spreader. A compressed spring (22) is providing between the head and the spreader for urging the spreader downwardly to engage with a heat generating electronic device.

    摘要翻译: 散热器组件包括散热器(10),从扩展器延伸的多个散热片(12),紧固件(20)和固定到紧固件的固定套管(30)。 紧固件包括具有螺纹底端(208)的头部(200)和轴(204)。 套筒包括圆柱形壁(302),上开口端(304)和下开口端(306)。 套筒还具有与壁垂直连接并在下开口端延伸的环形基座(308)。 头部被接收在墙壁上并接触基座。 轴延伸穿过吊具。 压头弹簧(22)在头部和吊具之间提供,用于向下推动吊具以与发热电子装置接合。

    CLIP FOR HEAT SINK
    16.
    发明申请
    CLIP FOR HEAT SINK 失效
    夹子用于散热

    公开(公告)号:US20080010788A1

    公开(公告)日:2008-01-17

    申请号:US11309220

    申请日:2006-07-13

    IPC分类号: A44B21/00 H05K7/20

    摘要: A clip includes a body having a first end and a second end. A connecting member extends through the first end of the body. A hook plate is attached to a bottom of the connecting member and an actuating member is pivotally coupled to an upper end of the connecting member. The actuating member is pivotable relative to the hook plate in a first direction so that the actuating member is turnable relative to the hook plate between a locked position and an unlocked position. Furthermore, the actuating member is turnable about an axis of the connecting member in a second direction different from the first direction.

    摘要翻译: 夹具包括具有第一端和第二端的本体。 连接构件延伸穿过主体的第一端。 钩板附接到连接构件的底部,并且致动构件枢转地联接到连接构件的上端。 致动构件可相对于钩板在第一方向上枢转,使得致动构件相对于钩板可在锁定位置和解锁位置之间转动。 此外,致动构件可在不同于第一方向的第二方向上围绕连接构件的轴线转动。

    HEAT DISSIPATION DEVICE
    17.
    发明申请
    HEAT DISSIPATION DEVICE 审中-公开
    散热装置

    公开(公告)号:US20070217162A1

    公开(公告)日:2007-09-20

    申请号:US11309758

    申请日:2006-09-22

    IPC分类号: H05K7/20

    摘要: A heat dissipation device includes a heat sink and a back plate assembly thermally independent from the sink. The back plate assembly includes a body facing a bottom surface of the heat sink and a heat-dissipating member thermal connecting to the body. The heat sink is used for absorbing heat generated by a heat-generating electronic component from a top side thereof. The back plate assembly is used for absorbing the heat generated by the heat-generating electronic component from a bottom side thereof. The heat sink and the back plate assembly are connected together by fixing members extending from the heat sink through a printed circuit board on which the electronic component is mounted to threadedly engage with the back plate assembly.

    摘要翻译: 散热装置包括散热器和与散热器热独立的背板组件。 背板组件包括面向散热器的底表面的主体和连接到主体的散热构件。 散热器用于从其顶侧吸收由发热电子部件产生的热量。 背板组件用于从其底侧吸收由发热电子部件产生的热量。 散热器和背板组件通过从散热器延伸的固定部件通过印刷电路板连接在一起,电路板安装在印刷电路板上,以与背板组件螺纹接合。

    HEAT DISSIPATION DEVICE
    18.
    发明申请
    HEAT DISSIPATION DEVICE 有权
    散热装置

    公开(公告)号:US20070145572A1

    公开(公告)日:2007-06-28

    申请号:US11306412

    申请日:2005-12-27

    IPC分类号: H01L23/34

    摘要: A heat dissipation device (1) includes a heat sink (10), a fan (20), and a cooling member (30). The heat sink includes a base, a plurality of fins extending from the base and at least one heat pipe thermally connecting the base and the fins. The cooling member is provided with a fin assembly thereon and includes a cold surface attached to one side of the fins and a condensing portion of the at least one heat pipe to make the one side of the fins and the condensing portion have a lower temperature.

    摘要翻译: 散热装置(1)包括散热器(10),风扇(20)和冷却构件(30)。 散热器包括基座,从基座延伸的多个翅片和至少一个热连接底座和翅片的热管。 冷却件在其上设置有翅片组件,并且包括附接到翅片的一侧的冷表面和至少一个热管的冷凝部分,以使翅片的一侧和冷凝部分具有较低的温度。

    Heat sink
    19.
    发明申请
    Heat sink 审中-公开
    散热器

    公开(公告)号:US20050286232A1

    公开(公告)日:2005-12-29

    申请号:US11135164

    申请日:2005-05-23

    摘要: A heat sink includes a base and a plurality of spaced parallel fins arranged on the base. Adjacent fins define a plurality of passages there between. Each passage includes an inlet and at least one outlet. The base and the fins made separately, and the fins is thin, such that amount of the fins arranged on the base increases. And the fins are disposed on the base alternately or/and staggered such that the inlet and the outlet are wider than a middle part of the passage to lower airflow resistance thereat. Thus, the heat sink has large heat dissipating area and low airflow resistance synchronously.

    摘要翻译: 散热器包括基部和布置在基部上的多个间隔开的平行翅片。 相邻的翅片在其间限定多个通道。 每个通道包括入口和至少一个出口。 底座和翅片单独制造,并且翅片较薄,使得布置在基座上的翅片的数量增加。 并且翅片交替地或/并交错设置在基座上,使得入口和出口比通道的中间部分宽,以降低通风阻力。 因此,散热器同时具有大的散热面积和低气流阻力。

    Heat dissipation device with heat pipes
    20.
    发明授权
    Heat dissipation device with heat pipes 失效
    带热管的散热装置

    公开(公告)号:US07610950B2

    公开(公告)日:2009-11-03

    申请号:US11557917

    申请日:2006-11-08

    IPC分类号: H01L23/427 F28D15/02

    摘要: A heat dissipation device includes a first base plate (10), a fin group (30) arranged on the first base plate, a first heat pipe (50) attached on the first base plate and the fin group and a second heat pipe (60) attached on the first base plate and extending across the fin group. Each of the first and second heat pipes includes an absorbing section and a dissipating section. The absorbing sections of the first and second heat pipes are L-shaped and oriented in opposite directions and dissipating sections of the first and second heat pipes are oriented perpendicular to each other, whereby heat from the first base plate attached with an electronic component can take more different dissipating-paths from the first base plate to the fin group.

    摘要翻译: 一种散热装置,包括第一基板(10),布置在第一基板上的翅片组(30),安装在第一基板和翅片组上的第一热管(50)和第二热管 )连接在第一基板上并延伸穿过翅片组。 第一和第二热管中的每一个包括吸收部分和消散部分。 第一和第二热管的吸收部分为L形并且在相反方向上定向,并且第一和第二热管的散热部分彼此垂直取向,由此附接有电子部件的第一基板的热量可以 从第一基板到散热片组的更多不同的散热路径。