-
公开(公告)号：US20220246514A1
公开(公告)日：2022-08-04
申请号：US17245259
申请日：2021-04-30
Inventor： Craig MCADAM , Jonathan TAYLOR , Douglas MACFARLANE , John KERR , James MUNGER , John PAVELKA , Steven A. ATHERTON
IPC: H01L23/498 , H01L23/00
Abstract: The present disclosure relates to a chip scale package (CSP) comprising: a first set of CSP contact balls or bumps; a second set of CSP contact balls or bumps; and a channel routing region, the channel routing region being devoid of any CSP contact balls or bumps.
Search Results
11
records
(took 0.013 seconds)
筛选
AND
AND
过滤
NOT
NOT
Scan to Join
