公开(公告)号：US20230344351A1

公开(公告)日：2023-10-26

申请号：US18299969

申请日：2023-04-13

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Alastair M. BOOMER ,  John B. BOWLERWELL ,  James MUNGER ,  Andrew J. HOWLETT

IPC: H02M3/158 ,  H02M1/00

CPC classification number: H02M3/1582 ,  H02M1/0009 ,  H02M1/0019

Abstract: The present disclosure relates to power converter circuitry, and in particular to power converter circuitry for providing a supply voltage to a load such as amplifier circuitry. In one aspect the invention provides a system comprising: amplifier circuitry; and power converter circuitry for receiving a supply voltage and providing an output voltage to the amplifier circuitry, the power converter circuitry comprising: a control loop for regulating an output voltage of the power converter circuitry in accordance with a target output voltage value; and controller circuitry configured to adjust the target output voltage value if the supply voltage to the power converter circuitry is within a first predefined threshold of a requested output voltage of the power converter circuitry.

公开(公告)号：US20230088252A1

公开(公告)日：2023-03-23

申请号：US17993638

申请日：2022-11-23

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Craig MCADAM ,  Jonathan TAYLOR ,  Douglas MACFARLANE ,  John KERR ,  James MUNGER ,  John PAVELKA ,  Steven A. ATHERTON

IPC: H01L23/498 ,  H01L23/00

Abstract: The present disclosure relates to a chip scale package (CSP) comprising: a first set of CSP contact balls or bumps; a second set of CSP contact balls or bumps; and a channel routing region, the channel routing region being devoid of any CSP contact balls or bumps.

公开(公告)号：US20220246514A1

公开(公告)日：2022-08-04

申请号：US17245259

申请日：2021-04-30

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Craig MCADAM ,  Jonathan TAYLOR ,  Douglas MACFARLANE ,  John KERR ,  James MUNGER ,  John PAVELKA ,  Steven A. ATHERTON

IPC: H01L23/498 ,  H01L23/00

Abstract: The present disclosure relates to a chip scale package (CSP) comprising: a first set of CSP contact balls or bumps; a second set of CSP contact balls or bumps; and a channel routing region, the channel routing region being devoid of any CSP contact balls or bumps.