公开(公告)号：US20160037692A1

公开(公告)日：2016-02-04

申请号：US14451360

申请日：2014-08-04

Applicant: Cisco Technology, Inc.

Inventor： Hailong Zhang ,  Xiaoxia Zhou ,  Jinghan Yu ,  Philippe Sochoux ,  Xiao Li ,  Alpesh Bhobe

IPC: H05K9/00 ,  H05K1/02

CPC classification number: H05K1/0203 ,  H05K1/0215 ,  H05K1/023 ,  H05K9/0024 ,  H05K2201/066 ,  H05K2201/083 ,  H05K2201/10409

Abstract: An apparatus is described for suppressing EMI emissions in an electrical device. In one example, the apparatus includes absorbing material surrounding at least a portion of an electrical component and electrically conductive material configured to contact at least one side of the absorbing material.

Abstract translation: 描述了一种用于抑制电气设备中的EMI排放的装置。 在一个示例中，该设备包括围绕电气部件的至少一部分的吸收材料和被配置为接触吸收材料的至少一侧的导电材料。

公开(公告)号：US20210193377A1

公开(公告)日：2021-06-24

申请号：US17192523

申请日：2021-03-04

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Jianquan Lou ,  Xiaoxia Zhou ,  Hailong Zhang ,  Yingchun Shu ,  Alpesh U. Bhobe

IPC: H01F27/34 ,  H01F27/28 ,  H01F27/24 ,  H01R24/64 ,  H01F27/29 ,  H01R13/719 ,  H01F27/02

Abstract: In one embodiment, an apparatus includes an array of transformers and common mode chokes each comprising a magnetic core and windings wound around the magnetic core at opposing locations on the magnetic core, and a retaining groove on each of the magnetic cores to maintain the windings in their opposing locations on the magnetic core. The transformers and common mode chokes are positioned in the array with the windings on each of the magnetic cores located offset to the windings of adjacent magnetic cores in the array to reduce crosstalk and improve common mode noise rejection.

公开(公告)号：US20190387650A1

公开(公告)日：2019-12-19

申请号：US16008203

申请日：2018-06-14

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Xiaoxia Zhou ,  Hailong Zhang ,  Jianquan Lou ,  Huasheng Zhao ,  Luli Gong ,  Yonghong Luo

IPC: H05K9/00 ,  G02B6/42 ,  H05K7/20

Abstract: In one embodiment, an apparatus includes a housing for receiving pluggable modules, the housing comprising at least one lower opening and at least one upper opening, each of the openings configured to receive one of the pluggable modules, and a heat sink interposed between the lower and upper openings. The heat sink comprises a cross-sectional honeycomb structure defining cooling tubes extending longitudinally between parallel surfaces of the heat sink for dissipating heat from the pluggable modules inserted into the lower and upper openings.

公开(公告)号：US10321553B2

公开(公告)日：2019-06-11

申请号：US14451360

申请日：2014-08-04

Applicant: Cisco Technology, Inc.

Inventor： Hailong Zhang ,  Xiaoxia Zhou ,  Jinghan Yu ,  Philippe Sochoux ,  Xiao Li ,  Alpesh Bhobe

IPC: H05K1/02 ,  H05K9/00 ,  H01R43/00

Abstract: An apparatus is described for suppressing EMI emissions in an electrical device. In one example, the apparatus includes absorbing material surrounding at least a portion of an electrical component and electrically conductive material configured to contact at least one side of the absorbing material.

公开(公告)号：US20150124425A1

公开(公告)日：2015-05-07

申请号：US14072888

申请日：2013-11-06

Applicant: Cisco Technology, Inc.

Inventor： Jing An ,  Luli Gong ,  Hua Yang ,  Hailong Zhang ,  Dewen Xu ,  Susan Huang ,  Mandy Hin Lam

IPC: H05K9/00

CPC classification number: H05K9/0015

Abstract: An apparatus may be provided. The apparatus may comprise a core and a covering material disposed on a portion of the core. At least one opening may be disposed in the core. The at least one opening may expose at least one interior surface on the core. The at least one interior surface may be devoid of the covering material.

Abstract translation: 可以提供一种装置。 该装置可以包括设置在芯的一部分上的芯和覆盖材料。 至少一个开口可以设置在芯中。 至少一个开口可以暴露在芯上的至少一个内表面。 至少一个内表面可以没有覆盖材料。