公开(公告)号：US20240224413A1

公开(公告)日：2024-07-04

申请号：US18555866

申请日：2021-11-16

申请人： Resonac Corporation

发明人： Kosuke URASHIMA ,  Motoki YONEKURA ,  Motohiro ARIFUKU ,  Tomohiko KOTAKE ,  Etsuo MIZUSHIMA

IPC分类号： H05K1/02 ,  H05K3/06 ,  H05K3/28

CPC分类号： H05K1/0237 ,  H05K3/06 ,  H05K3/28 ,  H05K2201/0753 ,  H05K2201/083 ,  H05K2201/10287 ,  H05K2203/063

摘要： A wiring substrate includes a substrate, conductor wiring provided on the substrate, and an insulator positioned on at least a part of the periphery of the conductor wiring, in which the insulator contains a magnetic material. The wiring substrate ensures little loss in transmission even in high-frequency band.

公开(公告)号：US11770903B2

公开(公告)日：2023-09-26

申请号：US17511572

申请日：2021-10-27

申请人： KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

发明人： Ji Young Byun ,  Kwang-Deok Choi ,  Honguk Cheon

IPC分类号： H05K3/38 ,  C23C18/18 ,  C23C18/31 ,  C23C28/02 ,  C23F1/02 ,  C23F17/00 ,  C25D5/34 ,  C25D5/48 ,  H05K3/06 ,  H05K3/10 ,  H05K1/03 ,  H05K1/09

CPC分类号： H05K3/388 ,  C23C18/1817 ,  C23C18/31 ,  C23C28/023 ,  C23F1/02 ,  C23F17/00 ,  C25D5/34 ,  C25D5/48 ,  H05K3/06 ,  H05K3/108 ,  H05K3/382 ,  H05K1/0306 ,  H05K1/09 ,  H05K2201/083 ,  H05K2203/072 ,  H05K2203/0723

摘要： Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c).

公开(公告)号：US20190254176A1

公开(公告)日：2019-08-15

申请号：US16391509

申请日：2019-04-23

申请人： International Business Machines Corporation

发明人： Gerald K. Bartley ,  Darryl J. Becker ,  Matthew S. Doyle ,  Mark J. Jeanson

IPC分类号： H05K3/40 ,  H05K3/32 ,  H05K3/12 ,  H05K3/42 ,  H05K1/11

CPC分类号： H05K3/4046 ,  H05K1/113 ,  H05K3/1266 ,  H05K3/323 ,  H05K3/425 ,  H05K3/429 ,  H05K2201/083 ,  H05K2203/0713 ,  H05K2203/104

摘要： A method and apparatus for implementing customized printed circuit board (PCB) via creation through use of magnetic capture pads. At least one magnetic capture pad is rendered before aqueous seed and plate processing in the PCB manufacture. The magnetic capture pad selectively provides seed material rendering copper in at least one selected region of the via.

公开(公告)号：US20180358742A1

公开(公告)日：2018-12-13

申请号：US15779635

申请日：2016-11-21

申请人： Nokia Technologies Oy

发明人： Piers ANDREW

IPC分类号： H01R13/62 ,  H05K3/36 ,  H05K3/32

CPC分类号： H01R13/6205 ,  H01R13/2414 ,  H05K3/323 ,  H05K3/36 ,  H05K3/361 ,  H05K3/365 ,  H05K2201/0314 ,  H05K2201/083

摘要： An apparatus and method, the apparatus comprising: a layer of quantum tunnelling composite configured such that in a non-compressed state the quantum tunnelling composite is an electrical insulator and in a compressed state the layer of quantum tunnelling composite is an electrical conductor; a magnetic portion configured to cause compression of the quantum tunnelling composite; and wherein the apparatus is configured to be coupled to a reciprocal apparatus where the reciprocal apparatus comprises a reciprocal magnetic portion such that when the apparatus is coupled to the reciprocal apparatus the magnetic portion causes compression of the quantum tunnelling composite to provide a direct current path through the quantum tunnelling composite to the reciprocal apparatus.

公开(公告)号：US09992869B2

公开(公告)日：2018-06-05

申请号：US15090285

申请日：2016-04-04

申请人： Magnetic Innovations LLC

发明人： Ricky David Schultz

IPC分类号： H05K7/00 ,  H05K1/09 ,  H01R13/719 ,  H01R43/20 ,  H04R3/04 ,  H05K1/02 ,  H05K1/16 ,  H05K3/30 ,  H01B7/30 ,  H01F7/02 ,  H05K9/00 ,  H04R5/04

CPC分类号： H05K1/092 ,  H01B7/30 ,  H01F7/02 ,  H01R13/719 ,  H01R43/20 ,  H04R3/04 ,  H04R5/04 ,  H05K1/0233 ,  H05K1/16 ,  H05K3/303 ,  H05K9/0007 ,  H05K2201/083 ,  H05K2201/086 ,  Y10T29/4913 ,  Y10T29/49208

摘要： Apparatus and methods for magnetically enhanced electrical signal conduction are disclosed. An embodiment electrical connector comprises a connector body, a first active signal contact mechanically attached to and at least partially disposed within the connector body, a ground contact mechanically attached to the connector body, an insulator mechanically separating and electrically isolating the first active signal contact and the ground contact, and a first permanent magnet electrically connected to the first active signal contact. An embodiment electrical cable comprises an elongated insulating sheath, a first active signal electrical conductor disposed within the sheath, a first connector body mechanically attached to a first end of the sheath, a first active signal contact mechanically attached to the first connector body, and electrically connected to the first active signal electrical conductor, and a first permanent magnet electrically connected to the first active signal electrical conductor.

公开(公告)号：US20180132390A1

公开(公告)日：2018-05-10

申请号：US15362872

申请日：2016-11-29

申请人： Ntrium Inc.

发明人： Se Young Jeong ,  Ki Su Joo ,  Ju Young Lee ,  Jeong Woo Hwang ,  Jin Ho Yoon

IPC分类号： H05K9/00 ,  H05K1/09 ,  H05K1/18 ,  H05K3/46

CPC分类号： H05K9/0088 ,  H01L23/3135 ,  H01L23/552 ,  H01L2924/1203 ,  H01L2924/1304 ,  H01L2924/1438 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/095 ,  H05K1/186 ,  H05K3/4644 ,  H05K3/4664 ,  H05K3/467 ,  H05K9/0024 ,  H05K2201/0715 ,  H05K2201/083

摘要： Provided is an electronic component package for electromagnetic interference shielding. The electronic component package for electromagnetic interference shielding according to an embodiment of the present invention comprises a substrate where electronic components are mounted, a molding member formed on the substrate and the electronic components, a magnetic layer formed on the molding member, and a conductive layer formed on the magnetic layer. Electromagnetic waves generated from the electronic components embeded in the molding member are absorbed in the magnetic layer to thus prevent or reduce harmful influence on other electronic components mounted in adjacent places. In addition, harmful electromagnetic waves generated from the outside may be shielded due to the conductive layer formed on the magnetic layer, thereby protecting electronic components embeded in the molding member from being influenced by the electromagnetic waves.

公开(公告)号：US09903754B2

公开(公告)日：2018-02-27

申请号：US15240277

申请日：2016-08-18

申请人： NANNING FUGUI PRECISION INDUSTRIAL CO., LTD. ,  HON HAI PRECISION INDUSTRY CO., LTD.

发明人： Xiao-Hu Tang ,  Pei Liu

IPC分类号： G01J1/18 ,  H05K1/02 ,  H05K1/18 ,  H05K1/14

CPC分类号： G01J1/18 ,  G01V8/20 ,  H05K1/0274 ,  H05K1/0275 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/08 ,  H05K2201/083 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10234

摘要： A security device in an electronic device which protects against unauthorized disassembly includes light sources, a plurality of photosensitive elements, a detection unit, a storage unit, a processor, and light guiding devices. Light conducting channels are provided between the light sources and the induction elements. Barrier objects that block light are installed at certain first light guiding channels of the light guiding channels, and are removed from the first light conducting channels when the electronic device is disassembled, so that induction signals output by the photosensitive elements are changed from the model or original digitally-recorded signals.

公开(公告)号：US20170299661A1

公开(公告)日：2017-10-19

申请号：US15099561

申请日：2016-04-14

申请人： Texas Instruments Incorporated

发明人： Iouri N. Mirgorodski ,  Roozbeh Parsa ,  William French ,  Dok Won Lee ,  Ann Gabrys

IPC分类号： G01R33/00 ,  H05K1/02 ,  H05K3/06

CPC分类号： G01R33/0005 ,  G01R33/0052 ,  H05K1/0296 ,  H05K1/0306 ,  H05K3/064 ,  H05K2201/083

摘要： A magnetic sensor has a circuit segment with a quadrupole region. The quadrupole region includes a supply line, a first return line and a second return line, all in a conductor layer. The first supply line is laterally adjacent to the supply line on a first side, and the second return line is laterally adjacent to the supply line on a second, opposite side. A space between the supply line and the first return line is free of the conductor layer; similarly, a space between the supply line and the second return line is free of the conductor layer. The first return line and the second return line are electrically coupled to the supply line at a terminus of the circuit segment.

公开(公告)号：US09635752B2

公开(公告)日：2017-04-25

申请号：US14653723

申请日：2014-10-24

申请人： BOE TECHNOLOGY GROUP CO., LTD.

发明人： Yue Wu ,  Yan Ren ,  Zifeng Wang

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K1/16

CPC分类号： H05K1/0233 ,  H05K1/0225 ,  H05K1/0228 ,  H05K1/0231 ,  H05K1/115 ,  H05K1/162 ,  H05K2201/083 ,  H05K2201/093

摘要： The present disclosure relates to the field of circuits, and provides a printed circuit board (PCB) and an electronic device. The PCB includes a substrate and a wiring layer arranged at the substrate. The wiring layer includes a digital region and an analog region, and a gap region is defined between the digital region and the analog region. The substrate is provided with a hole in the gap region, and the digital region and the analog region of the wiring layer are connected through a magnetic bead.

公开(公告)号：US20160329658A1

公开(公告)日：2016-11-10

申请号：US15146652

申请日：2016-05-04

申请人： JoyLabz LLC

发明人： Bryan Randall Wilcox ,  Todd Eddie ,  Jay Saul Silver

IPC分类号： H01R13/62 ,  H01R12/75 ,  G06F1/16

CPC分类号： H01R13/6205 ,  G06F1/16 ,  H01R11/24 ,  H01R13/6658 ,  H01R2201/06 ,  H05K1/11 ,  H05K1/111 ,  H05K1/113 ,  H05K1/117 ,  H05K5/0278 ,  H05K2201/083 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/094 ,  H05K2201/09427 ,  H05K2201/09481 ,  H05K2201/10386

摘要： Systems and methods for magnetic coupling. One system includes an external computing device and a connector having a conductive end. The system also includes a printed circuit board. The printed circuit board includes a connector side opposite a back side. The connector side has a contact pad with an aperture. The printed circuit board also includes a magnet positioned on the back side of the printed circuit board. The magnet provides a magnetic field configured to provide magnetic attraction forces to a connector contacting the contact pad. The printed circuit board also includes a communication terminal. The system also includes a circuit in communication with the printed circuit board through the connector and contact pad.

摘要翻译： 用于磁耦合的系统和方法。 一个系统包括外部计算设备和具有导电端的连接器。 该系统还包括印刷电路板。 印刷电路板包括与背面相对的连接器侧。 连接器侧具有带孔的接触垫。 印刷电路板还包括位于印刷电路板背侧的磁体。 磁体提供磁场，其被配置为向接触接触垫的连接器提供磁力吸引力。 印刷电路板还包括通信终端。 该系统还包括通过连接器和接触垫与印刷电路板通信的电路。