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公开(公告)号：US20220397727A1
公开(公告)日：2022-12-15
申请号：US17303853
申请日：2021-06-09
Applicant: Cisco Technology, Inc.
Inventor： Norbert SCHLEPPLE , Vipulkumar K. PATEL , Anthony D. KOPINETZ
IPC: G02B6/42
Abstract: Aspects described herein include an apparatus supporting optical alignment with one or more optical waveguides optically exposed along an edge of a photonic integrated circuit (IC). The apparatus comprises a frame body comprising an upper portion defining a reference surface, and a lateral portion defining an interface for an optical connector connected with one or more optical fibers. The lateral portion comprises one or more optical components defining an optical path through the lateral portion. The one or more optical components are arranged relative to the reference surface such that the one or more optical components align with (i) the one or more optical waveguides along at least one dimension when the reference surface contacts a top surface of an anchor IC, and with (ii) the one or more optical fibers when the optical connector is connected at the interface.
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公开(公告)号：US20220368102A1
公开(公告)日：2022-11-17
申请号：US17302964
申请日：2021-05-17
Applicant: Cisco Technology, Inc.
Inventor： Norbert SCHLEPPLE , Jock T. BOVINGTON , Mary NADEAU , Mittu PANNALA , Jarrett S. NEIMAN
IPC: H01S5/024 , H01S5/02 , H01S5/02326
Abstract: Heatsinking in laser devices may be improved via a device, including: a header disk having a first face with a circumference; a header post that is thermally conductive, and having: a second face connected to the first face coterminously with the circumference; a third face opposite to the second face; and a fourth face perpendicular to the second face and the third face; a lens holder, having a fifth face connected to the third face; and an optical subassembly connected to the fourth face and optically aligned with the lens holder. The device may also be understood to comprise: a header disk having a circumference; a header post that is thermally conductive, the header post having: an arc coterminous to a portion of the circumference; a mounting face, perpendicular to a plane in which the arc and the circumference are defined; and a bonding face perpendicular to the mounting face.
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公开(公告)号：US20220196933A1
公开(公告)日：2022-06-23
申请号：US17133407
申请日：2020-12-23
Applicant: Cisco Technology, Inc.
Inventor： Vipulkumar K. PATEL , Paul TON , Aparna R. PRASAD , Norbert SCHLEPPLE
IPC: G02B6/42
Abstract: Aspects described herein include an apparatus comprising a substrate, an electronic integrated circuit (IC) disposed on the substrate, one or more optical ICs disposed on the substrate and communicatively coupled with the electronic IC, and a stiffener device attached to the substrate. The stiffener device comprises a stiffener ring that substantially circumscribes the one or more optical ICs. The stiffener device defines one or more features configured to receive a plurality of light-carrying media that optically couple with the one or more optical ICs and that extend to one or more lateral edges of the stiffener device.
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公开(公告)号：US20250035858A1
公开(公告)日：2025-01-30
申请号：US18359498
申请日：2023-07-26
Applicant: Cisco Technology, Inc.
Inventor： Norbert SCHLEPPLE , Joyce J. M. PETERNEL , Bing SHAO
Abstract: An optical system is provided. The optical system includes an optical engine having a photonic integrated circuit (PIC) and an optical lens array, the optical lens array has a lens that is optically aligned with a waveguide in the PIC. The optical system also includes an optical connector optically aligned with the optical lens array to transfer optical signals between the optical connector and the waveguide in the PIC. The optical connector includes a ferrule and an optical fiber mated with the ferrule. The ferrule has a lens aligned with the lens of the optical lens array.
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Patent Agency Ranking
公开(公告)号：US20240272370A1
公开(公告)日：2024-08-15
申请号：US18168230
申请日：2023-02-13
Applicant: Cisco Technology, Inc.
Inventor： Norbert SCHLEPPLE , Neda NOBLE
IPC: G02B6/36
CPC classification number: G02B6/3636 , G02B6/3652
Abstract: The fiber array units (FAUs) described herein include an FAU substrate with a coupling surface, an array of V-grooves formed in a FAU substrate, and a plurality of optical channels individually disposed in a respective V-groove of the array of V-grooves. The array of V-grooves and the optical channels are configured to position the optical channels along a curve defined in the coupling surface such that the optical channels are aligned with waveguides in a warped photonic device.
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公开(公告)号：US20240264370A1
公开(公告)日：2024-08-08
申请号：US18165844
申请日：2023-02-07
Applicant: Cisco Technology, Inc.
Inventor： Aparna R. PRASAD , Norbert SCHLEPPLE , Vipulkumar K. PATEL , Arturo PACHON MUNOZ
CPC classification number: G02B6/12004 , G02B6/13 , G02B2006/12061
Abstract: An optical package with increased mechanical stability of co-packaged optic components is described. The optical package includes an electronic mold compound (EMC) layer with copper pillars formed through the EMC layer. The optical package also includes a silicon interposer layer with through silicon vias (TSVs) and positioned on the EMC layer. A combined thickness of the EMC layer and the silicon interposer layer provide a combined mechanical coupling thickness for a connection component on a smooth diced edge side of the EMC layer and the silicon interposer layer. The optical package also includes devices attached to the silicon interposer layer.
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公开(公告)号：US20230296840A1
公开(公告)日：2023-09-21
申请号：US18324630
申请日：2023-05-26
Applicant: Cisco Technology, Inc.
Inventor： Norbert SCHLEPPLE , Vipulkumar K. PATEL
CPC classification number: G02B6/2555 , G02B6/12 , G02B6/2551 , G02B6/2553 , G02B2006/12138 , G02B2006/12192
Abstract: Techniques for aligning each of a plurality of optical fibers for coupling to a photonic integrated circuit (PIC). Transmission is detected from each respective optical fiber to the PIC using a probe, and the respective optical fiber is aligned based on the detected transmission. Each of the plurality of optical fibers is coupled to the PIC using at least one of: (i) laser splicing, (ii) laser spot welding, or (iii) arc welding.
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公开(公告)号：US20230163561A1
公开(公告)日：2023-05-25
申请号：US18158879
申请日：2023-01-24
Applicant: Cisco Technology, Inc.
Inventor： Jock T. BOVINGTON , Norbert SCHLEPPLE
CPC classification number: H01S5/02453 , H01S3/06704 , H01S5/02469 , B23K2101/14
Abstract: Aspects described herein include a method of fabricating an optical component, the optical component, and a method of operating the optical component. A method includes electrically coupling a first laser channel and a second laser channel of a laser die to different electrical leads and testing (i) a first optical coupling of the first laser channel and a second optical coupling of the second laser channel or (ii) a first spectral performance of the first laser channel and a second spectral performance of the second laser channel. The method also includes optically aligning an optical fiber with the first laser channel and designating the second laser channel as a heater element for the first laser channel based at least in part on (i) the first optical coupling being greater than the second optical coupling or (ii) the first spectral performance relative to the second spectral performance
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公开(公告)号：US20220252789A1
公开(公告)日：2022-08-11
申请号：US17660993
申请日：2022-04-27
Applicant: Cisco Technology, Inc.
Inventor： Norbert SCHLEPPLE , Jock T. BOVINGTON
Abstract: Aspects described herein include an optical apparatus comprising a plurality of light-carrying media, a wavelength division multiplexing (WDM) device optically coupled with the plurality of light-carrying media, and a lens arranged between the WDM device and a multicore optical fiber. An arrangement of the plurality of light carrying media and the WDM device are selected to align each of the plurality of light-carrying media with a respective optical core of the multicore optical fiber.
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