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公开(公告)号:US20220320765A1
公开(公告)日:2022-10-06
申请号:US17645195
申请日:2021-12-20
Applicant: Cisco Technology, Inc.
Inventor: Matthew J. TRAVERSO , Sandeep RAZDAN , Joyce J. M. PETERNEL
Abstract: An apparatus includes a substrate, a frame, and a socket. The frame defines a slot. The frame is coupled to the substrate such that the slot is aligned with an attachment location on the substrate. The socket receives a first device. The socket aligns with the attachment location on the substrate when the socket is inserted in the slot.
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公开(公告)号:US20220278022A1
公开(公告)日:2022-09-01
申请号:US17663072
申请日:2022-05-12
Applicant: Cisco Technology, Inc.
Inventor: Ashley J.M. ERICKSON , Matthew J. TRAVERSO , Sandeep RAZDAN , Joyce J. M. PETERNEL , Aparna R. PRASAD
IPC: H01L23/473 , H01L21/48 , H01L21/683 , H01L23/00 , H01L21/78 , H01L23/544
Abstract: An opto-electronic package is described. The opto-electronic package is manufactured using a fan out wafer level packaging to produce dies/frames which include connection features. Additional structures such as heat exchanged structures are joined to a connection component and affixed to packages, using the connection features, to provide structural support and heat exchange to heat generating components in the package, among other functions.
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公开(公告)号:US20250035858A1
公开(公告)日:2025-01-30
申请号:US18359498
申请日:2023-07-26
Applicant: Cisco Technology, Inc.
Inventor: Norbert SCHLEPPLE , Joyce J. M. PETERNEL , Bing SHAO
Abstract: An optical system is provided. The optical system includes an optical engine having a photonic integrated circuit (PIC) and an optical lens array, the optical lens array has a lens that is optically aligned with a waveguide in the PIC. The optical system also includes an optical connector optically aligned with the optical lens array to transfer optical signals between the optical connector and the waveguide in the PIC. The optical connector includes a ferrule and an optical fiber mated with the ferrule. The ferrule has a lens aligned with the lens of the optical lens array.
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公开(公告)号:US20210055489A1
公开(公告)日:2021-02-25
申请号:US16544699
申请日:2019-08-19
Applicant: Cisco Technology, Inc.
Inventor: Ashley J. MAKER , Joyce J. M. PETERNEL , Sandeep RAZDAN , Matthew J. TRAVERSO , Aparna R. PRASAD
IPC: G02B6/42
Abstract: An optical connection assembly joining optical components is described. The optical connection assembly is manufactured using a fan out wafer level packaging to produce dies/frames which include mechanical connection features. A fastener is joined to a connection component and affixed to the mechanical connection features, to provide structural support to the connection between the connected component and the die/frame structure.
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