Apparatus for cooling electronic circuitry

    公开(公告)号:US11711904B2

    公开(公告)日:2023-07-25

    申请号:US17497042

    申请日:2021-10-08

    CPC classification number: H05K7/20154 H05K7/20145 H05K7/20445

    Abstract: Apparatus cools electronic circuitry. An enclosure surrounds the circuitry. Air intake holes are only in a portion of a first panel that faces a first direction. Air exhaust holes are only in a portion of a second panel that faces a second direction opposite the first. Air plenum piece is disposed within the enclosure, and a substantially planar portion extends from a first panel inner wall and ends a distance from a second panel inner wall. At least one tab extends from the substantially planar portion to an upper panel inner wall. The air plenum piece divides an enclosure interior into a first volume, enclosed by the first panel inner wall, substantially planar portion, at least one tab, and upper panel inner wall, into which the air intake holes open and a second volume into which the air exhaust holes open. The second volume is a remaining interior volume.

    Fliptop integrated latch
    12.
    发明授权

    公开(公告)号:US11616352B2

    公开(公告)日:2023-03-28

    申请号:US17829500

    申请日:2022-06-01

    Abstract: An integrated latching mechanism includes a slider button. At least one curved elastic arm extends from the slider button and is configured such that in response to an external force urging the slider button in a first direction, the curved elastic arm is distorted such that upon removal of the external force, the curved elastic arm moves the slider button in a direction opposite to the first direction. A locking part is contiguous with the slider button and extends away from the slider button. In response to the external force urging the slider button in the first direction, the locking part moves in the first direction, and upon removal of the external force, the curved elastic arm moves the locking part in the direction opposite to the first direction. The at least one curved elastic arm, the slider button, and the locking part form a single piece of elastic material.

    APPARATUS FOR COOLING ELECTRONIC CIRCUITRY

    公开(公告)号:US20210282295A1

    公开(公告)日:2021-09-09

    申请号:US16891130

    申请日:2020-06-03

    Abstract: Described herein are systems, modes, and methods for an electronics enclosure cooling apparatus comprising a plurality of air intake holes located on at least one surface of the enclosure, a plurality of air exhaust holes located on at least one surface of the enclosure different from that of the surface wherein the air intake holes are located, an air plenum piece that comprises a substantially planar portion and a hole located on the substantially planar portion, the air plenum piece of such dimension and placement within the enclosure such that a first volume of the interior is created and a second volume of the interior is created, and wherein the air plenum piece is further adapted to create an air channel that substantially separates the first volume of the interior of the enclosure from the second volume of the interior, and wherein the first volume is in fluid engagement with the plurality of air intake holes, and further wherein the second volume is in fluid engagement with the plurality of air exhaust holes; and a fan located in coaxial alignment with the hole of the air plenum piece such that the fan is adapted to draw air from an exterior of the enclosure through the plurality of air intake holes, into the first volume, out through the second volume, and out through the plurality of air exhaust holes.

    Apparatus for cooling electronic circuitry

    公开(公告)号:US11076501B2

    公开(公告)日:2021-07-27

    申请号:US16534398

    申请日:2019-08-07

    Abstract: An apparatus cools electronic circuitry. An enclosure surrounds the electronic circuitry and has plural surfaces. Air intake holes are disposed in at least one surface and face at least one first direction. Air exhaust holes are disposed in at least another surface and face at least one second direction different than the first direction. A heat sink is in thermal contact with the circuitry and conducts heat generated by the circuitry. When a fan operates, air is drawn from an exterior of the enclosure through the air intake holes, absorbs heat from the heat sink, and then is directed through the air exhaust holes into the exterior of the enclosure. The heat sink is further in thermal contact with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated from the exterior.

    Cable retractor
    16.
    发明授权

    公开(公告)号:US10549946B2

    公开(公告)日:2020-02-04

    申请号:US15857418

    申请日:2017-12-28

    Abstract: A cable retractor is disclosed and includes a housing. A spool is disposed within the housing and is mechanically coupled to the housing and rotatable about an axis. A spring mechanism is operatively attached to the spool and is configured to urge the spool to rotate in a first rotational direction about the axis. An electrically operated rotation regulator is operatively attached to the spool and is configured to, when activated, prevent the spool from rotating in the first rotational direction.

    Enhanced thermal management in electrical boxes

    公开(公告)号:US12178004B2

    公开(公告)日:2024-12-24

    申请号:US18638846

    申请日:2024-04-18

    Abstract: An apparatus cools electronic circuitry. A housing has surfaces configured to enclose the electronic circuitry and are mountable inside a cavity in a back box. At least one of the surfaces has a vent holes therein facing an exhaust opening in the back box when the housing is mounted inside the cavity. Another surface has a fan hole that faces an intake opening in the back box when the housing is mounted inside the cavity. A cooling fan is mounted onto the another surface and disposed over the fan hole. The cooling fan is configured to draw cooling air through the intake opening in the back box and the fan hole into the housing and over the electronic circuitry. The cooling air then exits the housing through the vent holes and thereafter exits the back box through the exhaust opening.

    Apparatus for cooling electronic circuitry

    公开(公告)号:US11963329B2

    公开(公告)日:2024-04-16

    申请号:US17949416

    申请日:2022-09-21

    CPC classification number: H05K7/20145

    Abstract: Described herein are systems, modes, and methods for an electronics enclosure cooling apparatus comprising a plurality of air intake holes located on at least one surface of the enclosure, a plurality of air exhaust holes located on at least one surface of the enclosure different from that of the surface wherein the air intake holes are located, an air plenum piece that comprises a substantially planar portion and a hole located on the substantially planar portion, the air plenum piece of such dimension and placement within the enclosure such that a first volume of the interior is created and a second volume of the interior is created, and wherein the air plenum piece is further adapted to create an air channel that substantially separates the first volume of the interior of the enclosure from the second volume of the interior, and wherein the first volume is in fluid engagement with the plurality of air intake holes, and further wherein the second volume is in fluid engagement with the plurality of air exhaust holes; and a fan located in coaxial alignment with the hole of the air plenum piece such that the fan is adapted to draw air from an exterior of the enclosure through the plurality of air intake holes, into the first volume, out through the second volume, and out through the plurality of air exhaust holes.

    THERMAL MANAGEMENT IN ELECTRICAL BOXES
    20.
    发明公开

    公开(公告)号:US20240032235A1

    公开(公告)日:2024-01-25

    申请号:US17868941

    申请日:2022-07-20

    CPC classification number: H05K7/20172 H05K7/20209 H05K7/20409

    Abstract: An apparatus cools electronic circuitry. A housing has surfaces configured to enclose the electronic circuitry and are mountable inside a cavity in a back box. At least one of the surfaces has a vent holes therein facing an exhaust opening in the back box when the housing is mounted inside the cavity. Another surface has a fan hole that faces an intake opening in the back box when the housing is mounted inside the cavity. A cooling fan is mounted onto the another surface and disposed over the fan hole. The cooling fan is configured to draw cooling air through the intake opening in the back box and the fan hole into the housing and over the electronic circuitry. The cooling air then exits the housing through the vent holes and thereafter exits the back box through the exhaust opening.

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