Hack-proof security keyboard
    11.
    发明授权

    公开(公告)号:US10853525B2

    公开(公告)日:2020-12-01

    申请号:US15953718

    申请日:2018-04-16

    Abstract: Systems and methods for a hack-proof security keyboard are described. In some embodiments, a keyboard module may include a first circuit configured to detect activation of a plurality of keys and a second circuit configured to detect activation of a subset of the plurality of keys, where the second circuit overlies the first circuit. In other embodiments, a method may include detecting an electrical signal received from a secondary membrane of a keyboard, where the keyboard includes a primary membrane configured to detect individual activation of any of a plurality of keys, and where the secondary membrane is configured to output the electrical signal in response to concurrent activation of a subset of the plurality of keys. The method may also include performing a selected action in response to the detection.

    HYBRID THROUGH HOLE FOR SOLID STATE INTRUSION DETECTION

    公开(公告)号:US20240135043A1

    公开(公告)日:2024-04-25

    申请号:US17969844

    申请日:2022-10-19

    CPC classification number: G06F21/86 G06F21/79

    Abstract: An information handling system includes a printed circuit board, a screw, and a processor. The printed circuit board includes a through hole via. The through hole via includes top and bottom sections plated with a conductive plating material, and a middle section without any conductive plating material. The screw in physical communication with the top, middle, and bottom sections of the through hole via in the printed circuit board. The processor determines whether an electrical circuit is formed between the screw, the top section of the through hole via, and the bottom section of the through hole via. Based on the determination of the electrical circuit being formed, the processor provides an indication that no intrusion has been made into the information handling system.

    Coaxial independent haptic force sensing unit

    公开(公告)号:US11720177B1

    公开(公告)日:2023-08-08

    申请号:US17970044

    申请日:2022-10-20

    CPC classification number: G06F3/016 G06F3/044 G06F3/04144 G06F2203/04106

    Abstract: A touch panel device includes a face plate, a force-feedback device, and a touch panel circuit. The face plate receives at a first surface a contact with the face plate. The force-feedback device includes a PCB affixed by a first surface of the PCB to a second surface of the face plate. The PCB includes a first metallic ring on a second surface of the PCB. The piezo disc includes a piezoelectric wafer and a second metallic ring. The piezo disc is adjacent to the second surface of the PCB. The touch panel circuit is coupled to the first metallic ring, the second metallic ring, and the piezoelectric wafer. The touch panel circuit determines a capacitance between the first metallic ring and the second metallic ring, determines a force associated with the contact based upon the capacitance, and triggers a haptic feedback response in the piezoelectric wafer.

    Information handling system high density motherboard

    公开(公告)号:US11662784B2

    公开(公告)日:2023-05-30

    申请号:US17579401

    申请日:2022-01-19

    CPC classification number: G06F1/189 G06F1/181 G06F1/184 G06F1/203

    Abstract: An information handling system motherboard integrates components through integrated wirelines, including at least some components coupled to the motherboard on opposite sides of a narrow region, such as formed by an opening that accepts a cooling fan. A bridge circuit board couples to contacts of the motherboard on opposing sides of the narrow region so that wirelines integrated in the bridge circuit board interface motherboard wirelines, thus offering greater communication density across the narrow region.

    INFORMATION HANDLING SYSTEM HIGH DENSITY MOTHERBOARD

    公开(公告)号:US20220147122A1

    公开(公告)日:2022-05-12

    申请号:US17579401

    申请日:2022-01-19

    Abstract: An information handling system motherboard integrates components through integrated wirelines, including at least some components coupled to the motherboard on opposite sides of a narrow region, such as formed by an opening that accepts a cooling fan. A bridge circuit board couples to contacts of the motherboard on opposing sides of the narrow region so that wirelines integrated in the bridge circuit board interface motherboard wirelines, thus offering greater communication density across the narrow region.

    Information handling system high density motherboard

    公开(公告)号:US11294435B2

    公开(公告)日:2022-04-05

    申请号:US16220712

    申请日:2018-12-14

    Abstract: An information handling system motherboard integrates components through integrated wirelines, including at least some components coupled to the motherboard on opposite sides of a narrow region, such as formed by an opening that accepts a cooling fan. A bridge circuit board couples to contacts of the motherboard on opposing sides of the narrow region so that wirelines integrated in the bridge circuit board interface motherboard wirelines, thus offering greater communication density across the narrow region.

Patent Agency Ranking