公开(公告)号：US20240232444A9

公开(公告)日：2024-07-11

申请号：US17969844

申请日：2022-10-20

Applicant: DELL PRODUCTS L.P.

Inventor： Yong-Teng Lin ,  Bradford Edward Vier ,  Chun-Kai Tzeng ,  Chin-Yao Hsu ,  Yu-Lin Tsai

IPC: G06F21/86 ,  G06F21/79

CPC classification number: G06F21/86 ,  G06F21/79

Abstract: An information handling system includes a printed circuit board, a screw, and a processor. The printed circuit board includes a through hole via. The through hole via includes top and bottom sections plated with a conductive plating material, and a middle section without any conductive plating material. The screw in physical communication with the top, middle, and bottom sections of the through hole via in the printed circuit board. The processor determines whether an electrical circuit is formed between the screw, the top section of the through hole via, and the bottom section of the through hole via. Based on the determination of the electrical circuit being formed, the processor provides an indication that no intrusion has been made into the information handling system.

公开(公告)号：US11832393B2

公开(公告)日：2023-11-28

申请号：US17844972

申请日：2022-06-21

Applicant: Dell Products L.P.

Inventor： Yu-Lin Tsai ,  Chia-Hsien Lu ,  Chun-Min He ,  RungLung Lin ,  Chin-Chung Wu

IPC: H05K13/04 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K13/0465 ,  H05K1/181 ,  H05K3/303 ,  H05K2201/10689

Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.

公开(公告)号：US20220322591A1

公开(公告)日：2022-10-06

申请号：US17844972

申请日：2022-06-21

Applicant: Dell Products L.P.

Inventor： Yu-Lin Tsai ,  Chia-Hsien Lu ,  Chun-Min He ,  RungLung Lin ,  Chin-Chung Wu

IPC: H05K13/04 ,  H05K3/30 ,  H05K1/18

Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.

公开(公告)号：US12279370B2

公开(公告)日：2025-04-15

申请号：US17969844

申请日：2022-10-20

Applicant: DELL PRODUCTS L.P.

Inventor： Yong-Teng Lin ,  Bradford Edward Vier ,  Chun-Kai Tzeng ,  Chin-Yao Hsu ,  Yu-Lin Tsai

IPC: H05K1/11 ,  G06F1/18 ,  G06F21/79 ,  G08B13/12 ,  H05K5/02

Abstract: An information handling system includes a printed circuit board, a screw, and a processor. The printed circuit board includes a through hole via. The through hole via includes top and bottom sections plated with a conductive plating material, and a middle section without any conductive plating material. The screw is in physical communication with the top, middle, and bottom sections of the through hole via in the printed circuit board. The processor determines whether an electrical circuit is formed between the screw, the top section of the through hole via, and the bottom section of the through hole via. Based on the determination of the electrical circuit being formed, the processor provides an indication that no intrusion has been made into the information handling system.

公开(公告)号：US20240135043A1

公开(公告)日：2024-04-25

申请号：US17969844

申请日：2022-10-19

Applicant: DELL PRODUCTS L.P.

Inventor： Yong-Teng Lin ,  Bradford Edward Vier ,  Chun-Kai Tzeng ,  Chin-Yao Hsu ,  Yu-Lin Tsai

IPC: G06F21/86 ,  G06F21/79

CPC classification number: G06F21/86 ,  G06F21/79

Abstract: An information handling system includes a printed circuit board, a screw, and a processor. The printed circuit board includes a through hole via. The through hole via includes top and bottom sections plated with a conductive plating material, and a middle section without any conductive plating material. The screw in physical communication with the top, middle, and bottom sections of the through hole via in the printed circuit board. The processor determines whether an electrical circuit is formed between the screw, the top section of the through hole via, and the bottom section of the through hole via. Based on the determination of the electrical circuit being formed, the processor provides an indication that no intrusion has been made into the information handling system.

公开(公告)号：US11432447B2

公开(公告)日：2022-08-30

申请号：US16432451

申请日：2019-06-05

Applicant: Dell Products L.P.

Inventor： Yu-Lin Tsai ,  Chia-Hsien Lu ,  Chun-Min He ,  RungLung Lin ,  Chin-Chung Wu

IPC: H05K13/04 ,  H05K3/30 ,  H05K1/18

Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.