公开(公告)号：US11965698B2

公开(公告)日：2024-04-23

申请号：US17520958

申请日：2021-11-08

Applicant: Delta Electronics, Inc.

Inventor： Shih-Lin Huang ,  Ting-Yuan Wu

IPC: F28D15/02 ,  F28D15/04

CPC classification number: F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28D15/046

Abstract: A slim heat-dissipation module is provided. The slim heat-dissipation module includes a first plate, a second plate, a first porous structure, a second porous structure, a first fluid, and a second fluid. The second plate is combined with the first plate to form a first type chamber and a second type chamber, wherein the first type chamber and the second type chamber are sealed and independent, respectively. The first porous structure is disposed in the first type chamber. The second porous structure is disposed in the second type chamber. The first fluid is disposed in the first type chamber. The second fluid is disposed in the second type chamber.

公开(公告)号：US11454456B2

公开(公告)日：2022-09-27

申请号：US16503251

申请日：2019-07-03

Applicant: DELTA ELECTRONICS, INC.

Inventor： Shih-Lin Huang ,  Chiu-Kung Chen

IPC: F28D15/00 ,  F28D15/04 ,  F28F13/00 ,  F28D15/02

Abstract: A heat pipe comprises a first pipe and at least a second pipe. The first pipe includes an evaporator, a heat insulator and a condenser communicating with each other to define a hollow chamber. The second pipe disposed in the hollow chamber includes an accommodating space and a first capillary structure disposed in one end of the accommodating space closer to the evaporator. Two opposite sides of an outer pipe wall of the second pipe directly abut an inner pipe wall of the first pipe. The first pipe further includes a second capillary structure which is disposed in the hollow chamber closer to the evaporator and extended to an outside of the second pipe and occupies at least ⅔ volume of the evaporator. A first part of the first capillary structure and the second capillary structure are connected to each other by winding so as to enhance transportation therebetween.

公开(公告)号：US10724803B2

公开(公告)日：2020-07-28

申请号：US15397067

申请日：2017-01-03

Applicant: Delta Electronics, Inc.

Inventor： Shih-Lin Huang ,  Chiu-Kung Chen ,  Ti-Jun Wang ,  Quan Zhang

IPC: F28D15/04 ,  H05K7/20 ,  F28D15/02 ,  F28D21/00

Abstract: A heat pipe is provided, including a capillary body. The capillary body has a condensation portion, an evaporation portion, and a connecting portion connecting the condensation portion with the evaporation portion. The capillary body is formed by metal weaving. A cross-section of the evaporation portion is larger than that of the condensation portion.

公开(公告)号：US10520260B2

公开(公告)日：2019-12-31

申请号：US14610503

申请日：2015-01-30

Applicant: DELTA ELECTRONICS, INC.

Inventor： Shih-Lin Huang ,  Chiu-Kung Chen ,  Ti-Jun Wang

IPC: F28D15/04

Abstract: A heat pipe is divided into an evaporation section, an insulation section and a condensation section. The insulation section includes a pipe section and a liquid delivery structure. The pipe section has a top wall and a bottom wall. The liquid delivery structure is a solid structure and in contact with the top and bottom walls of the pipe section. The liquid delivery structure and the top and bottom walls of the pipe section form a vapor channel. The liquid delivery structure is divided into a center portion and an outer layer, and the center portion has a porosity greater than the porosity of the outer layer. The outer layer is coupled to the center portion, and the center portion and the vapor channel are spaced from one another, so as to achieve the liquid and vapor isolation and improve the heat conducting effect of the heat pipe.