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公开(公告)号：US11598585B2
公开(公告)日：2023-03-07
申请号：US17223696
申请日：2021-04-06
Applicant: DELTA ELECTRONICS, INC.
Inventor： Shih-Lin Huang , Chiu-Kung Chen , Sheng-Hua Luo , Ti-Jun Wang
Abstract: A heat pipe comprises a tube and a wick structure. The tube includes a hollow chamber and has two sealed ends along an axial direction. The wick structure is disposed in the hollow chamber and extended along the axial direction of the tube. The wick structure has a first section near one of the sealed ends, a third section near the other of the sealed ends, and a second section between the first and third sections. The wick structure is composed of the first, the second and the third sections, and cross-sections of the first section, the second section and the third section in the axial direction are rectangles, respectively. A cross-sectional area of the first section is greater than that of the second and that of third section. The edge of each of the sections of the wick structure has a smooth form without the sectional difference.
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公开(公告)号：US11731220B2
公开(公告)日：2023-08-22
申请号：US17243480
申请日：2021-04-28
Applicant: Delta Electronics, Inc.
Inventor： Shih-Lin Huang , Sien Wu , Baoxun He , Ti-Jun Wang
CPC classification number: B23P15/26 , B23K26/21 , F28D15/0233 , F28D15/04 , B23K2101/14 , B23P2700/09 , F28F19/00 , F28F21/083 , F28F21/085 , F28F21/086 , F28F2225/04 , F28F2275/067
Abstract: A vapor chamber with a support structure and its manufacturing method are provided. The vapor chamber with the support structure includes a first plate, a second plate spaced apart from the first plate, and multiple support elements fixed between the first and second plates. On an outer surface of any of the first plate or the second plate, laser welding is performed on positions corresponding to the support elements so as to join the support elements to the first and second plates and to form weld ports on the outer surface of any of the plates. The invention solves the problem of fixing the support structure inside the thin vapor chamber, and therefore mass production can be realized.
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公开(公告)号：US20220120511A1
公开(公告)日：2022-04-21
申请号：US17336002
申请日：2021-06-01
Applicant: Delta Electronics, Inc.
Inventor： Shih-Lin Huang , Xiaojun Chen , Guangshuai Wang
Abstract: A heat pipe structure and a manufacturing method are provided. The heat pipe structure includes a case, a wick structure and two lateral sealing structures. The case includes an enclosed space in a sealing state. The wick structure is disposed within the enclosed space and includes a first end and a second end opposite to each other. The two lateral sealing structures are configured to seal two opposite sides of the case. One of the two lateral sealing structures clamps the first end of the wick structure. The other of the lateral sealing structures clamps the second end of the wick structure.
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公开(公告)号：US10145619B2
公开(公告)日：2018-12-04
申请号：US15783300
申请日：2017-10-13
Applicant: DELTA ELECTRONICS, INC.
Inventor： Shih-Lin Huang , Chiu-Kung Chen , Sien Wu , Ti-Jun Wang
IPC: F28D15/02
Abstract: A heat pipe is disclosed in the present invention. The heat pipe includes a first pipe and at least a second pipe. The first pipe is formed with an enclosed space. The second pipe is disposed in the enclosed space. There is no wick structure disposed between the first pipe and the second pipe.
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公开(公告)号：US12253314B2
公开(公告)日：2025-03-18
申请号：US18471079
申请日：2023-09-20
Applicant: DELTA ELECTRONICS, INC.
Inventor： Shih-Lin Huang , Chiu-Kung Chen , Sheng-Hua Luo , Ti-Jun Wang
Abstract: A heat pipe comprises a flat tube and a wick structure. The flat tube includes a hollow chamber and has a front and a rear sealed ends along an axial direction. The wick structure is disposed in the hollow chamber and extended along the axial direction of the flat tube. The wick structure is divided into a front, a middle and a rear sections sequentially along the axial direction. The front section is near the front sealed end, the rear section is near the rear sealed end. The front, middle and rear sections have a maximum length parallel to the width direction, respectively. The maximum length of the front section is greater than that of the middle section, and the maximum length of the middle section is greater than that of the rear section.
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Patent Agency Ranking
公开(公告)号：US12121988B2
公开(公告)日：2024-10-22
申请号：US18353427
申请日：2023-07-17
Applicant: Delta Electronics, Inc.
Inventor： Shih-Lin Huang , Tai-De Qi , Zhen-Hua Li
IPC: B23K101/14 , B23K20/10 , F28D15/02
CPC classification number: B23K20/10 , F28D15/02 , B23K2101/14 , F28F2275/065
Abstract: A heat transmitting device is provided, including a main body and an integrating portion. The main body has at least one opening. The integrating portion is used to seal the opening, and has a first surface and a second surface opposite the first surface. A first welding pattern is formed on the first surface, a second welding pattern is formed on the second surface, and the position of the first welding pattern corresponds to that of the second welding pattern. The type of the first welding pattern and the type of the second welding pattern are asymmetric.
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公开(公告)号：US11796259B2
公开(公告)日：2023-10-24
申请号：US18153760
申请日：2023-01-12
Applicant: DELTA ELECTRONICS, INC.
Inventor： Shih-Lin Huang , Chiu-Kung Chen , Sheng-Hua Luo , Ti-Jun Wang
CPC classification number: F28D15/046 , F28D15/0233
Abstract: A heat pipe comprises a flat tube and a wick structure. The flat tube includes a hollow chamber and has a front and a rear sealed ends along an axial direction. The wick structure is disposed in the hollow chamber and extended along the axial direction of the flat tube. The wick structure is divided into a front, a middle and a rear sections sequentially along the axial direction. The front section is near the front sealed end, the rear section is near the rear sealed end. The front, middle and rear sections have a maximum length parallel to the width direction, respectively, the maximum length of the middle section is greater than that of the front section and that of the rear section so as to be used as the evaporator of the heat pipe.
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公开(公告)号：US11892243B2
公开(公告)日：2024-02-06
申请号：US17889658
申请日：2022-08-17
Applicant: DELTA ELECTRONICS, INC.
Inventor： Shih-Lin Huang , Chiu-Kung Chen
CPC classification number: F28D15/046 , F28D15/0233 , F28F13/00 , F28F2270/00
Abstract: A heat pipe comprises a first pipe and at least a second pipe. The first pipe includes an evaporator, a heat insulator and a condenser communicating with each other to define a hollow chamber. The second pipe disposed in the hollow chamber includes an accommodating space and a first capillary structure disposed in one end of the accommodating space closer to the evaporator. At least one side of an outer pipe wall of the second pipe directly abuts an inner pipe wall of the first pipe. The first pipe further includes a second capillary structure disposed in the hollow chamber closer to the evaporator and extended to an outside of the second pipe and occupies at least 2/3 volume of the evaporator. A first part of the first capillary structure and the second capillary structure are connected to each other by winding so as to enhance transportation therebetween.
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公开(公告)号：US11561050B2
公开(公告)日：2023-01-24
申请号：US16673212
申请日：2019-11-04
Applicant: DELTA ELECTRONICS, INC.
Inventor： Shih-Lin Huang , Ting-Yuan Wu , Chiu-Kung Chen , Chun-Lung Chiu
Abstract: A slim vapor chamber includes a first plate, a second plate and a capillary structure. The periphery of the second plate is connected with that of the first plate to form a chamber. The capillary structure is disposed on an inner wall of the chamber. Both of a side of the first plate facing the second plate and a side of the second plate facing the first plate are formed with a plurality of supporting structures, which include a plurality of supporting pillars and a plurality of supporting plates, by an etching process.
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公开(公告)号：US20240344774A1
公开(公告)日：2024-10-17
申请号：US18750928
申请日：2024-06-21
Applicant: Delta Electronics, Inc.
Inventor： Shih-Lin Huang , Xiaojun Chen , Guangshuai Wang
CPC classification number: F28D15/046 , F28D15/0283 , F28D15/0233
Abstract: A manufacturing method of a heat pipe structure is provided. Firstly, a step S1 is performed. An original heat pipe structure is provided. The original heat pipe structure includes an enclosed space in a sealed state and an original wick structure disposed within the enclosed space. Then, a step S2 is performed. Portion of the original heat pipe structure is deformed to form a deformation portion. The deformation portion clamps portion of the original wick structure. The enclosed space is separated into two subspaces. Then, a step S3 is performed. The deformation portion is cut to separate the two subspaces to form two heat pipe structures.
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