Heat dissipation module for electronic device
    11.
    发明申请
    Heat dissipation module for electronic device 审中-公开
    电子设备散热模块

    公开(公告)号:US20050254212A1

    公开(公告)日:2005-11-17

    申请号:US10846500

    申请日:2004-05-17

    CPC classification number: H05K7/20918

    Abstract: A heat dissipation module is used for a high-power semiconductor laser device with an operation current below 8 amperes. The heat dissipation module has a housing, a plurality of air holes on in panels of the housing, an air outlet in a rear panel of the housing, a heat dissipation module in the housing, the heat dissipation module having a heat-dissipating plate and a base placed beside the heat-dissipating plate, the base having a plurality of holes corresponding to at least one high-power element, the high-power element being arranged on one face of the heat-dissipating plate and near the air outlet, and the high-power element having pins connected to holes on the base through insulating unit and wire. Therefore, the high-power semiconductor laser device can be operated at a stable temperature.

    Abstract translation: 散热模块用于工作电流低于8安培的大功率半导体激光器件。 所述散热模块具有壳体,所述壳体的面板中的多个气孔,所述壳体的后面板中的空气出口,所述壳体中的散热模块,所述散热模块具有散热板和 位于所述散热板旁边的基座,所述基座具有与至少一个高功率元件相对应的多个孔,所述高功率元件布置在所述散热板的一个面上且靠近所述出风口,以及 高功率元件具有通过绝缘单元和线连接到基座上的孔的销。 因此,高功率半导体激光器件可以在稳定的温度下工作。

    Heat dissipation apparatus
    12.
    发明授权
    Heat dissipation apparatus 失效
    散热装置

    公开(公告)号:US06904960B1

    公开(公告)日:2005-06-14

    申请号:US10731165

    申请日:2003-12-10

    CPC classification number: F04D25/0613 F04D19/007 H05K7/20172

    Abstract: A heat dissipation apparatus has an enclosure, in which a lateral fan seat is integrally formed with the enclosure. The lateral fan seat divides the interior space of the enclosure into an upper chamber and a lower chamber. An axis is installed across the upper and the lower chambers through a center of the fan seat. A coil set, a magnetic element and a plurality of blades are mounted about the axis in each of the upper and lower chambers. Thereby, two sets of fans are formed in a single enclosure to increase the heat dissipation effect while the assembly convenience is improved.

    Abstract translation: 散热装置具有外壳,其中侧风扇座与外壳一体形成。 侧风扇座将外壳的内部空间划分为上部室和下部室。 轴线通过风扇座的中心安装在上下两个腔室之间。 线圈组,磁性元件和多个叶片围绕轴线安装在每个上部和下部腔室中。 由此,在单个外壳中形成两组风扇,以提高散热效果,同时提高组装方便性。

    Touching device, laser source module, and laser source structure thereof
    13.
    发明授权
    Touching device, laser source module, and laser source structure thereof 有权
    触摸装置,激光源模块及其激光源结构

    公开(公告)号:US08791923B2

    公开(公告)日:2014-07-29

    申请号:US12747163

    申请日:2009-07-10

    CPC classification number: G06F3/0421

    Abstract: The disclosure describes a touch device including a touching area having a first edge and a second edge; two reflective lens arrays and two laser source modules which are all disposed at the first edge and the second edge respectively, wherein each laser source module includes a laser diode and a diffractive optical element assembled in front of the laser diode for separating a laser beam projected from the laser diode to a plurality of laser beams with equal magnitude, the laser beams are distributed in a parallel arrangement over the touching area by the reflective lens array; and two receiving devices disposed at the corresponding edges of the first edge and the second edge respectively. The receiving device includes a plurality of sensing units, wherein each sensing unit receives one of the laser beams respectively.

    Abstract translation: 本发明描述了一种触摸装置,其包括具有第一边缘和第二边缘的触摸区域; 两个反射透镜阵列和两个激光源模块分别设置在第一边缘和第二边缘处,其中每个激光源模块包括激光二极管和组合在激光二极管前面的衍射光学元件,用于分离投影的激光束 从激光二极管到具有相等幅度的多个激光束,激光束通过反射透镜阵列以平行布置分布在触摸区域上; 以及分别设置在第一边缘和第二边缘的相应边缘处的两个接收装置。 接收装置包括多个感测单元,其中每个感测单元分别接收一个激光束。

    OPTICAL TOUCH SYSTEM AND A POSITIONING METHOD THEREOF
    14.
    发明申请
    OPTICAL TOUCH SYSTEM AND A POSITIONING METHOD THEREOF 审中-公开
    光触摸系统及其定位方法

    公开(公告)号:US20130044081A1

    公开(公告)日:2013-02-21

    申请号:US13483073

    申请日:2012-05-30

    CPC classification number: G06F3/0418 G06F3/042 G06F3/0425

    Abstract: The present disclosure provides an optical touch system and a positioning method thereof based on stereo vision theory. The proposed optical touch system adopts at least two adjustable linear image sensors to capture image information so that the information can be applicable to different sizes of touch screens by adjusting locations of the image sensors. Sensing area covers the whole screen without the need to increase quantity of sensors; besides, the present disclosure also provides a positioning method for the optical touch system, malting the spectra emitted by a stylus correspond to the image sensors, which leaves out complicated image processing to improve the speed and accuracy of touch response.

    Abstract translation: 本公开提供了一种基于立体视觉理论的光学触摸系统及其定位方法。 所提出的光学触摸系统采用至少两个可调节的线性图像传感器来捕获图像信息,以便通过调整图像传感器的位置来将信息适用于不同尺寸的触摸屏。 感应区覆盖整个屏幕,无需增加传感器的数量; 此外,本公开还提供了一种用于光学触摸系统的定位方法,将由触针发射的光谱与图像传感器相对应,从而避免了复杂的图像处理以提高触摸响应的速度和准确性。

    Heat dissipation module for an electronic device
    15.
    发明申请
    Heat dissipation module for an electronic device 审中-公开
    电子设备散热模块

    公开(公告)号:US20050258523A1

    公开(公告)日:2005-11-24

    申请号:US10846498

    申请日:2004-05-17

    CPC classification number: H05K7/20918 H01L2924/0002 H01L2924/00

    Abstract: A heat dissipation module is used for a high-power semiconductor laser device with an operation current below 2 amperes and has a housing, a plurality of air holes in side panels of the housing, an air outlet on a rear panel of the housing, and a heat dissipation module in the housing. The heat dissipation module has a heat-dissipating plate and a base placed beside the heat-dissipating plate. The base has a plurality of holes corresponding to a current controller, the current controller is arranged on one face of the heat-dissipating plate and near the air outlet, and the current controller has pins connected to holes on the base through insulating unit and wire. Therefore, the high-power semiconductor laser device can be operated at a stable temperature.

    Abstract translation: 散热模块用于工作电流低于2安培的大功率半导体激光器件,并具有壳体,壳体侧面板上的多个气孔,壳体后面板上的出风口,以及 壳体中的散热模块。 散热模块具有散热板和放置在散热板旁边的基座。 基座具有对应于电流控制器的多个孔,电流控制器布置在散热板的一个面上且靠近出风口处,并且电流控制器具有通过绝缘单元和线连接到基座上的孔的销 。 因此,高功率半导体激光器件可以在稳定的温度下工作。

    Heat dissipation module for electronic device
    16.
    发明申请
    Heat dissipation module for electronic device 审中-公开
    电子设备散热模块

    公开(公告)号:US20050254211A1

    公开(公告)日:2005-11-17

    申请号:US10846499

    申请日:2004-05-17

    CPC classification number: H05K7/209

    Abstract: A heat dissipation module is used for high-power semiconductor laser device with operation current below 3.5 amperes and has a housing with a plurality of air holes in side panels of the housing, an air outlet on a rear panel of the housing and a heat dissipation module in the housing. The heat dissipation module has a heat-dissipating plate and a base placed beside the heat-dissipating plate, the base has a plurality of holes corresponding to at least one current controller, the current controller is arranged on one face of the heat-dissipating plate and near the air outlet, and the current controller has pins connected to holes on the base through insulating unit and wire. Therefore, the high-power semiconductor laser device can be operated at a stable temperature.

    Abstract translation: 散热模块用于工作电流低于3.5安培的大功率半导体激光器件,并具有外壳,壳体侧面板上有多个气孔,壳体后面板上的出风口和散热 模块在房屋。 散热模块具有散热板和放置在散热板旁边的基座,基座具有与至少一个电流控制器对应的多个孔,电流控制器设置在散热板的一个面上 并且在出风口附近,电流控制器具有通过绝缘单元和电线连接到基座上的孔的销。 因此,高功率半导体激光器件可以在稳定的温度下工作。

    Vacuum laser constant temperature device
    17.
    发明申请
    Vacuum laser constant temperature device 失效
    真空激光恒温装置

    公开(公告)号:US20050252228A1

    公开(公告)日:2005-11-17

    申请号:US10846501

    申请日:2004-05-17

    Abstract: A vacuum laser constant temperature device is adopted for a housing that has a heat dissipation module arranged therein. The device has a metallic partition adjacent to the heat dissipation module to enclose a airtight vacancy formed with the housing, a thermoelectric cooling chip with a heating portion connecting to a side of the metallic partition and a cooling portion, a semiconductor laser lighting module arranged in the airtight vacancy and connecting to the cooling portion of the thermoelectric cooling chip, and a heat insulation layer arranged both on an opposite side of the metallic partition and in the airtight vacancy. Heat generated by the semiconductor laser lighting module can be transferred to the heat dissipation module via the thermoelectric cooling chip and the metallic partition. The thermoelectric cooling chip makes an output power of the semiconductor laser lighting module keep constant within various environments without the condensation thereon.

    Abstract translation: 在其中布置有散热模块的壳体中采用真空激光恒温装置。 该装置具有与散热模块相邻的金属隔板,以封闭与壳体形成的气密空位;热电冷却芯片,具有连接到金属隔板侧面的加热部分和冷却部分;半导体激光照明模块, 密封空间并连接到热电冷却芯片的冷却部分,以及隔热层,其布置在金属隔板的相对侧并且处于气密空缺中。 半导体激光照明模块产生的热量可以通过热电冷却芯片和金属隔板传递到散热模块。 热电冷却芯片使得半导体激光照明模块的输出功率在各种环境中保持恒定,而不会在其上冷凝。

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