公开(公告)号：US07473579B2

公开(公告)日：2009-01-06

申请号：US11343256

申请日：2006-01-27

申请人： Hasan Sharifi ,  Saeed Mohammadi ,  Linda P. B. Katehi

发明人： Hasan Sharifi ,  Saeed Mohammadi ,  Linda P. B. Katehi

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/82 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2924/00

摘要： A polymer-based, self-aligned wafer-level heterogeneous integration system, SA WLIT, for integrating semiconductor integrated circuit (IC) chips to a substrate is presented. The system includes a method including preparing a substrate, flipping the substrate onto a polymer-based flat surface and securing the substrate to the flat surface, mounting semiconductor chips into the prepared substrate, integrating the chips to the substrate with another polymer-based material, and removing the resulting multi-chip module from the flat surface. The chips may then be connected with each other and regions off the multi-chip module with metal interconnect processing technology.A multi-chip module prepared by the polymer-based, self-aligned heterogeneous integration system including semiconductor chips mounted in a prepared substrate. The chips may be connected to the substrate by a polymer-based integrating material.

摘要翻译： 提出了一种用于将半导体集成电路（IC）芯片集成到衬底的基于聚合物的自对准晶片级异质集成系统SA WLIT。 该系统包括一种方法，包括制备基板，将基板翻转到基于聚合物的平坦表面上并将基板固定到平坦表面上，将半导体芯片安装到制备的基板中，将芯片与另一种聚合物基材料集成到基板上， 并从平坦表面移除所得到的多芯片模块。 然后可以利用金属互连处理技术将芯片彼此连接并且将多个芯片模块的区域连接。 通过基于聚合物的自对准异相集成系统制备的多芯片模块，其包括安装在制备的基板中的半导体芯片。 芯片可以通过基于聚合物的一体化材料连接到基板。