公开(公告)号：US20110140052A1

公开(公告)日：2011-06-16

申请号：US12962022

申请日：2010-12-07

Applicant: Nanayakkara L.D. Somasiri ,  Jimmie R. Baran, JR. ,  Andrew C. Lottes ,  Ge Jiang ,  Badri Veeraraghavan ,  Paul V. Huynh ,  Dipankar Ghosh

Inventor： Nanayakkara L.D. Somasiri ,  Jimmie R. Baran, JR. ,  Andrew C. Lottes ,  Ge Jiang ,  Badri Veeraraghavan ,  Paul V. Huynh ,  Dipankar Ghosh

IPC: H01B1/24 ,  H01B1/20 ,  H01B1/22 ,  B82Y30/00

CPC classification number: H01B1/24 ,  H01B1/22 ,  H01B3/004 ,  H01B3/28 ,  H02G15/064 ,  H02G15/103 ,  H02G15/184

Abstract: Provided is a composition comprising a polymeric material, a filler material dispersed in the polymeric material, the filler material comprising inorganic particles and a discontinuous arrangement of conductive material wherein at least a portion of the conductive material is in durable electrical contact with the inorganic particles, and conductive material dispersed in the polymeric material.

Abstract translation: 提供了一种组合物，其包含聚合材料，分散在聚合物材料中的填充材料，填充材料包含无机颗粒和不连续排列的导电材料，其中导电材料的至少一部分与无机颗粒耐久电接触， 和分散在聚合材料中的导电材料。