公开(公告)号：US20170317312A1

公开(公告)日：2017-11-02

申请号：US15417624

申请日：2017-01-27

Applicant: Electronics and Telecommunications Research Institute

Inventor： Doo-Hee CHO ,  Jonghee LEE ,  Hyunsu CHO ,  Byoung-Hwa KWON ,  Jaehyun MOON ,  YOUNG SAM PARK ,  Jin Wook SHIN ,  Byoung Gon YU ,  Hyunkoo LEE ,  Jong Tae LIM ,  Nam Sung CHO ,  Jun-Han HAN

IPC: H01L51/52 ,  H01L51/00 ,  H01L51/56

CPC classification number: H01L51/5253 ,  H01L51/0097 ,  H01L2251/5338

Abstract: Disclosed are an organic light emitting device and a method of fabricating the same. The method of fabricating an organic light emitting device comprises forming a flexible substrate, and forming an organic light emitting layer on the flexible substrate. The forming the flexible substrate comprises, forming a first polymer pattern on a first metal layer, forming a second metal layer on an exposed portion of the first metal layer through the first polymer pattern, forming a gas barrier layer on the first polymer pattern and the second metal layer, forming a second polymer layer on the gas barrier layer, and removing the first metal layer to expose a surface of the first polymer pattern and a surface of the second metal layer.

公开(公告)号：US20170207410A1

公开(公告)日：2017-07-20

申请号：US15400801

申请日：2017-01-06

Applicant: Electronics and Telecommunications Research Institute

Inventor： Doo-Hee CHO ,  Jonghee LEE ,  Hyunsu CHO ,  Byoung-Hwa KWON ,  Jaehyun MOON ,  YOUNG SAM PARK ,  Jin Wook SHIN ,  Byoung Gon YU ,  JEONG IK LEE ,  Hyunkoo LEE ,  Jong Tae LIM ,  Nam Sung CHO ,  Chul Woong JOO ,  Jun-Han HAN

IPC: H01L51/52 ,  H01L51/00 ,  H01L51/56

CPC classification number: H01L51/5212 ,  H01L21/6835 ,  H01L51/0022 ,  H01L51/0023 ,  H01L51/003 ,  H01L51/56 ,  H01L2221/6835

Abstract: Provided are a method for manufacturing an integrated substrate for an organic light emitting diode, an organic light emitting diode, and a method for manufacturing an organic light emitting diode, wherein the method for manufacturing an organic light emitting diode may include forming a sacrificial layer on a release substrate, forming a first electrode on the sacrificial layer, forming on the first electrode an auxiliary electrode pattern having an opening, forming a buffer layer on the auxiliary electrode pattern and in the opening, providing a substrate on the buffer layer, removing the release substrate and the sacrificial layer to expose a first surface of the first electrode, and laminating an organic light emitting layer and a second electrode on the first surface of the first electrode.