公开(公告)号：US08466041B2

公开(公告)日：2013-06-18

申请号：US12950308

申请日：2010-11-19

申请人： Yasuyoshi Kuroda ,  Kazunori Kondo ,  Hideto Kato

发明人： Yasuyoshi Kuroda ,  Kazunori Kondo ,  Hideto Kato

IPC分类号： H01L21/762

CPC分类号： H01L21/76898 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/544 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/54433 ,  H01L2223/54473 ,  H01L2224/11003 ,  H01L2224/81001 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01067 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/00

摘要： Provided is a method for manufacturing a lamination type semiconductor integrated device that can simultaneously attain grinding force resistance during back side grinding of a semiconductor wafer, heat resistance during anisotropic dry etching and the like, chemical resistance during plating and etching, smooth debonding of a support substrate for processing at the end, and low adherend staining; the method comprises at least a step of back side grinding of a first semiconductor wafer having a device formed on its surface and a step of laminating by electrical bonding the first semiconductor wafer with a second semiconductor wafer having a device formed on its surface, wherein, at the time of back side grinding of the first semiconductor wafer, back of the first semiconductor wafer is ground after surface of formed device on the first semiconductor wafer is bonded to a support substrate for processing by using a pressure-sensitive silicone adhesive.

摘要翻译： 本发明提供一种能够同时获得半导体晶片的后侧研磨期间的耐磨性，各向异性干法蚀刻等期间的耐热性，电镀和蚀刻时的耐化学性，支持体的平滑脱粘的层叠型半导体一体化装置的制造方法 底物加工结束，低粘附染色; 所述方法至少包括在其表面上形成有器件的第一半导体晶片的后侧研磨和通过将第一半导体晶片与其表面上形成有器件的第二半导体晶片电接合的步骤， 在第一半导体晶片的背面研磨时，第一半导体晶片的背面在第一半导体晶片上的成形器件的表面通过使用压敏硅胶粘合剂结合到用于处理的支撑衬底上之后被研磨。

公开(公告)号：US06756127B2

公开(公告)日：2004-06-29

申请号：US10269001

申请日：2002-10-11

申请人： Yasuyoshi Kuroda ,  Shunji Aoki ,  Masahiko Ogawa

发明人： Yasuyoshi Kuroda ,  Shunji Aoki ,  Masahiko Ogawa

IPC分类号： B32B2520

CPC分类号： C08K5/541 ,  C08K5/1539 ,  C09D183/04 ,  C09J7/50 ,  C09J2423/006 ,  C09J2479/086 ,  C09J2481/006 ,  C09J2483/00 ,  C09J2483/003 ,  Y10T428/31663 ,  C08L83/04 ,  C08L83/00 ,  C08L2666/34 ,  C08L2666/28

摘要： A primer composition comprising (A) a diorganopolysiloxane having an average degree of polymerization of 500-2,000 and alkenyl groups at both ends of its molecular chain in an amount of 0.001-0.005 mol per 100 g of the diorganopolysiloxane, (B) an organohydrogenpolysiloxane having at least two SiH groups in a molecule, (C) a platinum base curing catalyst, and (D) a retarder is effective for improving the adhesion between various plastic films and silicone pressure-sensitive adhesives and thus forming satisfactory pressure-sensitive adhesive tapes.

摘要翻译： 一种底漆组合物，其包含（A）平均聚合度为500-2,000的二有机聚硅氧烷和其分子链两端的烯基的量为每100克二有机聚硅氧烷为0.001-0.005摩尔，（B）有机氢聚硅氧烷，其具有 分子中的至少两个SiH基团，（C）铂基固化催化剂和（D）延迟剂对于改善各种塑料膜和硅氧烷压敏粘合剂之间的粘附性是有效的，因此形成令人满意的压敏粘合带。

公开(公告)号：US20060172140A1

公开(公告)日：2006-08-03

申请号：US11345327

申请日：2006-02-02

申请人： Yasuyoshi Kuroda ,  Shunji Aoki

发明人： Yasuyoshi Kuroda ,  Shunji Aoki

IPC分类号： B32B27/00 ,  C08L83/04 ,  B32B37/00

CPC分类号： C09J183/04 ,  C08L83/00 ,  C09J7/38 ,  C09J2483/00 ,  Y10T428/31663

摘要： A silicone composition for use as a pressure sensitive adhesive, comprising a mixture obtained by reacting (A) a polyorganosiloxane having at least two alkenyl groups per molecule with (B) a polyorganosiloxane having an R13SiO0.5 unit and a SiO2 unit, wherein R1 may be the same with or different from each other and is a monovalent hydrocarbon group having 1 to 10 carbon atoms, (C) a polyorganosiloxane having an SiH group, (D) a retarder and (E) a platinum group metal catalyst. A pressure sensitive adhesive tape made from the composition can be peeled off from an object without leaving adhesive residue even after aged at a temperature of 250° C. or higher.

摘要翻译： 一种用作压敏粘合剂的硅氧烷组合物，其包含通过使（A）每分子具有至少两个烯基的聚有机硅氧烷与（B）具有R 1的聚有机硅氧烷反应获得的混合物， 3 0.5 单元和SiO 2单元，其中R 1彼此可以相同或不同，并且是 具有1〜10个碳原子的一价烃基，（C）具有SiH基的聚有机硅氧烷，（D）延迟剂和（E）铂族金属催化剂。 即使在250℃或更高的温度下老化之后，也可以将由该组合物制成的压敏粘合带从物体上剥离而不留下粘合残留物。

公开(公告)号：US06559246B2

公开(公告)日：2003-05-06

申请号：US09805942

申请日：2001-03-15

申请人： Yasuyoshi Kuroda ,  Shunji Aoki ,  Masahiko Ogawa

发明人： Yasuyoshi Kuroda ,  Shunji Aoki ,  Masahiko Ogawa

IPC分类号： C08G7714

CPC分类号： C08K5/541 ,  C08K5/1539 ,  C09D183/04 ,  C09J7/50 ,  C09J2423/006 ,  C09J2479/086 ,  C09J2481/006 ,  C09J2483/00 ,  C09J2483/003 ,  Y10T428/31663 ,  C08L83/04 ,  C08L83/00 ,  C08L2666/34 ,  C08L2666/28

摘要： A primer composition comprising (A) a diorganopolysiloxane having an average degree of polymerization of 500-2,000 and alkenyl groups at both ends of its molecular chain in an amount of 0.001-0.005 mol per 100 g of the diorganopolysiloxane, (B) an organohydrogenpolysiloxane having at least two SiH groups in a molecule, (C) a platinum base curing catalyst, and (D) a retarder is effective for improving the adhesion between various plastic films and silicone pressure-sensitive adhesives and thus forming satisfactory pressure-sensitive adhesive tapes.