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公开(公告)号:US09812400B1
公开(公告)日:2017-11-07
申请号:US15154367
申请日:2016-05-13
Applicant: GLOBALFOUNDRIES INC.
Inventor: Veeraraghavan S. Basker , Keith H. Tabakman , Patrick D. Carpenter , Guillaume Bouche , Michael V. Aquilino
IPC: H01L29/40 , H01L29/66 , H01L21/336 , H01L23/535 , H01L29/78 , H01L29/417 , H01L21/768
CPC classification number: H01L23/535 , H01L21/76816 , H01L21/76841 , H01L21/76895 , H01L21/76897 , H01L23/485 , H01L29/41791 , H01L29/66795 , H01L29/785
Abstract: One aspect of the disclosure relates to an integrated circuit structure. The integrated circuit structure may include: a contact line being disposed within a dielectric layer and providing electrical connection to source/drain epitaxial regions surrounding a set of fins, the contact line including: a first portion of the contact line electrically isolated from a second portion of the contact line by a contact line spacer, wherein the first portion and the second portion each include a liner layer and a metal, the liner layer separating the metal from the dielectric layer and the source/drain epitaxial regions, and wherein the metal is directly in contact with the contact line spacer.
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公开(公告)号:US20130175547A1
公开(公告)日:2013-07-11
申请号:US13783526
申请日:2013-03-04
Inventor: Kevin K. Chan , Abhishek Dube , Eric C. Harley , Judson R. Holt , Viorel C. Ontalus , Kathryn T. Schonenberg , Matthew W. Stoker , Keith H. Tabakman , Linda R. Black
IPC: H01L29/78
CPC classification number: H01L29/7848 , H01L21/26586 , H01L21/823412 , H01L21/823425 , H01L21/823481 , H01L21/823807 , H01L21/823814 , H01L21/84 , H01L29/66628 , H01L29/66772 , H01L29/78618 , H01L29/78684
Abstract: A method for forming a field effect transistor device includes forming a gate stack portion on a substrate, forming a spacer portion on the gates stack portion and a portion of the substrate, removing an exposed portion of the substrate, epitaxially growing a first silicon material on the exposed portion of the substrate, removing a portion of the epitaxially grown first silicon material to expose a second portion of the substrate, and epitaxially growing a second silicon material on the exposed second portion of the substrate and the first silicon material.
Abstract translation: 一种用于形成场效应晶体管器件的方法,包括:在衬底上形成栅极叠层部分,在栅堆叠部分和衬底的一部分上形成间隔部分,去除衬底的暴露部分,将第一硅材料外延生长 衬底的暴露部分,去除外延生长的第一硅材料的一部分以暴露衬底的第二部分,以及在衬底的暴露的第二部分和第一硅材料上外延生长第二硅材料。
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