Proximity sensor connection mechanism

    公开(公告)号:US10461744B2

    公开(公告)日:2019-10-29

    申请号:US15711374

    申请日:2017-09-21

    Applicant: Google LLC

    Abstract: An electronic device includes: a display assembly including an electronic display configured to generate an optical image viewable from in front of the electronic device; a proximity sensor coupled to at least a portion of the display assembly, the proximity sensor including a sensing element configured to be responsive to presence of an object in front of the electronic device, the sensing element supported by a support structure having an upper surface facing a frontal direction of the electronic device; and a conductor that electrically connects the sensing element of the proximity sensor and the portion of the display assembly, the conductor including a conductive path extending along the support structure to the upper surface of the support structure.

    Camera Module Mounting in an Electronic Device

    公开(公告)号:US20190268513A1

    公开(公告)日:2019-08-29

    申请号:US16406438

    申请日:2019-05-08

    Applicant: Google LLC

    Abstract: An electronic device including a camera module is provided. In some embodiments, the electronic device includes a display device, a housing including an outer cover, and a camera module including an image sensor, a camera module circuit board, and an optical element. The outer cover defines a cavity, and the camera module is positioned at least partially within the cavity.

    Camera module mounting in an electronic device

    公开(公告)号:US10306114B2

    公开(公告)日:2019-05-28

    申请号:US15429233

    申请日:2017-02-10

    Applicant: Google LLC

    Abstract: An electronic device including a camera module is provided. In some embodiments, the electronic device includes a display device, a housing including an outer cover, and a camera module including an image sensor, a camera module circuit board, and an optical element. The outer cover defines a cavity, and the camera module is positioned at least partially within the cavity.

    Integrating a sensor into a flexible display circuit

    公开(公告)号:US10271425B1

    公开(公告)日:2019-04-23

    申请号:US16006425

    申请日:2018-06-12

    Applicant: Google LLC

    Abstract: Techniques, methods, systems, and other mechanisms are described for integrating a sensor into a flexible display circuit. In some implementations, a computing device includes a flexible printed circuit. The flexible printed circuit includes a first set of conductors that extend from a first end of the flexible printed circuit to a second end of the flexible printed circuit to connect a display layer of a display device to a processing device. The flexible printed circuit also includes a second set of conductors that at least partially define a sensor at a sensor portion of the flexible printed circuit that is between the first end of the flexible printed circuit and the second end of the flexible printed circuit.

    TRANSVERSE CIRCUIT BOARD TO ROUTE ELECTRICAL TRACES

    公开(公告)号:US20190098758A1

    公开(公告)日:2019-03-28

    申请号:US15716178

    申请日:2017-09-26

    Applicant: Google LLC

    Abstract: An electronic device including a transverse circuit board to route electrical traces is provided. In some embodiments, the electronic device includes: a housing; a first printed circuit board (PCB) that is fixed relative to the device housing; an integrated circuit that is connected to the first PCB; a second PCB that is situated in a transverse position relative to the first PCB, a plurality of electrical traces; and a securing component that secures the second PCB in the transverse position relative to the first PCB. Each respective electrical trace from the plurality of electrical traces includes: (i) a first portion that extends across the first PCB, between the integrated circuit and the second PCB, (ii) a second portion that extends across the second PCB, between the first PCB and either the first PCB or a third PCB, and (iii) a third portion that extends across either the first PCB or the third PCB, between the second PCB and a location other than the integrated circuit.

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