SIMULATED THERMAL VALUE MODIFICATIONS FOR 3D MODEL SECTIONS

    公开(公告)号:US20220092235A1

    公开(公告)日:2022-03-24

    申请号:US17417938

    申请日:2019-05-03

    Abstract: According to examples, an apparatus may include a processor and a memory on which are stored machine-readable instructions that when executed by the processor, may cause the processor access a thermal simulation of a three-dimensional (3D) model, the thermal simulation identifying thermal values simulated to occur across the 3D model during fabrication of a 3D part corresponding to the 3D model. The instructions may also cause the processor to determine a modification to be applied to first thermal values corresponding to a first section of the 3D model, in which the modification may increase accuracy of the first thermal values in the thermal simulation and to apply the determined modification to the first thermal values to generate a modified thermal simulation of the 3D model.

    THREE-DIMENSIONAL PRINTING
    17.
    发明申请

    公开(公告)号:US20210402684A1

    公开(公告)日:2021-12-30

    申请号:US17052870

    申请日:2019-03-21

    Abstract: Disclosed herein are kits, methods, systems, and compositions for threedimensional printing. In an example, disclosed herein is a multi-fluid kit for threedimensional printing comprising: a marking agent comprising a marking component which is a fluorescent color agent that is activated by ultraviolet radiation to emit light in the visible range of from about 400 nm to about 780 nm; a first fusing agent; a second fusing agent different from the first fusing agent; and a detailing agent.

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