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公开(公告)号:US20200282732A1
公开(公告)日:2020-09-10
申请号:US16763840
申请日:2018-07-13
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Judson M. Leiser , Peter R. Stokes , Mark A. Devries
IPC: B41J2/175
Abstract: A bag-in-box fluid supply may include a bag comprising a spout extending therefrom, the spout including a flange coupled to a surface of the bag and comprising a lip formed on the spout distal to the bag; a box formed around the bag to maintain the bag therein; a wedge to wedge a surface of the box between the lip and a surface of the bag; and a fluid interface to fluidically interface with the spout of the bag, the fluid interface including a fluidic channel and a collar disposed on a first end of the fluidic channel to secure the fluid interface to the spout.
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公开(公告)号:US20190111687A1
公开(公告)日:2019-04-18
申请号:US16217352
申请日:2018-12-12
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Brian J. Keefe , Joseph E. Scheffelin , James W. Ring , Mark A. Devries
Abstract: A fluid injection module may include a fluid ejection die, a die carrier, a bypass fluid passage in at least one pressure regulator. The fluid ejection die may include nozzle orifices on a front face of the die, first and second fluid passages extending through the die and a microchannel extending from the first fluid passage to the second fluid passage proximate the nozzle orifices to circulate fluid from the first fluid passage to the second fluid passage. Third and fourth fluid passages may extend through the die carrier. The bypass fluid passage may extend from the third fluid passage to the fourth fluid passage while being connected to the first fluid passage and the second fluid passage. The at least one pressure regulator is to induce pressure differential driven fluid flow across the microchannel and across the bypass fluid passage.
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公开(公告)号:US11254134B2
公开(公告)日:2022-02-22
申请号:US16764937
申请日:2018-07-13
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Judson M. Leiser , Mark A. Devries , Miquel Boleda Busquets
IPC: B41J2/175
Abstract: A fluid supply component for a replaceable fluid supply may include a channel fluidically coupled to a pliable fluid supply bag; a ball housed within the channel; and a gasket to prevent movement of the ball into the fluid supply bag; wherein the valve prevents fluid from entering the fluid supply bag while the fluid supply bag imparts a negative fluidic pressure.
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公开(公告)号:US20210370684A1
公开(公告)日:2021-12-02
申请号:US17285116
申请日:2018-12-12
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Mark A. Devries
IPC: B41J2/175
Abstract: An apparatus may include an electrical interface to access a memory. Based on data receivable from the memory, an actuator may allow fluid flow from a print fluid supply external to the apparatus to a print fluid reservoir of the apparatus.
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公开(公告)号:US10654275B2
公开(公告)日:2020-05-19
申请号:US16217352
申请日:2018-12-12
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Brian J. Keefe , Joseph E. Scheffelin , James W. Ring , Mark A. Devries
Abstract: A fluid injection module may include a fluid ejection die, a die carrier, a bypass fluid passage in at least one pressure regulator. The fluid ejection die may include nozzle orifices on a front face of the die, first and second fluid passages extending through the die and a microchannel extending from the first fluid passage to the second fluid passage proximate the nozzle orifices to circulate fluid from the first fluid passage to the second fluid passage. Third and fourth fluid passages may extend through the die carrier. The bypass fluid passage may extend from the third fluid passage to the fourth fluid passage while being connected to the first fluid passage and the second fluid passage. The at least one pressure regulator is to induce pressure differential driven fluid flow across the microchannel and across the bypass fluid passage.
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公开(公告)号:US10507662B2
公开(公告)日:2019-12-17
申请号:US16125745
申请日:2018-09-09
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Brian J. Keefe , Joseph E. Scheffelin , James W. Ring , Mark A. Devries
Abstract: A print module may include a printhead die. The printhead die may include a chamber layer having ink chambers and micro-channels formed in the chamber layer. The print module may further include a die carrier including manifold passages through which ink flows to and from the printhead die and dual pressure regulators to flow fluid through the micro-channels of the printhead die.
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公开(公告)号:US20190001686A1
公开(公告)日:2019-01-03
申请号:US16125745
申请日:2018-09-09
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Brian J. Keefe , Joseph E. Scheffelin , James W. Ring , Mark A. Devries
CPC classification number: B41J2/17 , B41J2/175 , B41J2/17563 , B41J2/17596 , B41J2/18 , B41J29/38
Abstract: A print module may include a printhead die. The printhead die may include a chamber layer having ink chambers and micro-channels formed in the chamber layer. The print module may further include a die carrier including manifold passages through which ink flows to and from the printhead die and dual pressure regulators to flow fluid through the micro-channels of the printhead die.
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公开(公告)号:US10071557B2
公开(公告)日:2018-09-11
申请号:US15260044
申请日:2016-09-08
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Rhonda L. Wilson , Mark A. Devries
CPC classification number: B41J2/17523 , B41J2/045 , B41J2/175 , B41J2/17563 , B41J2002/17516
Abstract: In one example implementation, a printhead assembly includes a fluid intake section, a fluid interconnect integrated with the fluid intake section to receive fluid from an ink supply assembly, and an air-permeable, fluid-resistant, fluid interconnect cover installed over the fluid interconnect.
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