公开(公告)号：US07638781B2

公开(公告)日：2009-12-29

申请号：US11860333

申请日：2007-10-22

申请人： Steven R. Walther ,  Harold M. Persing

发明人： Steven R. Walther ,  Harold M. Persing

IPC分类号： A61N5/00

CPC分类号： H01J37/3299 ,  H01J37/32449 ,  H01J37/32935

摘要： A plasma processing system includes a process chamber, a source configured to generate a plasma in the process chamber, a platen configured to support a workpiece in the process chamber, and a pressure sensor positioned adjacent to the workpiece. The pressure sensor is configured to monitor a local pressure adjacent to the workpiece. A method includes generating a plasma in a process chamber, supporting a workpiece in the process chamber, and monitoring a local pressure adjacent to the workpiece with a pressure sensor positioned adjacent to the workpiece.

摘要翻译： 等离子体处理系统包括处理室，被配置为在处理室中产生等离子体的源，被配置为支撑处理室中的工件的压板和邻近工件定位的压力传感器。 压力传感器被配置为监测邻近工件的局部压力。 一种方法包括在处理室中产生等离子体，在处理室中支撑工件，并用邻近工件定位的压力传感器监测与工件相邻的局部压力。

公开(公告)号：US20090101848A1

公开(公告)日：2009-04-23

申请号：US11860333

申请日：2007-10-22

申请人： Steven R. Walther ,  Harold M. Persing

发明人： Steven R. Walther ,  Harold M. Persing

IPC分类号： G21K5/00

CPC分类号： H01J37/3299 ,  H01J37/32449 ,  H01J37/32935

摘要： A plasma processing system includes a process chamber, a source configured to generate a plasma in the process chamber, a platen configured to support a workpiece in the process chamber, and a pressure sensor positioned adjacent to the workpiece. The pressure sensor is configured to monitor a local pressure adjacent to the workpiece. A method includes generating a plasma in a process chamber, supporting a workpiece in the process chamber, and monitoring a local pressure adjacent to the workpiece with a pressure sensor positioned adjacent to the workpiece.

摘要翻译： 等离子体处理系统包括处理室，被配置为在处理室中产生等离子体的源，被配置为支撑处理室中的工件的压板和邻近工件定位的压力传感器。 压力传感器被配置为监测邻近工件的局部压力。 一种方法包括在处理室中产生等离子体，在处理室中支撑工件，并用邻近工件定位的压力传感器监测与工件相邻的局部压力。

公开(公告)号：US07615748B2

公开(公告)日：2009-11-10

申请号：US11860696

申请日：2007-09-25

申请人： Steven R. Walther ,  Harold M. Persing

发明人： Steven R. Walther ,  Harold M. Persing

IPC分类号： G01J5/10

CPC分类号： H01L21/67253

摘要： A workpiece processing system includes a platen configured to support a workpiece, a source configured to provide an electromagnetic wave proximate a front surface of the workpiece, and a detector. The detector is configured to receive at least a portion of the electromagnetic wave and provide a detection signal representative of an outgassing rate from the workpiece of outgassing byproducts. A method of detecting an outgassing rate is also provided. The method includes providing an electromagnetic wave proximate a front surface of a workpiece, receiving at least a portion of the electromagnetic wave, and providing a detection signal representative of an outgassing rate from the workpiece of outgassing byproducts.

摘要翻译： 工件处理系统包括被配置为支撑工件的压板，被配置为提供靠近工件前表面的电磁波的源和检测器。 检测器被配置为接收电磁波的至少一部分并且提供表示来自除气副产物的工件的除气速率的检测信号。 还提供了一种检测排气速率的方法。 该方法包括在工件的前表面附近提供电磁波，接收电磁波的至少一部分，以及提供代表来自除气副产物的工件的除气速率的检测信号。