公开(公告)号：US12085840B2

公开(公告)日：2024-09-10

申请号：US17871533

申请日：2022-07-22

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Sen Wang ,  Jian Shi ,  Zhi Yuan ,  Weidong Tang ,  Along Zhou ,  Chenhan Liu

IPC: G03B17/55 ,  G03B30/00 ,  H04N23/52 ,  H04N23/54 ,  H04N23/55

CPC classification number: G03B17/55 ,  G03B30/00 ,  H04N23/52 ,  H04N23/54 ,  H04N23/55

Abstract: A camera assembly is provided. The camera assembly includes an auxiliary mount, a rotatable camera module and a flexible heat conducting assembly, the rotatable camera module includes a rotatable mount and a camera function group disposed on the rotatable mount, the rotatable mount is rotatably connected to the auxiliary mount, the flexible heat conducting assembly is fixedly connected to one end of the camera function group, and the flexible heat conducting assembly is further configured to be connected to a non-rotatable camera module component, so that heat generated by the camera function group is transferred to the non-rotatable camera module component. A flexible heat conducting assembly performs a cross-region transfer of heat generated by the rotatable camera module, to help reduce an ambient temperature of the rotatable camera module, so as to improve photography quality of the camera module, and prolong a photography time period of the rotatable camera module.

公开(公告)号：US20250102234A1

公开(公告)日：2025-03-27

申请号：US18973801

申请日：2024-12-09

Applicant: Huawei Technologies Co., Ltd.

Inventor： Jun Zhang ,  Qiang Hu ,  Liujun Zou ,  Jian Shi ,  Chenxi Feng

IPC: F28D15/04 ,  F28D15/02

Abstract: A vapor chamber includes a housing, a capillary structure, and a working fluid. Both the capillary structure and the working fluid are located in the housing. An area of a surface of the capillary structure in contact with an inner surface of the housing is less than an area of the inner surface. The housing has a cavity. The working fluid in a liquid state is located in the capillary structure. The working fluid in a gaseous state is located in the cavity. The housing includes a first region and a second region. The capillary structure includes a first part located in the first region and a second part located in the second region. The second part includes a trunk structure and a branch structure.

公开(公告)号：US20240164056A1

公开(公告)日：2024-05-16

申请号：US18550265

申请日：2022-03-11

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Huipeng Wu ,  Xinpei Huang ,  Tao Liu ,  Along Zhou ,  Jian Shi

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20272 ,  G06F1/203 ,  H05K7/20254

Abstract: This application relates to the field of liquid cooling technologies, and provides a gas collection apparatus, configured to collect bubbles generated due to loss of a working medium in a liquid cooling apparatus. The gas collection apparatus includes a cooling plate. The cooling plate includes at least one gas collection structure disposed inside the cooling plate, a first flow channel disposed inside the cooling plate, a second flow channel disposed inside the gas collection structure, and at least one connecting channel configured to connect the first flow channel and the second flow channel. The at least one connecting channel is configured to transfer, to the second flow channel, bubbles carried when the working medium flows in the first flow channel. The at least one gas collection structure is configured to collect the bubbles from the second flow channel.

公开(公告)号：US20220183146A1

公开(公告)日：2022-06-09

申请号：US17598530

申请日：2020-03-27

Applicant: Huawei Technologies Co., Ltd.

Inventor： Zhi Yuan ,  Guo Yang ,  Jian Shi ,  Linfang Jin ,  Zhen Xu

IPC: H05K1/02

Abstract: In an electronic device, a circuit board connects different systems or structures such that heat of a system with a relatively large amount of heat can be transferred to a position or a heat dissipation structure with a relatively small amount of heat, thereby mitigating local high temperatures in the electronic device and distributing heat more evenly throughout the electronic device.

公开(公告)号：US09328971B2

公开(公告)日：2016-05-03

申请号：US13731457

申请日：2012-12-31

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Jian Shi ,  Bjorn Gudmundsson ,  Wangjun Wu

IPC: H01L23/473 ,  F28F9/00 ,  H04B1/036 ,  H05K7/20

CPC classification number: F28F9/00 ,  H01L23/473 ,  H01L2924/0002 ,  H04B1/036 ,  H05K7/20218 ,  H05K7/20254 ,  H01L2924/00

Abstract: The invention relates to a liquid cooling system comprising a cooling unit and a liquid loop in which the liquid is arranged to be conveyed from a supply outlet of the cooling unit to a radio unit where the liquid is arranged to cool the radio unit before being conveyed back in the liquid loop to a return inlet of the cooling unit, the cooling unit being arranged located at a distance from the radio unit, wherein the cooling unit is an expandable cooling unit comprising a secondary outlet and a secondary inlet where, when an additional cooling unit of the liquid cooling system is connected with an inlet to said secondary outlet and with an outlet to said secondary inlet, the liquid is arranged to be fed from the cooling unit through the secondary outlet to the additional cooling unit arranged to also cool the liquid.

Abstract translation: 本发明涉及一种液体冷却系统，其包括冷却单元和液体回路，其中液体被布置成从冷却单元的供应出口传送到无线电单元，其中液体被布置成在被传送之前冷却无线电单元 将液体回路返回到冷却单元的返回入口，冷却单元布置成距离无线电单元一定距离，其中冷却单元是包括次级出口和次级入口的可扩展冷却单元，其中当附加 液体冷却系统的冷却单元与所述次级出口的入口连接，并且与出口连接到所述次级入口，液体被布置成从冷却单元通过次级出口供给到另外的冷却单元， 液体。