公开(公告)号：US09451725B2

公开(公告)日：2016-09-20

申请号：US14828321

申请日：2015-08-17

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yuping Hong ,  Chenglong Wang ,  Mingliang Hao ,  Youhe Ke

IPC: H05K7/20 ,  H04B1/036

CPC classification number: H05K7/20145 ,  H04B1/036 ,  H05K7/20572

Abstract: A communications product, including at least one RRU and a fan assembly, where the fan assembly is independent of the at least one RRU, and is disposed side by side with the at least one RRU, an air duct is disposed between the fan assembly and the RRU, and an airflow passes, from the fan assembly, through the air duct, and arrives at the at least one RRU, to dissipate heat of the at least one RRU. The communications product of the present disclosure can ensure a heat-dissipation capability, and also can allow the RRU to be small in size. The present disclosure further provides a base station system that includes the communications product.

Abstract translation: 一种通信产品，包括至少一个RRU和风扇组件，其中所述风扇组件独立于所述至少一个RRU，并且与所述至少一个RRU并排设置，风道布置在所述风扇组件和 RRU，并且气流从风扇组件通过空气管道，并到达至少一个RRU，以消散至少一个RRU的热量。 本公开的通信产品可以确保散热能力，并且还可以允许RRU的尺寸小。 本公开还提供了一种包括通信产品的基站系统。

公开(公告)号：US20150092341A1

公开(公告)日：2015-04-02

申请号：US14562529

申请日：2014-12-05

Applicant: Huawei Technologies Co., Ltd.

Inventor： Lianjun Liu ,  Youhe Ke ,  Chengpeng Yang

IPC: G06F1/18

CPC classification number: G06F1/187

Abstract: Disclosed are an optical disc drive installation mechanism, and an outer frame for installing an optical disc drive. The optical disc drive installation mechanism includes: an optical disc drive module and an outer frame which is configured to insert or pull out the optical disc drive module, and a buckle is connected to a side surface of the optical disc drive module; a buckle limiting hole is disposed on a first side surface of the outer frame; and a groove is further disposed on an outer wall on the first side surface of the outer frame, a fixedly connected spacing elastomer is disposed on an inner wall on a second side surface of the outer frame, the spacing elastomer and the first elastic part are configured to lock or unlock the optical disc drive module, and a first side surface is perpendicular to the second side surface.

Abstract translation: 公开了一种光盘驱动器安装机构和用于安装光盘驱动器的外框架。 光盘驱动器安装机构包括：光盘驱动模块和外框，其被配置为插入或拉出光盘驱动模块，并且带扣连接到光盘驱动模块的侧表面; 带扣限制孔设置在外框的第一侧表面上; 并且在外框的第一侧面的外壁上还设置有槽，在外框的第二侧面的内壁上设置有固定连接的间隔弹性体，间隔弹性体和第一弹性部为 被配置为锁定或解锁光盘驱动器模块，并且第一侧表面垂直于第二侧表面。

公开(公告)号：US20140352928A1

公开(公告)日：2014-12-04

申请号：US14462810

申请日：2014-08-19

Applicant: Huawei Technologies Co., Ltd.

Inventor： Shuliang Huang ,  Zhaoxia Luo ,  Youhe Ke

IPC: H05K7/20

CPC classification number: H05K7/20236 ,  H05K7/20772

Abstract: An electronic device and a heat dissipation system and heat dissipation method are provided that can be used in combination with a common heat exchange/refrigerating electronic device, thereby reducing an investment cost. The heat dissipation system of an electronic device includes a cooling pool, a heat exchanger, and at least one circulating pump, where a cooling medium is provided in the cooling pool, and the electronic device and the heat exchanger are immersed in the cooling medium; the circulating pump is configured to drive the cooling medium to circulatively flow between the electronic device and the heat exchanger; and a heat exchange medium is provided in the heat exchanger and used to exchange heat with the cooling medium, and the heat exchange medium flows out of the heat exchanger for cooling and then flows back, so as to discharge heat released by the electronic device.

Abstract translation: 本发明提供一种电子设备和散热系统及散热方法，其可以与普通的热交换/制冷电子设备结合使用，从而降低了投资成本。 电子设备的散热系统包括冷却池，热交换器和至少一个循环泵，其中在冷却池中设置冷却介质，电子设备和热交换器浸入冷却介质中; 循环泵构造成驱动冷却介质循环地在电子设备和热交换器之间流动; 并且在热交换器中设置有热交换介质，用于与冷却介质进行热交换，并且热交换介质流出热交换器进行冷却，然后流回，从而排出由电子设备释放的热量。

公开(公告)号：US20140071625A1

公开(公告)日：2014-03-13

申请号：US14081654

申请日：2013-11-15

Applicant: Huawei Technologies Co., Ltd.

Inventor： Zhaoxia Luo ,  Shuliang Huang ,  Youhe Ke ,  Liqian Zhai

IPC: H05K7/20

CPC classification number: H05K7/20236 ,  H05K7/20272

Abstract: Embodiments of the present invention provide an immersion cooling system, including: an electronic device, a non-conductive working medium, and one or more gasbags. The electronic device is immersed in the non-conductive working medium; the non-conductive working medium is configured to dissipate heat for the electronic device, and a volume of the non-conductive working medium expands as a temperature rises; and a surface of the gasbag is elastic, and the gasbag is configured to reduce its volume when the gasbag is compressed by volume expansion of the non-conductive working medium, so as to buffer a pressure rise in the system, where the pressure rise is caused by the volume expansion of the non-conductive working medium. With the immersion cooling system provided in the embodiments of the present invention, installation is more flexible and cooling performance of the system is further improved.

Abstract translation: 本发明的实施例提供了一种浸没冷却系统，包括：电子装置，非导电工作介质和一个或多个气囊。 电子器件浸没在非导电工作介质中; 非导电工作介质被配置为耗散用于电子设备的热量，并且一部分非导电工作介质的体积随温度升高而膨胀; 并且所述气囊的表面是弹性的，并且所述气囊被构造成当所述气囊被所述非导电工作介质的体积膨胀压缩时减小其体积，以缓冲所述系统中的压力升高，其中所述压力升高为 这是由非导电工作介质的体积膨胀引起的。 利用在本发明的实施例中提供的浸入式冷却系统，安装更加灵活，进一步提高了系统的冷却性能。