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    Linkage Apparatus for Plugging PCB Board
    2.
    发明申请
    Linkage Apparatus for Plugging PCB Board 有权
    插入PCB板的连接装置

    公开(公告)号：US20150017828A1

    公开(公告)日：2015-01-15

    申请号：US14472744

    申请日：2014-08-29

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Shuang Li ,  Jun Zhao ,  Chengpeng Yang

    IPC: H01R13/629

    CPC classification number: H01R13/62988 ,  G06F1/185 ,  G06F1/186 ,  H01R13/629

    Abstract: A linkage apparatus is provided. The linkage apparatus is disposed between a bottom plate and a carrier plate, and the linkage apparatus includes a drag link and an “L” shape swing link. The drag link is rotatably connected to an end of the “L” shape swing link, and the drag link and the bottom plate are connected to a fixing pin by using a horizontal guide groove; a corner in the middle of the swing link is rotatably connected to the bottom plate, and another end is fastened to the carrier plate; another fixing pin connects the bottom plate and the carrier plate. The swing link is driven by the drag link, so that the carrier plate can be driven to vertically move. Therefore, hot plugging of a peripheral component interconnect (PCI) express card fastened on the carrier plate and plugging of another printed circuit board (PCB) that requires two-dimensional plugging can be implemented without interrupting a power supply.

    Abstract translation: 提供了一种联动装置。 联动装置设置在底板和承载板之间，联动装置包括牵引连杆和“L”形摆动连杆。 牵引连杆可旋转地连接到“L”型摆动连杆的端部，牵引连杆和底板通过使用水平导向槽连接到固定销; 摆动连杆中间的角部可旋转地连接到底板，另一端紧固到承载板上; 另一个固定销连接底板和承载板。 摆动连杆由牵引杆驱动，从而可以驱动托板垂直移动。 因此，可以在不中断电源的情况下实现固定在承载板上的外围部件互连（PCI）快速卡的热插拔和需要二维插入的另一印刷电路板（PCB）的插入。

    Linkage apparatus for plugging PCB board
    3.
    发明授权
    Linkage apparatus for plugging PCB board 有权
    用于插入PCB板的连接装置

    公开(公告)号：US09373914B2

    公开(公告)日：2016-06-21

    申请号：US14472744

    申请日：2014-08-29

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Shuang Li ,  Jun Zhao ,  Chengpeng Yang

    IPC: H05K5/00 ,  H01R13/629 ,  G06F1/18

    CPC classification number: H01R13/62988 ,  G06F1/185 ,  G06F1/186 ,  H01R13/629

    Abstract: A linkage apparatus is provided. The linkage apparatus is disposed between a bottom plate and a carrier plate, and the linkage apparatus includes a drag link and an “L” shape swing link. The drag link is rotatably connected to an end of the “L” shape swing link, and the drag link and the bottom plate are connected to a fixing pin by using a horizontal guide groove; a corner in the middle of the swing link is rotatably connected to the bottom plate, and another end is fastened to the carrier plate; another fixing pin connects the bottom plate and the carrier plate. The swing link is driven by the drag link, so that the carrier plate can be driven to vertically move. Therefore, hot plugging of a peripheral component interconnect (PCI) express card fastened on the carrier plate and plugging of another printed circuit board (PCB) that requires two-dimensional plugging can be implemented without interrupting a power supply.

    Abstract translation: 提供了一种联动装置。 联动装置设置在底板和承载板之间，联动装置包括牵引连杆和“L”形摆动连杆。 牵引连杆可旋转地连接到“L”型摆动连杆的端部，牵引连杆和底板通过使用水平导向槽连接到固定销; 摆动连杆中间的角部可旋转地连接到底板，另一端紧固到承载板上; 另一个固定销连接底板和承载板。 摆动连杆由牵引杆驱动，从而可以驱动托板垂直移动。 因此，可以在不中断电源的情况下实现固定在承载板上的外围部件互连（PCI）快速卡的热插拔和需要二维插入的另一印刷电路板（PCB）的插入。

    OPTICAL DISC DRIVE INSTALLATION MECHANISM, AND OUTER FRAME FOR INSTALLING OPTICAL DISC DRIVE
    4.
    发明申请
    OPTICAL DISC DRIVE INSTALLATION MECHANISM, AND OUTER FRAME FOR INSTALLING OPTICAL DISC DRIVE 有权
    光盘驱动器安装机构和外框安装光盘驱动器

    公开(公告)号：US20150092341A1

    公开(公告)日：2015-04-02

    申请号：US14562529

    申请日：2014-12-05

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Lianjun Liu ,  Youhe Ke ,  Chengpeng Yang

    IPC: G06F1/18

    CPC classification number: G06F1/187

    Abstract: Disclosed are an optical disc drive installation mechanism, and an outer frame for installing an optical disc drive. The optical disc drive installation mechanism includes: an optical disc drive module and an outer frame which is configured to insert or pull out the optical disc drive module, and a buckle is connected to a side surface of the optical disc drive module; a buckle limiting hole is disposed on a first side surface of the outer frame; and a groove is further disposed on an outer wall on the first side surface of the outer frame, a fixedly connected spacing elastomer is disposed on an inner wall on a second side surface of the outer frame, the spacing elastomer and the first elastic part are configured to lock or unlock the optical disc drive module, and a first side surface is perpendicular to the second side surface.

    Abstract translation: 公开了一种光盘驱动器安装机构和用于安装光盘驱动器的外框架。 光盘驱动器安装机构包括：光盘驱动模块和外框，其被配置为插入或拉出光盘驱动模块，并且带扣连接到光盘驱动模块的侧表面; 带扣限制孔设置在外框的第一侧表面上; 并且在外框的第一侧面的外壁上还设置有槽，在外框的第二侧面的内壁上设置有固定连接的间隔弹性体，间隔弹性体和第一弹性部为 被配置为锁定或解锁光盘驱动器模块，并且第一侧表面垂直于第二侧表面。

    Method, Apparatus, and System for Dissipating Heat of Memory with Liquid Cooling
    5.
    发明申请
    Method, Apparatus, and System for Dissipating Heat of Memory with Liquid Cooling 审中-公开
    用液体冷却消耗记忆热的方法，装置和系统

    公开(公告)号：US20130342987A1

    公开(公告)日：2013-12-26

    申请号：US14015766

    申请日：2013-08-30

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Chengpeng Yang ,  Yaofeng Peng

    IPC: G06F1/20

    CPC classification number: G06F1/20 ,  G06F2200/201 ,  H01L23/40 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An apparatus can be used to dissipate heat from a memory with liquid cooling. A liquid-cooling block is disposed on a main board such that the liquid-cooling block is adjacent to a memory slot. The liquid-cooling block includes a metal block, metal spring leaves fixed on two sides of the metal block, and a liquid channel that penetrates through the metal block. The metal spring leaves are configured to contact a memory bank in the memory slot and conduct heat that is generated during operation of the memory bank to the metal block. A liquid inlet pipe and a liquid outlet pipe are installed on the main board and located at two ends of the liquid-cooling block in a manner such that cooling liquid can enter the liquid-cooling block via the liquid inlet pipe and exit the liquid-cooling block via the outlet pipe to form a cooling liquid loop.

    Abstract translation: 可以使用一种装置来从具有液体冷却的存储器中散热。 液体冷却块设置在主板上，使得液冷块与存储槽相邻。 液体冷却块包括金属块，固定在金属块的两侧的金属弹簧叶片和穿过金属块的液体通道。 金属弹簧叶片被配置为接触存储器插槽中的存储体，并将在存储器组的操作期间产生的热量传导到金属块。 液体入口管和液体出口管安装在主板上，位于液冷块的两端，冷却液可以经由液体入口管进入液冷块并离开液 - 冷却块通过出口管形成冷却液回路。

    Flow-guiding apparatus and electronic device including the flow-guiding apparatus
    7.
    发明授权
    Flow-guiding apparatus and electronic device including the flow-guiding apparatus 有权
    流动引导装置和包括流动引导装置的电子装置

    公开(公告)号：US09521765B2

    公开(公告)日：2016-12-13

    申请号：US13685396

    申请日：2012-11-26

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Yaofeng Peng ,  Chengpeng Yang

    IPC: H05K5/00 ,  H05K5/02 ,  G06F1/20 ,  H05K7/20

    CPC classification number: H05K5/0213 ,  G06F1/20 ,  H05K7/20172

    Abstract: The present invention is applicable to the technical field of heat-radiation structures and discloses a flow-guiding apparatus and an electronic device including the flow-guiding apparatus. The flow-guiding apparatus includes a support and flow-guiding members for guiding an air flow generated by an axial fan to a directed area, where the flow-guiding members are connected to the support, at least two flow-guiding members are arranged and are located on both sides of a hub of the axial fan or around the hub of the axial fan, and the flow-guiding members tilt toward the hub of the axial fan along an air-blowing direction of the axial fan. The electronic device includes a chassis, where the chassis is provided with an air vent, an axial fan is arranged at the air vent, and an air outlet of the axial fan is arranged with a flow-guiding apparatus mentioned above.

    Abstract translation: 本发明可应用于散热结构的技术领域，并且公开了一种流动引导装置和包括流动引导装置的电子装置。 流动引导装置包括用于将由轴流风扇产生的空气流引导到引导构件连接到支撑件的定向区域的支撑件和流动引导构件，至少布置有两个导流构件， 位于轴流风扇的轮毂的两侧或轴流风扇的轮毂周围，并且导流构件沿着轴流风扇的吹风方向朝向轴流风扇的轮毂倾斜。 电子设备包括底盘，其中底盘设有通气口，排气孔处设有轴流风扇，轴流风扇的出风口配有上述的导流装置。

    Panel for ventilation and noise reduction and manufacturing method
    8.
    发明授权
    Panel for ventilation and noise reduction and manufacturing method 有权
    通风和降噪面板及制造方法

    公开(公告)号：US09326427B2

    公开(公告)日：2016-04-26

    申请号：US14549769

    申请日：2014-11-21

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Baosheng Li ,  Jun Zhao ,  Chengpeng Yang

    IPC: H05K7/20 ,  B21D35/00 ,  H05K5/02 ,  F24F7/00 ,  F24F13/24

    CPC classification number: H05K7/20709 ,  B21D35/001 ,  F24F7/00 ,  F24F13/24 ,  H05K5/0213 ,  H05K7/20736 ,  Y10T29/4957

    Abstract: A panel for ventilation and noise reduction and its manufacturing method are disclosed. A left side and a right side of the panel each include one or a plurality of ventilation holes, and a sound insulation board for sound insulation is set near each ventilation hole along an inner side of the panel, so that at least certain sound from the inner of the electronic device needs to bypass the board to pass through the ventilation holes; and the ventilation hole on the left side and the right side of the panel are opened in a staggered position, so that when the panel is placed side by side with another panel, air exhausted from a ventilation hole at an adjacent side of the panel does not form strong face-to-face blowing interference with air exhausted from a ventilation hole at an adjacent side of another panel.

    Abstract translation: 公开了一种用于通风和降噪的面板及其制造方法。 面板的左侧和右侧均包括一个或多个通风孔，并且隔声隔音板沿着面板的内侧设置在每个通气孔附近，使得至少一些来自 电子设备的内部需要绕过电路板通过通风孔; 并且面板的左侧和右侧的通风孔以交错位置打开，使得当面板与另一个面板并排放置时，从面板相邻侧的通风孔排出的空气 不会对从另一个面板的相邻侧的通风孔排出的空气形成强烈的面对面吹风干扰。

    CHIP PACKAGE STRUCTURE AND ELECTRONIC DEVICE
    9.
    发明公开
    CHIP PACKAGE STRUCTURE AND ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20240071859A1

    公开(公告)日：2024-02-29

    申请号：US18492967

    申请日：2023-10-24

    Applicant: HUAWEI TECHNOLOGIES CO., LTD.

    Inventor： Zelong Jiao ,  Chungang Li ,  Chengpeng Yang

    IPC: H01L23/367 ,  H01L23/00

    CPC classification number: H01L23/3675 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29191 ,  H01L2224/29193 ,  H01L2924/0715

    Abstract: A chip package structure is provided and includes a PCB, a chip, a package cover, a thermal interface material layer, and a heat sink. The chip is welded to the PCB. The package cover is disposed on the PCB. The chip is packaged in the package cover. The thermal interface material layer covers the chip, and is attached to an inner top surface of the package cover. The heat sink is disposed on the PCB. An assembly space is formed between the heat sink and the PCB. The heat sink includes a contact plate. A lower end face of the contact plate abuts against an outer top surface of the package cover. A projection of the abutting member in a height direction of the chip package structure covers the chip, and is located in a region enclosed by an edge of the outer top surface of the package cover.

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