公开(公告)号：US20080079128A1

公开(公告)日：2008-04-03

申请号：US11855951

申请日：2007-09-14

申请人： Hyo-Jae BANG ,  Seong-Chan HAN ,  Hun HAN ,  Dong-Chun LEE

发明人： Hyo-Jae BANG ,  Seong-Chan HAN ,  Hun HAN ,  Dong-Chun LEE

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49582 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/0002 ,  H01L2924/00

摘要： A lead frame type stack package in which a lead of the package is well connected to a semiconductor module, and a method of fabricating the same are provided. A lead of an upper package and a lead of a lower package are connected using laser soldering. Since leads of the upper and lower packages are connected by solder balls without the use of a soldering pot, loss of a plating layer of the lead due to solder dipping is prevented and the leads are well connected without soldering defects when connecting the lead of the lower package to a connection pad of a semiconductor module substrate.

摘要翻译： 一种引线框架型堆叠封装，其中封装的引线与半导体模块良好连接，并提供其制造方法。 使用激光焊接连接上封装的引线和下封装的引线。 由于上，下封装的引线通过焊锡球连接而不使用焊锡锅，因此防止了由焊料浸渍引起的引线的镀层损失，并且当连接引线 下封装到半导体模块基板的连接焊盘。