公开(公告)号：US20220110210A1

公开(公告)日：2022-04-07

申请号：US17488769

申请日：2021-09-29

Applicant: IBIDEN CO., LTD.

Inventor： Haruhiko MORITA ,  Hitoshi MIWA ,  Shinobu KATO ,  Toshihiko YOKOMAKU ,  Hisashi KATO ,  Takahisa HIRASAWA ,  Tetsuya MURAKI ,  Takayuki FURUNO

IPC: H05K1/02 ,  H02K3/04 ,  H05K1/18

Abstract: A coil substrate includes a first flexible substrate, a coil formed on the first flexible substrate, a second flexible substrate extending from the first flexible substrate, and a wiring that is formed on the second flexible substrate and is electrically connected to the coil formed on the first flexible substrate. The second flexible substrate includes a first portion extending from the first flexible substrate and a second portion extending from the first portion such that the second portion is formed along the first flexible substrate and that the second flexible substrate forms a gap between the second portion and the first flexible substrate.

公开(公告)号：US20220069657A1

公开(公告)日：2022-03-03

申请号：US17407900

申请日：2021-08-20

Applicant: IBIDEN CO., LTD.

Inventor： Haruhiko MORITA ,  Hitoshi MIWA ,  Shinobu KATO ,  Toshihiko YOKOMAKU ,  Hisashi KATO ,  Takahisa HIRASAWA ,  Tetsuya MURAKI ,  Takayuki FURUNO

IPC: H02K3/26

Abstract: A coil substrate includes a flexible substrate having a first end and a second end on the opposite side with respect to the first end, and coils formed on the flexible substrate in substantially one row between the first end and the second end of the flexible substrate such that each of the coils has a center space and wirings surrounding the center space. The wirings in each of the coils include parallel wirings formed substantially parallel to a row direction extending from the first end toward the second end and perpendicular wirings formed substantially perpendicular to the row direction, and the coils are formed such that a thickness of the perpendicular wirings is greater than a thickness of the parallel wirings.

公开(公告)号：US20220060074A1

公开(公告)日：2022-02-24

申请号：US17386957

申请日：2021-07-28

Applicant: IBIDEN CO., LTD.

Inventor： Haruhiko MORITA ,  Hitoshi MIWA ,  Shinobu KATO ,  Toshihiko YOKOMAKU ,  Hisashi KATO ,  Takahisa HIRASAWA ,  Tetsuya MURAKI ,  Takayuki FURUNO

IPC: H02K3/26

Abstract: A coil substrate includes a flexible substrate, and coils formed on the flexible substrate such that the coils are positioned substantially in a raw and that each coil has a center space and wirings surrounding the center space. The coils are formed such that each coil includes first wirings on a first surface of the flexible substrate, second wirings on a second surface of the flexible substrate on the opposite side with respect to the first surface, and via conductors penetrating through the flexible substrate and connecting the first and second wirings, and the coils are positioned such that a m-th coil has the second wirings positioned below the center space of a (m+1)-th coil and that a (m+2)-th coil has the first coils positioned on the center space of a (m+1)-th coil, where in is an integer equal to or greater than 1.

公开(公告)号：US20200287452A1

公开(公告)日：2020-09-10

申请号：US16804026

申请日：2020-02-28

Applicant: IBIDEN CO., LTD.

Inventor： Haruhiko MORITA ,  Hitoshi MIWA ,  Shinobu KATO ,  Toshihiko YOKOMAKU ,  Hisashi KATO ,  Takahisa HIRASAWA ,  Tetsuya MURAKI ,  Takayuki FURUNO

IPC: H02K23/30 ,  H02K3/26 ,  H02K3/28

Abstract: A motor coil substrate includes a coil substrate including a flexible substrate and multiple coils formed on the flexible substrate such that the coils are extending from a first end toward a second end on the opposite side with respect to the first end. The flexible substrate includes inner peripheral and outer peripheral flexible substrates such that the coils include outer peripheral coils formed on the outer peripheral flexible substrate and inner peripheral coils formed on the inner peripheral flexible substrate, that a number of the outer peripheral coils and a number of the inner peripheral coils are L, that an m-th outer peripheral coil of the outer peripheral coils is positioned on a m-th inner peripheral coil of the inner peripheral coils, and that the m-th outer peripheral coil and the m-th inner peripheral coil are connected to each other in parallel, where L and m are natural numbers.

公开(公告)号：US20200075224A1

公开(公告)日：2020-03-05

申请号：US16555194

申请日：2019-08-29

Applicant: IBIDEN CO., LTD.

Inventor： Haruhiko MORITA ,  Hitoshi MIWA ,  Shinobu KATO ,  Toshihiko YOKOMAKU ,  Hisashi KATO ,  Takahisa HIRASAWA ,  Tetsuya MURAKI ,  Takayuki FURUNO

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/06

Abstract: A planar transfoinier includes a flexible insulating substrate having a pair of short sides, a pair of long sides, a first surface, and a second surface on an opposite side with respect to the first surface, multiple coils formed side by side on the first surface and second surface of the flexible insulating substrate such that each of the coils has a spiral-shaped wiring, and multiple terminals formed on the flexible insulating substrate and connected to the coils respectively such that the terminals are positioned in a center portion of the flexible insulating substrate formed close to a center of the long sides of the flexible insulating substrate. The flexible insulating substrate has multiple bending portions formed such that the flexible insulating substrate is folded at the bending portions and stacks the coils one another.