公开(公告)号：US11322301B2

公开(公告)日：2022-05-03

申请号：US16850470

申请日：2020-04-16

Applicant: IBIDEN CO., LTD.

Inventor： Hiroaki Kodama ,  Kazuro Nishiwaki ,  Kazuhiko Kuranobu ,  Hiroaki Uno

IPC: H01F41/04 ,  H01F27/28 ,  H01L21/48 ,  H01L23/498 ,  H01L23/552 ,  H01L49/02 ,  H05K3/42

Abstract: A method for manufacturing an inductor built-in substrate includes forming openings in a core substrate including a resin substrate and a metal foil laminated on the resin substrate, filling a magnetic resin in the openings formed in the substrate, forming a shield layer including a first plating film on the substrate and on a surface of the magnetic resin such that the shielding layer is formed on the metal foil and on the surface of the magnetic resin, forming first through holes in the substrate, applying a desmear treatment in the first through holes, forming second through holes in the magnetic resin after the desmear treatment, and forming a second plating film on the substrate, on the magnetic resin, and in the first and second through holes such that the second plating film is formed on the shield layer, in the first through holes, and in the second through holes.