公开(公告)号：US20210068264A1

公开(公告)日：2021-03-04

申请号：US17004719

申请日：2020-08-27

Applicant: IBIDEN CO., LTD.

Inventor： Yoji Sawada ,  Shuto Iwata

IPC: H05K3/34 ,  H05K3/12 ,  H05K1/11 ,  H05K3/42

Abstract: A method for manufacturing a printed wiring board includes forming a conductor layer including first and second pads on an insulating layer, forming a dry film resist layer on the insulating and conductor layers, forming first and second openings exposing the first and second pads, applying first metal plating to form first and second base plating layers on the first and second pads, applying second metal plating to form a first top plating layer of a first post and portion of a second top plating layer of a second bump post, applying the second metal plating further to form second portion of the second top layer of the second post, removing the dry film resist layer, forming a solder resist layer to cover the first and second posts, and thinning the solder resist layer over entire surface to position the first and second top layers outside the solder resist layer.

公开(公告)号：US10804191B2

公开(公告)日：2020-10-13

申请号：US16157433

申请日：2018-10-11

Applicant: IBIDEN CO., LTD.

Inventor： Hajime Sakamoto ,  Yoji Sawada

IPC: H05K1/00 ,  H05K1/18 ,  H05K7/00 ,  H01L23/498 ,  H01L21/48

Abstract: A printed wiring board includes a first build-up layer having first insulating layer, conductor layer and via conductor, a second build-up layer formed on the first build-up layer and having second insulating layer, conductor layer and via conductor, a third build-up layer formed on the second build-up layer and having third insulating layer, conductor layer and via conductor, and a fourth build-up layer formed on the third build-up layer and having fourth insulating layer, conductor layer and via conductor. The first insulating layer has a thickness that is larger than a thickness of the second insulating layer, the thickness of the second insulating layer is larger than a thickness of the third insulating layer, the thickness of the second insulating layer is larger than a thickness of the fourth insulating layer, and the thickness of the fourth insulating layer is larger than the thickness of the third insulating layer.