公开(公告)号：US20190098752A1

公开(公告)日：2019-03-28

申请号：US16143627

申请日：2018-09-27

申请人： IBIDEN CO., LTD.

发明人： Hajime Sakamoto ,  Yoji Sawada

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H01L21/48

摘要： A printed wiring board includes a first build-up layer including first insulating layer, conductor layer and via conductor, a second build-up layer formed on the first build-up layer and including second insulating layer, conductor layer and via conductor, and a third build-up layer formed on the second build-up layer and including third insulating layer, conductor layer and via conductor. The first via conductor has first via conductor diameter at interface between the first conductor layer and first via conductor, the second via conductor has second via conductor diameter at interface between the second conductor layer and second via conductor, and the third via conductor has third via conductor diameter at interface between the third conductor layer and third via conductor such that the first via conductor diameter is larger than the second via conductor diameter and that the second via conductor diameter is larger than the third via conductor diameter.

公开(公告)号：US11019732B2

公开(公告)日：2021-05-25

申请号：US17004812

申请日：2020-08-27

申请人： IBIDEN CO., LTD.

发明人： Yoji Sawada ,  Shuto Iwata

IPC分类号： H05K1/11 ,  H05K3/34 ,  H05K3/12 ,  H05K3/42

摘要： A printed wiring board includes an insulating layer, a conductor layer formed on the insulating layer and including first and second pads, a solder resist layer formed on the insulating layer, covering the conductor layer and exposing the first and second pads to form the second pad having diameter smaller than diameter of the first pad, a first bump formed on the first pad and including first base and top plating layers such that the first base layer has embedded portion in the resist layer and exposed portion and having diameter substantially equal to or smaller than diameter of the embedded portion, and a second bump formed on the second pad and including second base and top plating layers such that the second base layer has embedded portion in the resist layer and exposed portion and having diameter substantially equal to or smaller than diameter of the embedded portion.

公开(公告)号：US20190109085A1

公开(公告)日：2019-04-11

申请号：US16157433

申请日：2018-10-11

申请人： IBIDEN CO., LTD.

发明人： Hajime SAKAMOTO ,  Yoji Sawada

IPC分类号： H01L23/498

摘要： A printed wiring board includes a first build-up layer having first insulating layer, conductor layer and via conductor, a second build-up layer formed on the first build-up layer and having second insulating layer, conductor layer and via conductor, a third build-up layer formed on the second build-up layer and having third insulating layer, conductor layer and via conductor, and a fourth build-up layer formed on the third build-up layer and having fourth insulating layer, conductor layer and via conductor. The first insulating layer has a thickness that is larger than a thickness of the second insulating layer, the thickness of the second insulating layer is larger than a thickness of the third insulating layer, the thickness of the second insulating layer is larger than a thickness of the fourth insulating layer, and the thickness of the fourth insulating layer is larger than the thickness of the third insulating layer.

公开(公告)号：US11622446B2

公开(公告)日：2023-04-04

申请号：US17359805

申请日：2021-06-28

申请人： IBIDEN CO., LTD.

发明人： Isao Ohno ,  Tomoya Daizo ,  Yoji Sawada ,  Kazuhiko Kuranobu

IPC分类号： H05K1/11 ,  H05K1/09 ,  H01L23/00 ,  H01L23/498

摘要： A wiring substrate includes a resin insulating layer, a conductor pad formed on the resin insulating layer, a coating insulating layer formed on the resin insulating layer such that the coating insulating layer is covering the conductor pad, and a metal post connected to the conductor pad and protruding from the coating insulating layer such that a gap is formed between the metal post and the conductor pad at a peripheral edge of the metal post. The coating insulating layer is formed such that the coating insulating layer has an interposed portion formed in the gap between the metal post and the conductor pad at the peripheral edge of the metal post.

公开(公告)号：US11222791B2

公开(公告)日：2022-01-11

申请号：US15931696

申请日：2020-05-14

申请人： IBIDEN CO., LTD.

发明人： Yoji Sawada ,  Nobuhisa Kuroda ,  Kazuyuki Ueda ,  Shota Tachibana

IPC分类号： H05K1/18 ,  H05K1/11 ,  H01L21/48 ,  H01L23/498 ,  H05K3/46 ,  H01L23/00 ,  H05K1/02

摘要： A printed wiring board includes a resin insulating layer, a metal post formed in the resin insulating layer such that the metal post is protruding from a first surface of the resin insulating layer, a conductor layer formed on a second surface of the resin insulating layer on the opposite side with respect to the first surface of the resin insulating layer, and a via conductor formed in the resin insulating layer such that the via conductor is penetrating through the resin insulating layer and connecting the metal post and the conductor layer. The metal post has a protruding portion protruding from the first surface of the resin insulating layer and an embedded portion integrally formed with the protruding portion and embedded in the resin insulating layer.

公开(公告)号：US11246224B2

公开(公告)日：2022-02-08

申请号：US17004719

申请日：2020-08-27

申请人： IBIDEN CO., LTD.

发明人： Yoji Sawada ,  Shuto Iwata

IPC分类号： H05K3/34 ,  H05K3/12 ,  H05K3/42 ,  H05K1/11 ,  H05K3/24

摘要： A method for manufacturing a printed wiring board includes forming a conductor layer including first and second pads on an insulating layer, forming a dry film resist layer on the insulating and conductor layers, forming first and second openings exposing the first and second pads, applying first metal plating to form first and second base plating layers on the first and second pads, applying second metal plating to form a first top plating layer of a first post and portion of a second top plating layer of a second bump post, applying the second metal plating further to form second portion of the second top layer of the second post, removing the dry film resist layer, forming a solder resist layer to cover the first and second posts, and thinning the solder resist layer over entire surface to position the first and second top layers outside the solder resist layer.

公开(公告)号：US20210068264A1

公开(公告)日：2021-03-04

申请号：US17004719

申请日：2020-08-27

申请人： IBIDEN CO., LTD.

发明人： Yoji Sawada ,  Shuto Iwata

IPC分类号： H05K3/34 ,  H05K3/12 ,  H05K1/11 ,  H05K3/42

摘要： A method for manufacturing a printed wiring board includes forming a conductor layer including first and second pads on an insulating layer, forming a dry film resist layer on the insulating and conductor layers, forming first and second openings exposing the first and second pads, applying first metal plating to form first and second base plating layers on the first and second pads, applying second metal plating to form a first top plating layer of a first post and portion of a second top plating layer of a second bump post, applying the second metal plating further to form second portion of the second top layer of the second post, removing the dry film resist layer, forming a solder resist layer to cover the first and second posts, and thinning the solder resist layer over entire surface to position the first and second top layers outside the solder resist layer.

公开(公告)号：US10804191B2

公开(公告)日：2020-10-13

申请号：US16157433

申请日：2018-10-11

申请人： IBIDEN CO., LTD.

发明人： Hajime Sakamoto ,  Yoji Sawada

IPC分类号： H05K1/00 ,  H05K1/18 ,  H05K7/00 ,  H01L23/498 ,  H01L21/48

摘要： A printed wiring board includes a first build-up layer having first insulating layer, conductor layer and via conductor, a second build-up layer formed on the first build-up layer and having second insulating layer, conductor layer and via conductor, a third build-up layer formed on the second build-up layer and having third insulating layer, conductor layer and via conductor, and a fourth build-up layer formed on the third build-up layer and having fourth insulating layer, conductor layer and via conductor. The first insulating layer has a thickness that is larger than a thickness of the second insulating layer, the thickness of the second insulating layer is larger than a thickness of the third insulating layer, the thickness of the second insulating layer is larger than a thickness of the fourth insulating layer, and the thickness of the fourth insulating layer is larger than the thickness of the third insulating layer.