公开(公告)号：US20140020940A1

公开(公告)日：2014-01-23

申请号：US13938637

申请日：2013-07-10

Applicant: IBIDEN CO., LTD.

Inventor： Yasuhiko MANO ,  Kazuhiro YOSHIKAWA ,  Takashi KARIYA

IPC: H05K1/16 ,  H05K3/30

CPC classification number: H05K1/165 ,  H01L2924/3511 ,  H05K1/0233 ,  H05K1/186 ,  H05K3/0032 ,  H05K3/30 ,  H05K3/4676 ,  H05K3/4697 ,  H05K2201/0209 ,  Y10T29/4913

Abstract: A printed wiring board includes a core substrate, a first buildup layer formed on a first surface of the core substrate and including an insulation layer and a conductive layer, a second buildup layer formed on a second surface of the core substrate on the opposite side with respect to the first buildup layer and including an insulation layer and a conductive layer, and an inductor device positioned in the second buildup layer and including a resin insulation layer and a coil layer formed on the resin insulation layer. The second buildup layer has a cavity in which the inductor device is accommodated.

Abstract translation: 印刷电路板包括芯基板，形成在芯基板的第一表面上并包括绝缘层和导电层的第一累积层，在相对侧的芯基板的第二表面上形成的第二累积层， 相对于第一累积层，并且包括绝缘层和导电层，以及位于第二堆积层中的电感器件，并且包括树脂绝缘层和形成在树脂绝缘层上的线圈层。 第二累积层具有容纳电感器装置的空腔。