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公开(公告)号：US20230284394A1
公开(公告)日：2023-09-07
申请号：US18176900
申请日：2023-03-01
发明人： Naoki SHIBATA , Ryosuke SASAOKA
CPC分类号： H05K3/4676 , G03F7/039 , G03F7/0387 , H05K3/4608 , H05K3/0023
摘要： Provided is a method for producing a wiring circuit board capable of improving the dimensional accuracy of a second conductive layer. The wiring circuit board produced by the producing method includes a metal supporting layer, a first insulating layer disposed on one surface of the metal supporting layer in a thickness direction, a first conductive layer disposed on one surface of the first insulating layer in the thickness direction, a second insulating layer disposed on one surface of the first insulating layer in the thickness direction so as to cover the first conductive layer, and a second conductive layer disposed on one surface of the second insulating layer in the thickness direction. The producing method includes a step of forming the second insulating layer by bonding a film made of a photosensitive resin to one surfaces of the first insulating layer and the first conductive layer in the thickness direction.
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公开(公告)号：US20180315687A1
公开(公告)日：2018-11-01
申请号：US15956829
申请日：2018-04-19
申请人： FUJITSU LIMITED
发明人： Kei FUKUI , Youichi Hoshikawa , Hiromitsu KOBAYASHI , Hidehiko Fujisaki , Seigo Yamawaki , Masateru Koide , MANABU WATANABE , Daisuke Mizutani , Tomoyuki AKAHOSHI
IPC分类号： H01L23/498 , H05K1/16 , H01L49/02
CPC分类号： H01L23/49822 , H01L28/40 , H05K1/162 , H05K3/4632 , H05K3/4652 , H05K3/4676
摘要： A board includes a plate-shaped member having a first wiring pattern, a first resin layer formed on a first surface of the plate-shaped member, the first surface having the first wiring pattern, a second resin layer stacked on the first resin layer, and a component fixed to the second resin layer in which a second wiring pattern formed on a second surface of the component is buried.
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公开(公告)号：US09993838B2
公开(公告)日：2018-06-12
申请号：US15788226
申请日：2017-10-19
IPC分类号： B05C5/00 , B05C5/02 , H05K3/00 , H05K3/12 , G01B11/14 , G06T7/00 , B05C21/00 , H04N7/18 , H04N5/225 , H05K13/08 , H05K13/04 , G06T7/80 , H05K3/46
CPC分类号： B05C21/00 , G01B11/14 , G06T7/0006 , G06T7/80 , G06T2207/30108 , G06T2207/30232 , H04N5/2253 , H04N7/185 , H05K3/0008 , H05K3/4676 , H05K13/0469 , H05K13/08 , H05K13/0818 , H05K2201/09918 , H05K2203/0126 , H05K2203/0545 , H05K2203/166
摘要： A method is used to identify and compensate for errors created by changes in the relative positions of a deposition unit and a vision system of a dispenser. The method includes calibrating the vision system, dispensing a pattern of features over a working area, moving the vision system over a deposition location to locate a deposition, obtaining an image of the deposition, tagging data associated with the image, calculating a relative distance between the deposition unit and the vision system, storing correction data with spatial location in a file for later use, and using the stored data to make small corrections prior to dispensing additional material.
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公开(公告)号：US09949379B2
公开(公告)日：2018-04-17
申请号：US14897214
申请日：2014-04-30
发明人： Jongsoo Kim , Jeong-Sang Yu , O-Chung Kwon , Jae-Sic Kim
IPC分类号： H05K3/36 , H05K3/28 , H05K3/46 , H05K1/02 , H05K1/09 , H05K1/11 , H05K3/00 , H05K3/10 , H05K1/03
CPC分类号： H05K3/361 , H05K1/028 , H05K1/0298 , H05K1/0393 , H05K1/092 , H05K1/115 , H05K3/0011 , H05K3/10 , H05K3/285 , H05K3/46 , H05K3/4664 , H05K3/4676 , H05K2201/0145 , H05K2201/0154 , H05K2201/0209 , H05K2201/0317 , H05K2203/0759
摘要： A flexible printed circuit board includes a substrate, a circuit pattern formed on the substrate, and a protective coating layer formed on the substrate by applying and curing a coating solution to cover and protect the circuit pattern. A method for manufacturing forming a circuit pattern on a substrate and forming a protective coating layer for covering and protecting the circuit pattern by applying a coating solution on the substrate. The circuit pattern may be securely attached to the substrate, and damage and deformation of the circuit pattern due to repeated bending or warping of the substrate may be prevented, ultimately improving operational reliability.
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公开(公告)号：US20180036762A1
公开(公告)日：2018-02-08
申请号：US15788226
申请日：2017-10-19
CPC分类号： B05C21/00 , G01B11/14 , G06T7/0006 , G06T7/80 , G06T2207/30108 , G06T2207/30232 , H04N5/2253 , H04N7/185 , H05K3/0008 , H05K3/4676 , H05K13/0469 , H05K13/08 , H05K13/0818 , H05K2201/09918 , H05K2203/0126 , H05K2203/0545 , H05K2203/166
摘要： A method is used to identify and compensate for errors created by changes in the relative positions of a deposition unit and a vision system of a dispenser. The method includes calibrating the vision system, dispensing a pattern of features over a working area, moving the vision system over a deposition location to locate a deposition, obtaining an image of the deposition, tagging data associated with the image, calculating a relative distance between the deposition unit and the vision system, storing correction data with spatial location in a file for later use, and using the stored data to make small corrections prior to dispensing additional material.
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公开(公告)号：US09822226B2
公开(公告)日：2017-11-21
申请号：US14934700
申请日：2015-11-06
发明人： Takayuki Chujo , Arata Endo
CPC分类号： C08J5/18 , C08J2363/00 , H05K1/0271 , H05K1/0373 , H05K3/429 , H05K3/4676 , H05K2203/0537 , H05K2203/0783
摘要： An object of the present invention is to provide: a dry film comprising a resin layer which has excellent detachability from a carrier film and in which cracking and powdering are inhibited; and a printed wiring board comprising a cured article obtained by curing the dry film. The dry film comprises a resin layer containing a thermosetting resin component, a filler and at least two solvents, wherein the at least two solvents both have a boiling point of 100° C. or higher and the boiling points of the at least two solvents are different by not less than 5° C.
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公开(公告)号：US09515018B2
公开(公告)日：2016-12-06
申请号：US15193479
申请日：2016-06-27
发明人： Tomohiro Suzuki
IPC分类号： H05K1/09 , H05K1/00 , H05K1/11 , H05K7/10 , H01L23/498 , H01L21/48 , H01L23/00 , H01L21/56 , H01L23/31
CPC分类号： H01L23/49838 , H01L21/4857 , H01L21/486 , H01L21/565 , H01L23/3114 , H01L23/492 , H01L23/49822 , H01L23/49827 , H01L23/49866 , H01L24/17 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/01028 , H01L2924/01079 , H01L2924/15738 , H01L2924/15747 , H01L2924/181 , H05K3/10 , H05K3/108 , H05K3/4676 , H05K3/4682 , H05K2203/1572 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A wiring substrate includes an insulating layer, a wiring layer, a via wiring, and a solder resist layer. The wiring layer includes a pad body that constitutes a part of a pad and a wiring pattern including an upper surface. The pad includes the pad body, a first metal layer formed on an upper surface of the pad body and including an embedded part embedded in the insulating layer and a projecting part including upper and side surfaces and projecting from the upper surface of the insulating layer, and a second metal layer including an upper surface and covering the upper and side surfaces of the projecting part. The upper surface of the pad body and the upper surface of the wiring pattern are on the same plane. The upper surface of the second metal layer is positioned lower than the upper surface of the solder resist layer.
摘要翻译： 布线基板包括绝缘层，布线层，通孔布线和阻焊层。 布线层包括构成焊盘的一部分的焊盘主体和包括上表面的布线图案。 衬垫包括衬垫体，形成在衬垫本体的上表面上的第一金属层，并且包括嵌入绝缘层中的嵌入部分和包括上表面和侧表面并从绝缘层的上表面突出的突出部分， 以及包括上表面并覆盖突出部分的上表面和侧表面的第二金属层。 垫体的上表面和布线图案的上表面在同一平面上。 第二金属层的上表面位于比阻焊层的上表面低的位置。
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公开(公告)号：US09406599B2
公开(公告)日：2016-08-02
申请号：US14824174
申请日：2015-08-12
发明人： Tomohiro Suzuki
IPC分类号： H05K1/09 , H01L23/498 , H01L23/492 , H01L21/48 , H05K3/10
CPC分类号： H01L23/49838 , H01L21/4857 , H01L21/486 , H01L21/565 , H01L23/3114 , H01L23/492 , H01L23/49822 , H01L23/49827 , H01L23/49866 , H01L24/17 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/01028 , H01L2924/01079 , H01L2924/15738 , H01L2924/15747 , H01L2924/181 , H05K3/10 , H05K3/108 , H05K3/4676 , H05K3/4682 , H05K2203/1572 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A wiring substrate includes an insulating layer, a wiring layer, a via wiring, and a solder resist layer. The wiring layer includes a pad body that constitutes a part of a pad and a wiring pattern including an upper surface. The pad includes the pad body, a first metal layer formed on an upper surface of the pad body and including an embedded part embedded in the insulating layer and a projecting part including upper and side surfaces and projecting from the upper surface of the insulating layer, and a second metal layer including an upper surface and covering the upper and side surfaces of the projecting part. The upper surface of the pad body and the upper surface of the wiring pattern are on the same plane. The upper surface of the second metal layer is positioned lower than the upper surface of the solder resist layer.
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公开(公告)号：US20160064319A1
公开(公告)日：2016-03-03
申请号：US14824174
申请日：2015-08-12
发明人： Tomohiro SUZUKI
IPC分类号： H01L23/498 , H01L21/48 , H05K3/10 , H01L23/492
CPC分类号： H01L23/49838 , H01L21/4857 , H01L21/486 , H01L21/565 , H01L23/3114 , H01L23/492 , H01L23/49822 , H01L23/49827 , H01L23/49866 , H01L24/17 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/01028 , H01L2924/01079 , H01L2924/15738 , H01L2924/15747 , H01L2924/181 , H05K3/10 , H05K3/108 , H05K3/4676 , H05K3/4682 , H05K2203/1572 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A wiring substrate includes an insulating layer, a wiring layer, a via wiring, and a solder resist layer. The wiring layer includes a pad body that constitutes a part of a pad and a wiring pattern including an upper surface. The pad includes the pad body, a first metal layer formed on an upper surface of the pad body and including an embedded part embedded in the insulating layer and a projecting part including upper and side surfaces and projecting from the upper surface of the insulating layer, and a second metal layer including an upper surface and covering the upper and side surfaces of the projecting part. The upper surface of the pad body and the upper surface of the wiring pattern are on the same plane. The upper surface of the second metal layer is positioned lower than the upper surface of the solder resist layer.
摘要翻译： 布线基板包括绝缘层，布线层，通孔布线和阻焊层。 布线层包括构成焊盘的一部分的焊盘主体和包括上表面的布线图案。 衬垫包括衬垫体，形成在衬垫本体的上表面上的第一金属层，并且包括嵌入绝缘层中的嵌入部分和包括上表面和侧表面并从绝缘层的上表面突出的突出部分， 以及包括上表面并覆盖突出部分的上表面和侧表面的第二金属层。 垫体的上表面和布线图案的上表面在同一平面上。 第二金属层的上表面位于比阻焊层的上表面低的位置。
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公开(公告)号：US20160060408A1
公开(公告)日：2016-03-03
申请号：US14934700
申请日：2015-11-06
发明人： Takayuki CHUJO , Arata ENDO
CPC分类号： C08J5/18 , C08J2363/00 , H05K1/0271 , H05K1/0373 , H05K3/429 , H05K3/4676 , H05K2203/0537 , H05K2203/0783
摘要： An object of the present invention is to provide: a dry film comprising a resin layer which has excellent detachability from a carrier film and in which cracking and powdering are inhibited; and a printed wiring board comprising a cured article obtained by curing the dry film. The dry film comprises a resin layer containing a thermosetting resin component, a filler and at least two solvents, wherein the at least two solvents both have a boiling point of 100° C. or higher and the boiling points of the at least two solvents are different by not less than 5° C.
摘要翻译： 本发明的目的是提供一种干膜，其具有树脂层，该树脂层与载体膜具有优异的可剥离性，并且其中抑制了开裂和粉化; 以及印刷线路板，其包括通过固化所述干膜而获得的固化物。 干膜包括含有热固性树脂组分，填料和至少两种溶剂的树脂层，其中所述至少两种溶剂的沸点为100℃以上，所述至少两种溶剂的沸点为 不同于5℃不等
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