公开(公告)号：US09775234B2

公开(公告)日：2017-09-26

申请号：US14691588

申请日：2015-04-21

Applicant: Industrial Technology Research Institute

Inventor： Cheng-Che Wu ,  Chen-Chu Tsai ,  Chia-Hao Tsai

IPC: H05K1/00 ,  H05K1/02

CPC classification number: H05K1/028 ,  H05K1/0281 ,  H05K2201/055

Abstract: A flexible electronic device including a flexible panel and an auxiliary layer is provided. The flexible panel has a plurality of operation portions, wherein a predetermined bending portion disposed between each adjacent two of the operation portions. The auxiliary layer is disposed on a surface of the flexible panel and at least located above the predetermined bending portion. The predetermined bending portion of the flexible panel may be bent in a first bending state for the auxiliary layer to be in contact with the predetermined bending portion, and a radius of curvature of the auxiliary layer is greater than a radius of curvature of the predetermined bending portion. The flexible electronic device has a first compressive stress region and a first tensile stress region, and a range of the first compressive stress region is greater than a range of the first tensile stress region.

公开(公告)号：US20160218320A1

公开(公告)日：2016-07-28

申请号：US15003803

申请日：2016-01-22

Applicant: Industrial Technology Research Institute

Inventor： Kun-Ming Chen ,  Chen-Chu Tsai ,  Yuh-Zheng Lee ,  Kuo-Lung Lo

IPC: H01L51/52

CPC classification number: H01L51/5256 ,  H01L51/5246 ,  H01L2251/5338 ,  H01L2251/558

Abstract: A flexible environmental sensitive electronic device package including a flexible electronic device, a thin film encapsulation (TFE) and a sealing member is provided. The TFE covers the flexible electronic device as well as the sealing member covers the TFE and the flexible electronic device. The sealing member includes a first portion and a second portion, wherein the first portion covers the flexible electronic device and the TFE, and the second portion covers the first portion. Young's modulus of the second portion is between the 0 MPa and 100 MPa. Young's modulus of the first portion is greater than that of the second portion. The thickness of the first portion is less than that of the second portion.

Abstract translation: 提供一种灵活的环境敏感的电子器件封装，包括柔性电子器件，薄膜封装（TFE）和密封构件。 TFE覆盖柔性电子设备，密封构件覆盖TFE和柔性电子设备。 密封构件包括第一部分和第二部分，其中第一部分覆盖柔性电子装置和TFE，并且第二部分覆盖第一部分。 第二部分的杨氏模量在0MPa和100MPa之间。 第一部分的杨氏模量大于第二部分的杨氏模量。 第一部分的厚度小于第二部分的厚度。

公开(公告)号：US11262482B2

公开(公告)日：2022-03-01

申请号：US16039336

申请日：2018-07-19

Applicant: Industrial Technology Research Institute ,  Intellectual Property Innovation Corporation

Inventor： Jui-Chang Chuang ,  Chen-Chu Tsai ,  Kai-Ming Chang ,  Chih-Chia Chang ,  Ting-Hsun Cheng

IPC: G02B1/14 ,  B32B7/12

Abstract: An impact resistant structure adapted to an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, and the damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.

公开(公告)号：US20190049630A1

公开(公告)日：2019-02-14

申请号：US16039336

申请日：2018-07-19

Applicant: Industrial Technology Research Institute ,  Intellectual Property Innovation Corporation

Inventor： Jui-Chang Chuang ,  Chen-Chu Tsai ,  Kai-Ming Chang ,  Chih-Chia Chang ,  Ting-Hsun Cheng

IPC: G02B1/14 ,  B32B7/12

Abstract: An impact resistant structure adapted to an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, and the damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.

公开(公告)号：US09743513B2

公开(公告)日：2017-08-22

申请号：US14583235

申请日：2014-12-26

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Shu-Wei Kuo ,  Kuo-Lung Lo ,  Cheng-Che Wu ,  Chen-Chu Tsai

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/28

CPC classification number: H05K1/0281 ,  H05K1/189 ,  H05K3/007 ,  H05K3/284 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/2009 ,  H05K2203/1316

Abstract: According to embodiments of the disclosure, a flexible electronic device is provided. The flexible electronic device includes a flexible substrate, at least one component and at least one stress buffer. The component may be disposed on the flexible substrate and having a lateral surface. The stress buffer may be disposed adjacent to the lateral surface of the component and has a stiffness which is getting larger toward the component.

公开(公告)号：US09408300B2

公开(公告)日：2016-08-02

申请号：US14620214

申请日：2015-02-12

Applicant: Industrial Technology Research Institute

Inventor： Cheng-Che Wu ,  Chen-Chu Tsai ,  Chien-Jung Huang ,  Yung-Hui Yeh ,  Heng-Yin Chen

IPC: H05K1/02 ,  H05K3/00 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/028 ,  H05K1/0281 ,  H05K3/0032 ,  H05K3/007 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/2009 ,  H05K2203/1178

Abstract: According to embodiments of the disclosure, a flexible device and a fabrication method thereof are provided. The flexible device has a first area and a second area, and the stiffness of a portion of the first area is greater than the stiffness of the second area. The flexible device may include a flexible substrate and a rigid element. The flexible substrate includes a first surface and a second surface opposite to each other. The second surface has a coarse structure. The surface roughness of the second surface is greater in the first area than in the second area. The rigid element is disposed on the first surface of the flexible substrate and located in the first area. The stiffness of the rigid element is greater than the stiffness of the flexible substrate. A projection area of the coarse structure on the flexible substrate overlaps an area of the rigid element.

Abstract translation: 根据本公开的实施例，提供了柔性装置及其制造方法。 柔性装置具有第一区域和第二区域，并且第一区域的一部分的刚度大于第二区域的刚度。 柔性装置可以包括柔性基底和刚性元件。 柔性基板包括彼此相对的第一表面和第二表面。 第二表面具有粗糙的结构。 在第一区域中第二表面的表面粗糙度大于第二区域中的表面粗糙度。 刚性元件设置在柔性基板的第一表面上并且位于第一区域中。 刚性元件的刚度大于柔性基板的刚度。 柔性基板上的粗糙结构的投影区域与刚性元件的区域重叠。

公开(公告)号：US20160143130A1

公开(公告)日：2016-05-19

申请号：US14691588

申请日：2015-04-21

Applicant: Industrial Technology Research Institute

Inventor： Cheng-Che Wu ,  Chen-Chu Tsai ,  Chia-Hao Tsai

IPC: H05K1/02 ,  H05K5/00

CPC classification number: H05K1/028 ,  H05K1/0281 ,  H05K2201/055

Abstract: A flexible electronic device including a flexible panel and an auxiliary layer is provided. The flexible panel has a plurality of operation portions, wherein a predetermined bending portion disposed between each adjacent two of the operation portions. The auxiliary layer is disposed on a surface of the flexible panel and at least located above the predetermined bending portion. The predetermined bending portion of the flexible panel may be bent in a first bending state for the auxiliary layer to be in contact with the predetermined bending portion, and a radius of curvature of the auxiliary layer is greater than a radius of curvature of the predetermined bending portion. The flexible electronic device has a first compressive stress region and a first tensile stress region, and a range of the first compressive stress region is greater than a range of the first tensile stress region.

Abstract translation: 提供了一种包括柔性面板和辅助层的柔性电子设备。 柔性面板具有多个操作部，其中设置在每个相邻的两个操作部之间的预定弯曲部。 辅助层设置在柔性板的表面上，并且至少位于预定的弯曲部分之上。 柔性板的预定弯曲部分可以在第一弯曲状态下弯曲以使辅助层与预定弯曲部分接触，并且辅助层的曲率半径大于预定弯曲的曲率半径 一部分。 柔性电子器件具有第一压缩应力区域和第一拉伸应力区域，并且第一压缩应力区域的范围大于第一拉伸应力区域的范围。