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公开(公告)号：US11007751B2
公开(公告)日：2021-05-18
申请号：US16729520
申请日：2019-12-30
Inventor： Jui-Chang Chuang , Chen-Chu Tsai , Kai-Ming Chang , Chih-Chia Chang , Ting-Hsun Cheng
Abstract: An impact resistant structure for an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, a thickness of the resistance stack layer is less than 10 μm, and a Young's modulus of the resistance stack layer is between 40 GPa and 150 GPa. The damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.
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公开(公告)号：US20160295689A1
公开(公告)日：2016-10-06
申请号：US14983594
申请日：2015-12-30
Applicant: Industrial Technology Research Institute
Inventor： Chih-Chia Chang , Ming-Huan Yang , Cheng-Chung Lee , Jia-Chong Ho , Chen-Chu Tsai , Kun-Lin Chuang
CPC classification number: H05K1/0283 , H03K17/9622 , H03K2217/960755 , H05K1/189 , H05K3/007 , H05K3/284 , H05K2201/0187 , H05K2201/0191
Abstract: A flexible electronic module including a patterned flexible substrate, a stretchable material layer, and at least one electronic device is provided. The patterned flexible substrate includes at least one distributed region, and the stretchable material layer connects the distributed region. The electronic device is disposed on at least one of the patterned flexible substrate and the stretchable material layer. A manufacturing method of the flexible electronic module is also provided.
Abstract translation: 提供了包括图案化柔性基板，可拉伸材料层和至少一个电子装置的柔性电子模块。 图案化的柔性基板包括至少一个分布区域，并且可拉伸材料层连接分布区域。 电子器件设置在图案化的柔性衬底和可伸展材料层中的至少一个上。 还提供了柔性电子模块的制造方法。
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公开(公告)号：US20160174358A1
公开(公告)日：2016-06-16
申请号：US14620214
申请日：2015-02-12
Applicant: Industrial Technology Research Institute
Inventor： Cheng-Che Wu , Chen-Chu Tsai , Chien-Jung Huang , Yung-Hui Yeh , Heng-Yin Chen
CPC classification number: H05K1/028 , H05K1/0281 , H05K3/0032 , H05K3/007 , H05K2201/0145 , H05K2201/0154 , H05K2201/10106 , H05K2201/10128 , H05K2201/2009 , H05K2203/1178
Abstract: According to embodiments of the disclosure, a flexible device and a fabrication method thereof are provided. The flexible device has a first area and a second area, and the stiffness of a portion of the first area is greater than the stiffness of the second area. The flexible device may include a flexible substrate and a rigid element. The flexible substrate includes a first surface and a second surface opposite to each other. The second surface has a coarse structure. The surface roughness of the second surface is greater in the first area than in the second area. The rigid element is disposed on the first surface of the flexible substrate and located in the first area. The stiffness of the rigid element is greater than the stiffness of the flexible substrate. A projection area of the coarse structure on the flexible substrate overlaps an area of the rigid element.
Abstract translation: 根据本公开的实施例，提供了柔性装置及其制造方法。 柔性装置具有第一区域和第二区域，并且第一区域的一部分的刚度大于第二区域的刚度。 柔性装置可以包括柔性基底和刚性元件。 柔性基板包括彼此相对的第一表面和第二表面。 第二表面具有粗糙的结构。 在第一区域中第二表面的表面粗糙度大于第二区域中的表面粗糙度。 刚性元件设置在柔性基板的第一表面上并且位于第一区域中。 刚性元件的刚度大于柔性基板的刚度。 柔性基板上的粗糙结构的投影区域与刚性元件的区域重叠。
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公开(公告)号：US20170144422A1
公开(公告)日：2017-05-25
申请号：US15135403
申请日：2016-04-21
Applicant: Industrial Technology Research Institute
Inventor： Chen-Chu Tsai , Cheng-Yi Wang , Shi-Chang Chen , Tzu-Chun Lin
CPC classification number: B32B37/1018 , B32B37/0046 , B32B43/006 , B32B2457/00
Abstract: A device is for removing a first substrate from a second substrate or adhering the first substrate to the second substrate. The device includes a carrier, a flexible member and a supporting member. The carrier is for fixing the first substrate. The flexible member is for fixing the second substrate. The supporting member is connected to the carrier and the flexible member. The carrier and the flexible member are spaced a distance from each other. The carrier, the flexible member and the supporting member together define a first variable pressure chamber. The first variable pressure chamber has a first air hole.
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5.发明授权Electronic device package, electronic device structure and method of fabricating electronic device package 有权电子器件封装，电子器件结构及制造电子器件封装的方法公开(公告)号：US09591746B2
公开(公告)日：2017-03-07
申请号：US15199913
申请日：2016-06-30
Applicant: Industrial Technology Research Institute
Inventor： Wei-Yuan Cheng , Chen-Chu Tsai , Yuh-Zheng Lee
IPC: H05K1/00 , H05K3/00 , H05K1/02 , H01L23/498 , H01L23/31 , H01L21/683 , H05K1/11 , H05K3/40
CPC classification number: H05K1/028 , H01L21/6835 , H01L23/3128 , H01L23/3135 , H01L23/49827 , H01L23/49838 , H01L23/4985 , H01L2221/68318 , H01L2221/68345 , H01L2221/68359 , H01L2221/68381 , H01L2224/16 , H01L2924/181 , H05K1/0281 , H05K1/115 , H05K3/0032 , H05K3/007 , H05K3/4038 , H05K2201/0145 , H05K2201/0154 , H05K2201/10106 , H05K2201/10128 , H05K2201/2009 , H05K2203/1178 , H01L2924/00012
Abstract: According to embodiments of the disclosure, an electronic device package may include a wire layer and a rigid element. The wire layer includes a first surface and a second surface opposite to each other, and the second surface of the wire layer has at least one coarse structure. A portion of the second surface having the coarse structure has a greater roughness than another portion of the second surface. The rigid element is disposed on the first surface of the wire layer, wherein a stiffness of the rigid element is greater than a stiffness of the wire layer and a projection area of the coarse structure on the first surface of the wire layer overlaps an edge of the rigid element.
Abstract translation: 根据本公开的实施例，电子设备封装可以包括导线层和刚性元件。 线层包括彼此相对的第一表面和第二表面，并且线层的第二表面具有至少一个粗糙结构。 具有粗糙结构的第二表面的一部分具有比第二表面的另一部分更大的粗糙度。 刚性元件设置在线层的第一表面上，其中刚性元件的刚度大于金属丝层的刚度，并且粗糙结构在金属丝层的第一表面上的投影区域与 刚性元素。
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Patent Agency Ranking
公开(公告)号：US10173407B2
公开(公告)日：2019-01-08
申请号：US15135403
申请日：2016-04-21
Applicant: Industrial Technology Research Institute
Inventor： Chen-Chu Tsai , Cheng-Yi Wang , Shi-Chang Chen , Tzu-Chun Lin
Abstract: A device is for removing a first substrate from a second substrate or adhering the first substrate to the second substrate. The device includes a carrier, a flexible member and a supporting member. The carrier is for fixing the first substrate. The flexible member is for fixing the second substrate. The supporting member is connected to the carrier and the flexible member. The carrier and the flexible member are spaced a distance from each other. The carrier, the flexible member and the supporting member together define a first variable pressure chamber. The first variable pressure chamber has a first air hole.
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公开(公告)号：US10098225B2
公开(公告)日：2018-10-09
申请号：US14983594
申请日：2015-12-30
Applicant: Industrial Technology Research Institute
Inventor： Chih-Chia Chang , Ming-Huan Yang , Cheng-Chung Lee , Jia-Chong Ho , Chen-Chu Tsai , Kun-Lin Chuang
Abstract: A flexible electronic module including a patterned flexible substrate, a stretchable material layer, and at least one electronic device is provided. The patterned flexible substrate includes at least one distributed region, and the stretchable material layer connects the distributed region. The electronic device is disposed on at least one of the patterned flexible substrate and the stretchable material layer. A manufacturing method of the flexible electronic module is also provided.
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公开(公告)号：US09655244B1
公开(公告)日：2017-05-16
申请号：US15356522
申请日：2016-11-18
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Chen-Chu Tsai , Cheng-Yi Wang , Yuh-Zheng Lee , Ko-Chin Yang , Shi-Chang Chen
CPC classification number: H05K1/144 , G06F1/1643 , G06F1/1652 , H05K1/147 , H05K1/181 , H05K3/007 , H05K2201/058 , H05K2201/10128 , H05K2203/0228
Abstract: A flexible electronic device includes a first flexible substrate, a first electronic component, a second flexible substrate, a second electronic component and an adhesive layer disposed between the first flexible substrate and the second flexible substrate. The first electronic component is disposed on a first surface of the first flexible substrate. The second electronic component is disposed on a first surface of the second flexible substrate. The first surface of the first flexible substrate has a first FPC bonding area having an orthogonal projection projected on a plane where the second flexible substrate is located does not overlap the second flexible substrate. The first surface of the second flexible substrate has a second FPC bonding area having an orthogonal projection projected on a plane where the first flexible substrate is located does not overlap the first flexible substrate.
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9.发明申请ELECTRONIC DEVICE PACKAGE, ELECTRONIC DEVICE STRUCTURE AND METHOD OF FABRICATING ELECTRONIC DEVICE PACKAGE 有权电子设备包装，电子设备结构和制造电子设备包装的方法公开(公告)号：US20160315044A1
公开(公告)日：2016-10-27
申请号：US15199913
申请日：2016-06-30
Applicant: Industrial Technology Research Institute
Inventor： Wei-Yuan Cheng , Chen-Chu Tsai , Yuh-Zheng Lee
IPC: H01L23/498 , H01L21/683 , H01L23/31
CPC classification number: H05K1/028 , H01L21/6835 , H01L23/3128 , H01L23/3135 , H01L23/49827 , H01L23/49838 , H01L23/4985 , H01L2221/68318 , H01L2221/68345 , H01L2221/68359 , H01L2221/68381 , H01L2224/16 , H01L2924/181 , H05K1/0281 , H05K1/115 , H05K3/0032 , H05K3/007 , H05K3/4038 , H05K2201/0145 , H05K2201/0154 , H05K2201/10106 , H05K2201/10128 , H05K2201/2009 , H05K2203/1178 , H01L2924/00012
Abstract: According to embodiments of the disclosure, an electronic device package may include a wire layer and a rigid element. The wire layer includes a first surface and a second surface opposite to each other, and the second surface of the wire layer has at least one coarse structure. A portion of the second surface having the coarse structure has a greater roughness than another portion of the second surface. The rigid element is disposed on the first surface of the wire layer, wherein a stiffness of the rigid element is greater than a stiffness of the wire layer and a projection area of the coarse structure on the first surface of the wire layer overlaps an edge of the rigid element.
Abstract translation: 根据本公开的实施例，电子设备封装可以包括导线层和刚性元件。 线层包括彼此相对的第一表面和第二表面，并且线层的第二表面具有至少一个粗糙结构。 具有粗糙结构的第二表面的一部分具有比第二表面的另一部分更大的粗糙度。 刚性元件设置在线层的第一表面上，其中刚性元件的刚度大于金属丝层的刚度，并且粗糙结构在金属丝层的第一表面上的投影区域与 刚性元素。
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公开(公告)号：US09847509B2
公开(公告)日：2017-12-19
申请号：US15003803
申请日：2016-01-22
Applicant: Industrial Technology Research Institute
Inventor： Kun-Ming Chen , Chen-Chu Tsai , Yuh-Zheng Lee , Kuo-Lung Lo
IPC: H01L51/52
CPC classification number: H01L51/5256 , H01L51/5246 , H01L2251/5338 , H01L2251/558
Abstract: A flexible environmental sensitive electronic device package including a flexible electronic device, a thin film encapsulation (TFE) and a sealing member is provided. The TFE covers the flexible electronic device as well as the sealing member covers the TFE and the flexible electronic device. The sealing member includes a first portion and a second portion, wherein the first portion covers the flexible electronic device and the TFE, and the second portion covers the first portion. Young's modulus of the second portion is between the 0 MPa and 100 MPa. Young's modulus of the first portion is greater than that of the second portion. The thickness of the first portion is less than that of the second portion.
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