公开(公告)号：US10483250B2

公开(公告)日：2019-11-19

申请号：US15765992

申请日：2015-11-04

Applicant: Intel Corporation

Inventor： Vijay K. Nair ,  Adel A. Elsherbini ,  Lakshman Krishnamurthy ,  Johanna M. Swan ,  Alexander Essaian ,  Torrey W. Frank

IPC: H01L25/16 ,  H01L23/48 ,  H01L23/00 ,  H01L25/10 ,  H01L23/538 ,  H01L25/00 ,  H01L21/56 ,  H01L23/498

Abstract: Embodiments are generally directed to three-dimensional small form factor system in package architecture. An embodiment of an apparatus includes a first package having a first side and an opposite second side, the first package including a plurality of embedded electronic components and one or more embedded via bars, each via bar including a plurality of through vias; and a second package having a first side and an opposite second side, the second package including a plurality of embedded electronic components, wherein a first side of the first package and a second side of second package are coupled together by a plurality of connections, including at least a first connection connecting the second package to a first component of the first package and a second connection connecting the second package to a first via bar of the one or more via bars.

公开(公告)号：US10128177B2

公开(公告)日：2018-11-13

申请号：US14433369

申请日：2014-05-06

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Adel A. Elsherbini ,  Torrey W. Frank

IPC: H01L21/00 ,  H01L23/498 ,  G06F1/16 ,  H01L21/288 ,  H01L23/522 ,  H01L23/66 ,  H01L23/14 ,  H01L21/48 ,  H01L23/00

Abstract: Embodiments of the present disclosure describe a multi-layer package with antenna and associated techniques and configurations. In one embodiment, an integrated circuit (IC) package assembly includes a first layer having a first side and a second side disposed opposite to the first side a second layer coupled with the first side of the first layer, one or more antenna elements coupled with the second layer and a third layer coupled with the second side of the first layer, wherein the first layer is a reinforcement layer having a tensile modulus that is greater than a tensile modulus of the second layer and the third layer. Other embodiments may be described and/or claimed.