公开(公告)号：US20130244424A1

公开(公告)日：2013-09-19

申请号：US13886836

申请日：2013-05-03

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Daniel C. EDELSTEIN ,  Takeshi NOGAMI

IPC: H01L21/768

CPC classification number: H01L21/76841 ,  H01L21/76849 ,  H01L21/76867 ,  H01L21/76877 ,  H01L21/76882 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Interconnect structures and methods of manufacturing the same are disclosed herein. The method includes forming a barrier layer within a structure and forming an alloy metal on the barrier layer. The method further includes forming a pure metal on the alloy metal, and reflowing the pure metal such that the pure metal migrates to a bottom of the structure, while the alloy metal prevents exposure of the barrier layer. The method further includes completely filling in the structure with additional metal.

公开(公告)号：US20130214416A1

公开(公告)日：2013-08-22

申请号：US13777554

申请日：2013-02-26

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Daniel C. EDELSTEIN ,  Takeshi NOGAMI

IPC: H01L23/532

CPC classification number: H01L21/76841 ,  H01L21/76849 ,  H01L21/76867 ,  H01L21/76877 ,  H01L21/76882 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Interconnect structures and methods of manufacturing the same are disclosed herein. The method includes forming a barrier layer within a structure and forming an alloy metal on the barrier layer. The method further includes forming a pure metal on the alloy metal, and reflowing the pure metal such that the pure metal migrates to a bottom of the structure, while the alloy metal prevents exposure of the barrier layer. The method further includes completely filling in the structure with additional metal.