公开(公告)号：US11652012B2

公开(公告)日：2023-05-16

申请号：US16913188

申请日：2020-06-26

Applicant: Infineon Technologies AG

Inventor： Edmund Riedl ,  Steffen Jordan ,  Stefan Miethaner ,  Stefan Schwab

IPC: H01L23/29 ,  H01L21/56

CPC classification number: H01L23/29 ,  H01L21/56

Abstract: A package includes an electronic component, an inorganic encapsulant encapsulating at least part of the electronic component, and an adhesion promoter between at least part of the electronic component and the encapsulant.

公开(公告)号：US11069626B2

公开(公告)日：2021-07-20

申请号：US16385337

申请日：2019-04-16

Applicant: Infineon Technologies AG

Inventor： Anton Mauder ,  Oliver Hellmund ,  Peter Irsigler ,  Hanno Melzner ,  Stefan Miethaner ,  Sebastian Schmidt ,  Hans-Joachim Schulze

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L23/00 ,  H01L25/07 ,  H01L23/29

Abstract: A molding compound and a semiconductor arrangement with a molding compound are disclosed. The molding compound includes a matrix and a filler including filler particles. The filler particles each include a core with an electrically conducting or a semiconducting material and an electrically insulating cover.