公开(公告)号：US20210132306A1

公开(公告)日：2021-05-06

申请号：US17120039

申请日：2020-12-11

Applicant: Intel Corporation

Inventor： Alexander Krichevsky ,  John M. Heck

IPC: G02B6/42 ,  H01L25/16 ,  H01L31/0203

Abstract: An optical system can include a optical receiver comprising an optical waveguide, an optical lid adjacent the waveguide, and a reflective surface proximate an output of the optical waveguide to direct light from the waveguide towards an output of the optical lid. The optical system can also include a photodetector (PD) die comprising a substrate, a concave mirror, and a photodetector. The concave mirror is formed on a first side of the substrate and the photodetector is disposed on a second side of the substrate, the first side opposite the second side, wherein the photodetector is disposed on the second side of the PD die offset from the optical axis of the optical element.

公开(公告)号：US20190123109A1

公开(公告)日：2019-04-25

申请号：US16225130

申请日：2018-12-19

Applicant: Intel Corporation

Inventor： Boping Xie ,  Ansheng Liu ,  Olufemi Isiade Dosunmu ,  Alexander Krichevsky ,  Kelly Christopher Magruder ,  Harel Frish

IPC: H01L27/30 ,  G02B6/42 ,  G02B27/09 ,  G02B7/04 ,  H05K1/02

Abstract: Optical receiver packages and device assemblies that include photodetector (PD) chips having focus lenses monolithically integrated on PD die backsides are disclosed. An example receiver package includes a support structure, a PD die, and an optical input device. The PD die includes a PD, integrated proximate to a first face of the PD die, and further includes a lens, integrated on, or proximate to, an opposite second face. The first face of the PD die faces the support structure, while the second face (“backside”) faces the optical input device. The optical receiver architectures described herein may provide an improvement for the optical alignment tolerance issues, especially for high-speed operation in which the active aperture of the PD may have to be very small. Furthermore, architectures described herein advantageously enable integrating a focus lens in a PD die that may be coupled to the support structure in a flip-chip arrangement.

公开(公告)号：US20210058159A1

公开(公告)日：2021-02-25

申请号：US17075372

申请日：2020-10-20

Applicant: Intel Corporation

Inventor： Alexander Krichevsky ,  Boping Xie

IPC: H04B10/40 ,  H04B10/079 ,  H04B10/516

Abstract: Embodiments of the present disclosure are directed to an optical transceiver within a single device. The optical transceiver incorporates an optical isolator, thus eliminating the need for an external isolator unit. In embodiments, transmitter channels and receiver channels share a single lens array and incorporate a compensator block to equalize the transmitter and receiver optical signals in the transceiver. Other embodiments may be described and/or claimed.