公开(公告)号：US11906777B2

公开(公告)日：2024-02-20

申请号：US16797657

申请日：2020-02-21

申请人： Intel Corporation

发明人： John Heck ,  Lina He ,  Sungbong Park ,  Olufemi Isiade Dosunmu ,  Harel Frish ,  Kelly Christopher Magruder ,  Seth M. Slavin ,  Wei Qian ,  Ansheng Liu ,  Nutan Gautam ,  Mark Isenberger

IPC分类号： G02B6/12 ,  H04J14/02 ,  G02B6/122

CPC分类号： G02B6/12007 ,  G02B6/12004 ,  G02B6/1228 ,  H04J14/02 ,  G02B2006/12061

摘要： Embodiments may relate to a wavelength-division multiplexing (WDM) transceiver that has a silicon waveguide layer coupled with a silicon nitride waveguide layer. In some embodiments, the silicon waveguide layer may include a tapered portion that is coupled with the silicon nitride waveguide layer. In some embodiments, the silicon waveguide layer may be coupled with a first oxide layer with a first z-height, and the silicon nitride waveguide layer may be coupled with a second oxide layer with a second z-height that is greater than the first z-height. Other embodiments may be described or claimed.

公开(公告)号：US11251228B2

公开(公告)日：2022-02-15

申请号：US16225130

申请日：2018-12-19

申请人： Intel Corporation

发明人： Boping Xie ,  Ansheng Liu ,  Olufemi Isiade Dosunmu ,  Alexander Krichevsky ,  Kelly Christopher Magruder ,  Harel Frish

IPC分类号： H01L27/30 ,  G02B6/42 ,  H05K1/02 ,  G02B27/09 ,  G02B7/04

摘要： Optical receiver packages and device assemblies that include photodetector (PD) chips having focus lenses monolithically integrated on PD die backsides are disclosed. An example receiver package includes a support structure, a PD die, and an optical input device. The PD die includes a PD, integrated proximate to a first face of the PD die, and further includes a lens, integrated on, or proximate to, an opposite second face. The first face of the PD die faces the support structure, while the second face (“backside”) faces the optical input device. The optical receiver architectures described herein may provide an improvement for the optical alignment tolerance issues, especially for high-speed operation in which the active aperture of the PD may have to be very small. Furthermore, architectures described herein advantageously enable integrating a focus lens in a PD die that may be coupled to the support structure in a flip-chip arrangement.

公开(公告)号：US20190123109A1

公开(公告)日：2019-04-25

申请号：US16225130

申请日：2018-12-19

申请人： Intel Corporation

发明人： Boping Xie ,  Ansheng Liu ,  Olufemi Isiade Dosunmu ,  Alexander Krichevsky ,  Kelly Christopher Magruder ,  Harel Frish

IPC分类号： H01L27/30 ,  G02B6/42 ,  G02B27/09 ,  G02B7/04 ,  H05K1/02

摘要： Optical receiver packages and device assemblies that include photodetector (PD) chips having focus lenses monolithically integrated on PD die backsides are disclosed. An example receiver package includes a support structure, a PD die, and an optical input device. The PD die includes a PD, integrated proximate to a first face of the PD die, and further includes a lens, integrated on, or proximate to, an opposite second face. The first face of the PD die faces the support structure, while the second face (“backside”) faces the optical input device. The optical receiver architectures described herein may provide an improvement for the optical alignment tolerance issues, especially for high-speed operation in which the active aperture of the PD may have to be very small. Furthermore, architectures described herein advantageously enable integrating a focus lens in a PD die that may be coupled to the support structure in a flip-chip arrangement.