公开(公告)号：US20230204877A1

公开(公告)日：2023-06-29

申请号：US17561694

申请日：2021-12-23

Applicant: Intel Corporation

Inventor： John M. Heck ,  Haisheng Rong ,  Harel Frish ,  Ankur Agrawal ,  Boping Xie ,  Randal S. Appleton ,  Hari Mahalingam ,  Alexander Krichevsky ,  Pooya Tadayon ,  Ling Liao ,  Eric J. M. Moret

IPC: G02B6/42

CPC classification number: G02B6/4207 ,  G02B6/4214 ,  G02B6/428

Abstract: Technologies for beam expansion and collimation for photonic integrated circuits (PICs) are disclosed. In one embodiment, an ancillary die is bonded to a PIC die. Vertical couplers in the PIC die direct light from waveguides to flat mirrors on a top side of the ancillary die. The flat mirrors reflect the light towards curved mirrors defined in the bottom surface of the ancillary die. The curved mirrors collimate the light from the waveguides. In another embodiment, a cavity is formed in a PIC die, and curved mirrors are formed in the cavity. Light beams from waveguides in the PIC die are directed to the curved mirrors, which collimate the light beams.

公开(公告)号：US10852491B2

公开(公告)日：2020-12-01

申请号：US16228577

申请日：2018-12-20

Applicant: Intel Corporation

Inventor： Alexander Krichevsky

IPC: G02B6/42

Abstract: There is disclosed in one example a computing apparatus, including: a fiber-optic transmitter including a laser source; an input waveguide to receive a modulated laser pulse from the laser source; an output waveguide to direct the modulated laser pulse to an external communication element; and an isolator bridge optically coupled to the input waveguide and output waveguide, the isolator bridge including an input lens, an input-side folding prism, an isolator element, an output-side folding prism, and an output lens, wherein an input light pulse through the input lens is to be redirected by the input-side folding prism through the isolator element to the output-side folding prism, and redirected by the output-side folding prism through the output lens.

公开(公告)号：US12298556B2

公开(公告)日：2025-05-13

申请号：US17352098

申请日：2021-06-18

Applicant: Intel Corporation

Inventor： Alexander Krichevsky ,  Boping Xie

IPC: G02B6/12 ,  C03B37/025 ,  C03C27/10 ,  G02B6/13

Abstract: A photonic integrated circuit (PIC) package comprising a first die, the first die comprising a first optical waveguide and a first trench extending from a first edge of the first die to the first optical waveguide. The first trench is aligned with the first optical waveguide. A second die comprises a second optical waveguide and a second trench extending from a second edge of the second die to the second optical waveguide. The second trench is aligned with the second optical waveguide. An optical wire comprising an uncladded glass fiber comprises a first terminal portion extending within the first trench and a second terminal portion extending within the second trench. The first terminal portion is aligned with the first optical waveguide and the second terminal portion is aligned with the second optical waveguide.

公开(公告)号：US20240361541A1

公开(公告)日：2024-10-31

申请号：US18309123

申请日：2023-04-28

Applicant: Intel Corporation

Inventor： Alexander Krichevsky ,  Boping Xie ,  Sunil Priyadarshi ,  Chao Tian ,  Guojiang Hu ,  Hari Mahalingam ,  Haijiang Yu

IPC: G02B6/42

CPC classification number: G02B6/4206 ,  G02B6/42 ,  G02B6/4214

Abstract: Method and apparatus for vision assisted optical alignment. In the apparatus, one or more main waveguides of a photonic integrated circuit (PIC) are selected, and respective one or more corresponding auxiliary waveguides are terminated with a respective scattering structure. The scattering structures deflect externally supplied light out of the PIC for detection by a camera or photo detector to provide feedback on the amount of light coupled into the main waveguides during the optical alignment process. The method and apparatus eliminate the need to power up the PIC circuitry, speed up the subsequent alignment process, and allow control and failure analysis of multiple channels at once.

公开(公告)号：US12052058B2

公开(公告)日：2024-07-30

申请号：US17075372

申请日：2020-10-20

Applicant: Intel Corporation

Inventor： Alexander Krichevsky ,  Boping Xie

IPC: H04B10/40 ,  H04B10/079 ,  H04B10/516

CPC classification number: H04B10/40 ,  H04B10/0795 ,  H04B10/5161

Abstract: Embodiments of the present disclosure are directed to an optical transceiver within a single device. The optical transceiver incorporates an optical isolator, thus eliminating the need for an external isolator unit. In embodiments, transmitter channels and receiver channels share a single lens array and incorporate a compensator block to equalize the transmitter and receiver optical signals in the transceiver. Other embodiments may be described and/or claimed.

公开(公告)号：US20220404546A1

公开(公告)日：2022-12-22

申请号：US17352098

申请日：2021-06-18

Applicant: Intel Corporation

Inventor： Alexander Krichevsky ,  Boping Xie

IPC: G02B6/12 ,  G02B6/13 ,  C03B37/025 ,  C03C27/10

Abstract: A photonic integrated circuit (PIC) package comprising a first die, the first die comprising a first optical waveguide and a first trench extending from a first edge of the first die to the first optical waveguide. The first trench is aligned with the first optical waveguide. A second die comprises a second optical waveguide and a second trench extending from a second edge of the second die to the second optical waveguide. The second trench is aligned with the second optical waveguide. An optical wire comprising an uncladded glass fiber comprises a first terminal portion extending within the first trench and a second terminal portion extending within the second trench. The first terminal portion is aligned with the first optical waveguide and the second terminal portion is aligned with the second optical waveguide.

公开(公告)号：US20190146164A1

公开(公告)日：2019-05-16

申请号：US16228577

申请日：2018-12-20

Applicant: Intel Corporation

Inventor： Alexander Krichevsky

IPC: G02B6/42

Abstract: There is disclosed in one example a computing apparatus, including: a fiber-optic transmitter including a laser source; an input waveguide to receive a modulated laser pulse from the laser source; an output waveguide to direct the modulated laser pulse to an external communication element; and an isolator bridge optically coupled to the input waveguide and output waveguide, the isolator bridge including an input lens, an input-side folding prism, an isolator element, an output-side folding prism, and an output lens, wherein an input light pulse through the input lens is to be redirected by the input-side folding prism through the isolator element to the output-side folding prism, and redirected by the output-side folding prism through the output lens.

公开(公告)号：US12253723B2

公开(公告)日：2025-03-18

申请号：US17120039

申请日：2020-12-11

Applicant: Intel Corporation

Inventor： Alexander Krichevsky ,  John M. Heck

IPC: G02B6/42 ,  H01L25/16 ,  H01L31/0203

Abstract: An optical system can include a optical receiver comprising an optical waveguide, an optical lid adjacent the waveguide, and a reflective surface proximate an output of the optical waveguide to direct light from the waveguide towards an output of the optical lid. The optical system can also include a photodetector (PD) die comprising a substrate, a concave mirror, and a photodetector. The concave mirror is formed on a first side of the substrate and the photodetector is disposed on a second side of the substrate, the first side opposite the second side, wherein the photodetector is disposed on the second side of the PD die offset from the optical axis of the optical element.

公开(公告)号：US20230204876A1

公开(公告)日：2023-06-29

申请号：US17561286

申请日：2021-12-23

Applicant: Intel Corporation

Inventor： Alexander Krichevsky ,  Boping Xie

IPC: G02B6/42

CPC classification number: G02B6/4207 ,  G02B6/4214

Abstract: Technologies for coupling to and from a photonic integrated circuit (PIC) with an optical isolator are disclosed. In one embodiment, light beams from waveguides on a PIC die are reflected towards flat mirrors on the bottom surface of the PIC die. The flat mirrors reflect the light towards curved mirrors defined in a top surface of the PIC die, which collimate the beam and direct the collimated beams out the bottom surface of the PIC die. An optical isolator below the PIC die can allow the beams to pass while blocking beams in the opposite direction.

公开(公告)号：US11251228B2

公开(公告)日：2022-02-15

申请号：US16225130

申请日：2018-12-19

Applicant: Intel Corporation

Inventor： Boping Xie ,  Ansheng Liu ,  Olufemi Isiade Dosunmu ,  Alexander Krichevsky ,  Kelly Christopher Magruder ,  Harel Frish

IPC: H01L27/30 ,  G02B6/42 ,  H05K1/02 ,  G02B27/09 ,  G02B7/04

Abstract: Optical receiver packages and device assemblies that include photodetector (PD) chips having focus lenses monolithically integrated on PD die backsides are disclosed. An example receiver package includes a support structure, a PD die, and an optical input device. The PD die includes a PD, integrated proximate to a first face of the PD die, and further includes a lens, integrated on, or proximate to, an opposite second face. The first face of the PD die faces the support structure, while the second face (“backside”) faces the optical input device. The optical receiver architectures described herein may provide an improvement for the optical alignment tolerance issues, especially for high-speed operation in which the active aperture of the PD may have to be very small. Furthermore, architectures described herein advantageously enable integrating a focus lens in a PD die that may be coupled to the support structure in a flip-chip arrangement.