公开(公告)号：US20190044514A1

公开(公告)日：2019-02-07

申请号：US15852814

申请日：2017-12-22

Applicant: Intel Corporation

Inventor： Archanna Srinivasan ,  Guang Chen ,  Jun Pin Tan

IPC: H03K19/003 ,  H03K19/177 ,  H03K19/00

Abstract: An integrated circuit configured to execute multiple operations in parallel is provided. The integrated circuit may be organized into multiple logic sectors. Two or more groups of logic sectors may be executed in an interleaved fashion, where successive groups of logic sectors are activated after a predetermined amount of delay. The integrated circuit may include an array of memory cells. Rows of the memory cells may be accessed in an interleaving manner, where successive rows of memory cells are selected after a predetermined amount of delay. Operating groups of circuit components using an interleaving scheme can help improve operational efficiency while reducing power supply noise without having to increase die area for on-die decoupling capacitance.