公开(公告)号：US20160020051A1

公开(公告)日：2016-01-21

申请号：US14368771

申请日：2013-12-17

Applicant: INTEL CORPORATION

Inventor： Qing Ma ,  Johanna Swan ,  Valluri Rao ,  Feras Eid

IPC: H01H59/00 ,  H01Q5/314 ,  H01H50/00

CPC classification number: H01H59/0009 ,  H01H50/005 ,  H01H2229/016 ,  H01H2229/05 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01Q5/314

Abstract: An electronic device and methods including a switch formed in a chip package are shown. An electronic device and methods including a switch formed in a polymer based dielectric are shown. Examples of switches shown include microelectromechanical system (MEMS) structures, such as cantilever switches and/or shunt switches.

Abstract translation: 示出了包括形成在芯片封装中的开关的电子装置和方法。 示出了包括形成在基于聚合物的电介质中的开关的电子装置和方法。 所示的开关的示例包括微机电系统（MEMS）结构，例如悬臂开关和/或分流开关。