Abstract:
A semiconductor device, such as a positive channel metal-oxide semiconductor (PMOS) transistor, and a fabricating method thereof are provided. The semiconductor device includes: a gate insulation layer and a gate electrode, a semiconductor substrate, a spacer formed on side walls of the gate insulation layer and the gate electrode, a lightly doped drain (LDD) area formed on the semiconductor substrate at both sides of the gate electrode, a source/drain area formed on the semiconductor substrate at both sides of the gate electrode, and an oxide-nitride layer formed on the gate electrode and on the source/drain area.
Abstract:
Disclosed herein is an ion implantation apparatus for use in manufacturing of a semiconductor device, which has a software program including an option for selecting a manipulator, enabling a time for beam tuning to be minimized. The ion implantation apparatus further includes a manipulator for extracting and focusing an ion source and an ion beam, a control block for controlling overall operation of the ion implantation apparatus and recognizing a newly installed manipulator, and a control window on which a selection menu is displayed, allowing recipe data to be selected on a screen. When installing a replacement manipulator, recipe data for the replacement manipulator can be selected to improve beam tuning set up time.