专利检索 ap:("Jin-Ho Kim" OR "In-Ku Kang" OR "Hee-Kook Choi") AND inv:"Hee-Kook Choi" 第 2 页

11.

发明申请
Memory module, socket and mounting method providing improved heat dissipating characteristics 有权
标题翻译：内存模块，插座和安装方法，提供改善的散热特性

公开(公告)号：US20050245137A1

公开(公告)日：2005-11-03

申请号：US11093236

申请日：2005-03-30

申请人： Sang-Wook Park , Joong-Hyun Baek , Hae-Hyung Lee , Hee-Kook Choi , Jin-Yang Lee

发明人： Sang-Wook Park , Joong-Hyun Baek , Hae-Hyung Lee , Hee-Kook Choi , Jin-Yang Lee

IPC分类号： H01L23/50 , H01R13/62 , H05K3/30

CPC分类号： H01R12/721 , H05K3/305 , H05K3/306 , H05K2201/0133 , H05K2201/10189 , H05K2201/10446 , H05K2203/1147 , H05K2203/304 , Y02P70/613

摘要： In a memory module, a gap filler for eliminating an air gap may be formed on an end of a PCB where a tab may be formed. The gap filler may be formed on a surface of a socket receiving the memory module. A grease may be coated on the tab to provide a heat conduction path away from the memory module.

摘要翻译： 在存储器模块中，可以在PCB的可以形成突片的端部上形成用于消除气隙的间隙填充物。间隙填料可以形成在接收存储器模块的插座的表面上。可以在突片上涂覆润滑脂以提供远离存储器模块的热传导路径。