公开(公告)号：US20190219251A1

公开(公告)日：2019-07-18

申请号：US16161221

申请日：2018-10-16

申请人： LiliBrand LLC

发明人： Ariel Meir ,  Noam Meir ,  Rina Meir

IPC分类号： F21V17/04 ,  H01L33/50 ,  H01L33/60 ,  H05K3/28 ,  G02B27/30 ,  H05K1/18 ,  H05K1/02 ,  F21S8/04 ,  F21V5/04 ,  H01L33/58

CPC分类号： F21V17/04 ,  F21S8/033 ,  F21S8/04 ,  F21V5/04 ,  F21V13/04 ,  F21W2131/10 ,  F21Y2103/10 ,  F21Y2115/10 ,  G02B19/0061 ,  G02B27/30 ,  H01L33/502 ,  H01L33/58 ,  H01L33/60 ,  H01L2933/0091 ,  H05K1/0274 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0133 ,  H05K2201/10106 ,  H05K2203/1316 ,  H05K2203/1327

摘要： According to at least one aspect, a lighting device is provided. The lighting device comprises a circuit board, a light emitting diode (LED) mounted to the circuit board and configured to emit light, a lens disposed over the LED having a bottom surface facing the circuit board, a top surface opposite the bottom surface, and a lateral surface between the top and bottom surfaces, and an elastomer encapsulating at least part of the circuit board. The elastomer may not be in contact with at least part of the lateral surface of the lens so as to form a gap between the elastomer and the lateral surface of the lens.

公开(公告)号：US20190011092A1

公开(公告)日：2019-01-10

申请号：US16004936

申请日：2018-06-11

申请人： Lilibrand LLC

发明人： Ariel Meir

IPC分类号： F21S4/22 ,  H05K3/30 ,  H05K3/28 ,  H05K3/36 ,  H05K1/14 ,  F21Y115/10

CPC分类号： F21S4/22 ,  F21K9/64 ,  F21Y2115/10 ,  H05K1/142 ,  H05K3/284 ,  H05K3/285 ,  H05K3/30 ,  H05K3/361 ,  H05K2201/0133 ,  H05K2201/10106 ,  H05K2203/1305 ,  Y10T29/49126

摘要： According to at least one aspect, a lighting system is provided. The lighting system includes a first lighting device comprising a first light emitting diode (LED), a second lighting device comprising a second LED, a two-part connector configured to electrically couple the first lighting device to the second lighting device and comprising a first connector portion attached to the first lighting device and a second connector portion attached to the second lighting device, at least one elastomer commonly encapsulating the first lighting device, the second lighting device, and the two-part connector, and a cutting device configured to facilitate separation of the first lighting device from the second lighting device at least in part by cutting at least some of the at least one elastomer that is adjacent a surface of the two-part connector.

公开(公告)号：US20180317318A1

公开(公告)日：2018-11-01

申请号：US15950479

申请日：2018-04-11

申请人： Seiko Epson Corporation

发明人： Yohei YAMADA ,  Tomoyuki KAMAKURA

IPC分类号： H05K1/02 ,  H05K1/18 ,  G01B7/16

CPC分类号： H05K1/0283 ,  G01B7/20 ,  H05K1/111 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0133 ,  H05K2201/0191 ,  H05K2201/09281 ,  H05K2201/09736 ,  H05K2201/10151 ,  H05K2201/10439 ,  H05K2201/2009 ,  H05K2203/1316 ,  H05K2203/1322

摘要： A stretchable circuit board includes a stretchable substrate, a stretchable conducting film placed on one surface of the stretchable substrate and elongated in a first direction, an electric element placed on the one surface of the stretchable substrate, and a covering portion that covers a part of the stretchable conducting film and at least a part of the electric element, wherein, when an area of a first section as a section along an outer circumference of the covering portion in the stretchable conducting film is referred to as a first area and an area of a second section as a section of the stretchable conducting film orthogonal to the first direction in a location apart from the outer circumference of the covering portion toward outside is referred to as a second area, the first area is larger than the second area.

公开(公告)号：US10057981B2

公开(公告)日：2018-08-21

申请号：US15141867

申请日：2016-04-29

申请人： INDUSTRY FOUNDATION OF CHONNAM NATIONAL UNIVERSITY

发明人： Dong-Weon Lee ,  Guangyong Li

IPC分类号： H05K1/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/24

CPC分类号： H05K1/0283 ,  H05K3/007 ,  H05K3/246 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2203/016

摘要： A stretchable circuit board has stretchability as well as flexibility of the flexible substrate and retains mechanical and electrical properties even under larger deformation such as bending, twisting, etc. The liquid metal pattern can exhibit stretchability almost the same as that of the polymer substrate due to the liquid metal being fully wetted on the substrate with metal patterns based on the wetting behavior of the liquid metal. Therefore, the stretchable circuit board can achieve both mechanical and electrical properties even under physical deformation such as bending, stretching and twisting. It is demonstrated that the stretchable circuit board can be effectively applied to wearable tactile interfaces, stretchable solar cell arrays, stretchable displays, and wearable electronic devices.

公开(公告)号：US20180116049A1

公开(公告)日：2018-04-26

申请号：US15569647

申请日：2017-01-30

申请人： NIPPON MEKTRON, LTD.

发明人： Masayuki Iwase ,  Takeo Wakabayashi ,  Eiji Mizuno

IPC分类号： H05K1/02 ,  H01R12/77 ,  H01R43/20 ,  H01R12/70 ,  H05K3/00

CPC分类号： H05K1/0281 ,  B32B25/00 ,  B32B27/00 ,  H01R12/7041 ,  H01R12/771 ,  H01R43/205 ,  H05K1/0283 ,  H05K1/03 ,  H05K1/14 ,  H05K3/0011 ,  H05K3/28 ,  H05K3/36 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2203/065 ,  H05K2203/0759 ,  H05K2203/0783

摘要： The stretchable circuit board (100) includes: a stretchable base (10); a stretchable wiring portion (20) formed on the stretchable base (10); a reinforcement base (30) having in-plane rigidity higher than that of the stretchable base (10); a draw-out wiring portion (40) formed on the reinforcement base (30), and electrically continuous with the stretchable wiring portion (20); and an elastomer layer (50) formed on the reinforcement base (30). The reinforcement base (30) overlaps with a partial area (10a) of the stretchable base (10). An other area (10b) of the stretchable base (10) is exposed from the reinforcement base (30). The stretchable wiring portion (20) extends on the other area (10b) and over the partial area (10a). The elastomer layer (50) and the stretchable base (10) are layered and joined with each other.

公开(公告)号：US09907189B2

公开(公告)日：2018-02-27

申请号：US14257192

申请日：2014-04-21

申请人： FUJIKURA LTD.

发明人： Nobuki Ueta

IPC分类号： H05K1/02 ,  H05K3/46 ,  H05K1/18

CPC分类号： H05K3/4697 ,  H05K1/186 ,  H05K1/189 ,  H05K3/4635 ,  H05K2201/0133 ,  H05K2201/09563 ,  H05K2201/10674 ,  H05K2203/063 ,  Y10T29/49126

摘要： A multi-layer wiring board is configured having stacked therein, in a stacking direction, via an adhesive layer, a plurality of printed wiring bases in each of which a wiring pattern and a via are formed on/in a resin base. A multi-layer wiring board includes a movable portion configured from an elastic member and a void portion, the movable portion being formed in the printed wiring bases and adhesive layer in a periphery of a matrix-shaped plurality of multi-layer wiring portions disposed at a certain interval as viewed in a planar manner, and the movable portion joining the plurality of multi-layer wiring portions such that each of the multi-layer wiring portions is displaceable in the stacking direction and a direction of surfaces of the printed wiring bases.

公开(公告)号：US20180054912A1

公开(公告)日：2018-02-22

申请号：US15243690

申请日：2016-08-22

申请人： John Michael Hannig

发明人： John Michael Hannig

IPC分类号： H05K7/18 ,  H05K7/20 ,  H05K7/14

CPC分类号： H05K7/18 ,  H05K1/0271 ,  H05K1/144 ,  H05K7/1417 ,  H05K7/142 ,  H05K7/1422 ,  H05K7/20009 ,  H05K2201/0133 ,  H05K2201/042 ,  H05K2201/10409 ,  H05K2201/2018

摘要： A frame for dampening vibrations in a printed circuit board (PCB) assembly is provided. The frame includes a substrate having a first surface and a second surface and multiple ridges extending from at least one of the first and second surfaces. The ridges define recesses, and at least one of the recesses is configured to accommodate an electronic component of a PCB in the PCB assembly. Also provided is a PCB assembly including a PCB and the frame.

公开(公告)号：US20170367225A1

公开(公告)日：2017-12-21

申请号：US15187617

申请日：2016-06-20

申请人： Avago Technologies General IP (Singapore) Pte. Ltd.

发明人： Deog Soon Choi ,  Ah Ron Lee

IPC分类号： H05K9/00 ,  H05K3/22

CPC分类号： H05K1/0216 ,  H05K3/0032 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/0133 ,  H05K2201/0715 ,  H05K2203/085

摘要： A method is provided for forming an internal electromagnetic interference (EMI) shield in a mold cap formed over a printed circuit board (PCB). The method includes forming a trench in the mold cap, the trench extending continuously from a first edge of the mold cap to a second edge of the mold cap, where the trench defines a trench pattern corresponding to desired locations of the internal EMI shield. The method further includes sealing an elastomeric pad on a top surface of the mold cap to form a channel, the channel including at least the trench formed in the mold cap; and filling the channel with a conductive epoxy using a vacuum configured to draw the conductive epoxy from a dispenser, connected to the first edge of the mold cap, through the channel to the second edge of the mold cap based on pressure differential.

公开(公告)号：US20170344055A1

公开(公告)日：2017-11-30

申请号：US15164559

申请日：2016-05-25

申请人： Intel Corporation

发明人： Aleksandar Aleksov ,  Javier Soto Gonzalez

IPC分类号： G06F1/16 ,  H05K1/03 ,  H05K3/32 ,  H05K1/18 ,  H05K3/22 ,  H05K1/02

CPC分类号： G06F1/163 ,  H01L23/5387 ,  H05K1/0281 ,  H05K1/0283 ,  H05K1/0296 ,  H05K1/0393 ,  H05K1/185 ,  H05K3/22 ,  H05K3/284 ,  H05K3/32 ,  H05K2201/0133 ,  H05K2201/09118 ,  H05K2201/09263 ,  H05K2201/10522 ,  H05K2201/2009 ,  H05K2203/1316 ,  H05K2203/1327

摘要： An electronic circuit may include an elastomeric substrate with an electronic die attached to the elastomer substrate at a first substrate area and one or more meander traces electrically coupled to the electronic die and encapsulated in the elastomer substrate at a second substrate area that is adjacent to the first substrate area. An inelastic, non-electronic, structural brace may be attached to the elastomeric substrate in the first substrate area.

公开(公告)号：US09768036B2

公开(公告)日：2017-09-19

申请号：US12152021

申请日：2008-05-12

申请人： Christian Göbl ,  Heiko Braml

发明人： Christian Göbl ,  Heiko Braml

IPC分类号： H01L23/48 ,  H01L21/44 ,  H01L21/48 ,  H01L23/373 ,  H01L23/00 ,  H05K3/12 ,  H05K3/24 ,  C04B35/645 ,  C04B37/02 ,  H01L23/498 ,  H01L25/07 ,  H05K1/03 ,  H05K3/06

CPC分类号： H01L21/4867 ,  C04B35/645 ,  C04B37/021 ,  C04B37/026 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/407 ,  C04B2237/408 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/72 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/05644 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/75317 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/1283 ,  H05K3/247 ,  H05K2201/0133 ,  H05K2201/035 ,  H05K2203/0191 ,  H05K2203/0278 ,  H05K2203/1131 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A power semiconductor substrate comprising an insulating planar base, at least one conductor track and at least one contact area as part of the conductor track, wherein a layer of a metallic material is disposed on the contact area by means of pressure sintering. The associated method comprises the steps of: producing a power semiconductor substrate that includes a planar insulating base, conductor tracks and contact areas; arranging a pasty layer, composed of a metallic material and a solvent, on at least one contact area of the power semiconductor substrate; and applying pressure to the pasty layer.