公开(公告)号：US09234095B2

公开(公告)日：2016-01-12

申请号：US14507156

申请日：2014-10-06

Applicant: KANEKA CORPORATION

Inventor： Shusuke Yoshihara ,  Kazuaki Matsumoto

IPC: C08L63/00 ,  C08L67/02 ,  C08K3/00 ,  C09K5/14 ,  C09K19/38 ,  F28F21/06

CPC classification number: C08L67/02 ,  C09K5/14 ,  C09K19/3804 ,  F28F21/06

Abstract: A resin composition includes (A) a thermally-conductive organic additive including a liquid crystalline thermoplastic resin which has a mainly-chain structure, wherein a main chain of the liquid crystalline thermoplastic resin contains mainly a repeating unit represented by the general formula (1): -M-Sp-  (1) where M represents a mesogenic group and Sp represents a spacer, (B) a thermosetting resin; and (C) an inorganic filler.

Abstract translation: 树脂组合物包括（A）包含具有主链结构的液晶热塑性树脂的导热有机添加剂，其中液晶热塑性树脂的主链主要包含由通式（1）表示的重复单元， ：-M-Sp-（1）其中M表示介晶基团，Sp表示间隔基，（B）热固性树脂; 和（C）无机填料。