公开(公告)号：US11629237B2

公开(公告)日：2023-04-18

申请号：US16688209

申请日：2019-11-19

Applicant: KANEKA CORPORATION

Inventor： Shusuke Yoshihara

IPC: C08J3/09 ,  C08J5/24 ,  C08L33/10 ,  C08L83/04 ,  C08L25/04 ,  C08F22/40 ,  C08F20/06 ,  C08F12/08

Abstract: A solvent composition includes an organic solvent including one or more organic solvents (A) and one or more organic solvents (B), and one or more types of core-shell polymer particles each comprising a core layer and a shell layer. The organic sol vents (A) have a polar teen δp of a Hansen solubility parameter of less than 11 and a hydrogen bond term δh of less than 10, and the organic solvents (B) satisfy at least one of 11 or more of the polar term δp or 10 or more of the hydrogen bond term δh. A weight ratio of (A) to (B) ranges from 15:85 to 95:5. Based on a total weight of the solvent composition, a content of the core-shell polymer particles is 20 to 40% by weight and a water content is 1% by weight or less.

公开(公告)号：US20200095385A1

公开(公告)日：2020-03-26

申请号：US16688209

申请日：2019-11-19

Applicant: KANEKA CORPORATION

Inventor： Shusuke Yoshihara

IPC: C08J3/09 ,  C08L33/10 ,  C08L83/04 ,  C08L25/04 ,  C08F22/40 ,  C08F20/06 ,  C08F12/08 ,  C08J5/24

Abstract: A solvent composition includes an organic solvent including one or more organic solvents (A) and one or more organic solvents (B), and one or more types of core-shell polymer particles each comprising a core layer and a shell layer. The organic sol vents (A) have a polar teen δp of a Hansen solubility parameter of less than 11 and a hydrogen bond term δh of less than 10, and the organic solvents (B) satisfy at least one of 11 or more of the polar term δp or 10 or more of the hydrogen bond term δh. A weight ratio of (A) to (B) ranges from 15:85 to 95:5. Based on a total weight of the solvent composition, a content of the core-shell polymer particles is 20 to 40% by weight and a water content is 1% by weight or less.

公开(公告)号：US20180298186A1

公开(公告)日：2018-10-18

申请号：US16016228

申请日：2018-06-22

Applicant: Kaneka Corporation

Inventor： Shusuke Yoshihara ,  Takashi Ando

IPC: C08L63/00 ,  C09K5/14 ,  C08L71/12 ,  C09J9/00 ,  C09J171/12 ,  H05K1/03 ,  H05K1/02

Abstract: A resin composition includes: a curable compound (α); a curing agent (β); a liquid crystal polymer (γ) that forms a liquid crystal phase at 190° C. or lower; and a filler (δ). A liquid crystal polymer composition includes: (I) a compound having two or more epoxy groups in the molecule; (II) a curing agent; (III) a liquid crystal polymer that forms a liquid crystal phase at 190° C. or lower; (IV) a thermal conductive filler; and (V) a solvent. A curable resin composition includes: (A) a thermoplastic resin; (B) a curable resin; (C) a curing agent; (D) an elastomer; and (E) an inorganic filler.

公开(公告)号：US20150025188A1

公开(公告)日：2015-01-22

申请号：US14507156

申请日：2014-10-06

Applicant: KANEKA CORPORATION

Inventor： Shusuke Yoshihara ,  Kazuaki Matsumoto

IPC: C08L67/02

CPC classification number: C08L67/02 ,  C09K5/14 ,  C09K19/3804 ,  F28F21/06

Abstract: A resin composition includes (A) a thermally-conductive organic additive including a liquid crystalline thermoplastic resin which has a mainly-chain structure, wherein a main chain of the liquid crystalline thermoplastic resin contains mainly a repeating unit represented by the general formula (1): -M-Sp-  (1) where M represents a mesogenic group and Sp represents a spacer, (B) a thermosetting resin; and (C) an inorganic filler.

Abstract translation: 树脂组合物包括（A）包含具有主链结构的液晶热塑性树脂的导热有机添加剂，其中液晶热塑性树脂的主链主要包含由通式（1）表示的重复单元， ：-M-Sp-（1）其中M表示介晶基团，Sp表示间隔基，（B）热固性树脂; 和（C）无机填料。

公开(公告)号：US11889623B2

公开(公告)日：2024-01-30

申请号：US17162000

申请日：2021-01-29

Applicant: KANEKA CORPORATION

Inventor： Shusuke Yoshihara

IPC: H05K1/03 ,  C08L9/00 ,  C08L51/04 ,  C08L63/00 ,  C08L71/12

CPC classification number: H05K1/0366 ,  C08L9/00 ,  C08L51/04 ,  C08L63/00 ,  C08L71/123 ,  C08L2207/53

Abstract: A metal-clad laminate and techniques using the metal-clad laminate are provided where the metal-clad laminate has excellent adhesiveness between a substrate and metal foil in addition to good dielectric characteristics and heat resistance. The metal-clad laminate includes an insulating layer in contact with metal foil where the insulating layer further includes a resin composition and a fibrous base material. The resin composition contains a specific resin (A) and specific core-shell polymer particles (B), and a surface of the metal foil has a ten-point average roughness (Rz) of not more than 2.0 μm.

公开(公告)号：US20210153346A1

公开(公告)日：2021-05-20

申请号：US17162000

申请日：2021-01-29

Applicant: KANEKA CORPORATION

Inventor： Shusuke Yoshihara

IPC: H05K1/03 ,  C08L9/00 ,  C08L63/00 ,  C08L71/12 ,  C08L51/04

Abstract: A metal-clad laminate and techniques using the metal-clad laminate are provided where the metal-clad laminate has excellent adhesiveness between a substrate and metal foil in addition to good dielectric characteristics and heat resistance. The metal-clad laminate includes an insulating layer in contact with metal foil where the insulating layer further includes a resin composition and a fibrous base material. The resin composition contains a specific resin (A) and specific core-shell polymer particles (B), and a surface of the metal foil has a ten-point average roughness (Rz) of not more than 2.0 μm.

公开(公告)号：US10253178B2

公开(公告)日：2019-04-09

申请号：US15477483

申请日：2017-04-03

Applicant: KANEKA CORPORATION

Inventor： Shusuke Yoshihara ,  Hidekazu Kawakubo ,  Keika Hattori ,  Kazuaki Matsumoto ,  Kazunori Saegusa

IPC: C08L67/03 ,  C08G63/193 ,  C08K5/13 ,  C08K5/524 ,  C08L69/00 ,  C08L67/02

Abstract: A method of improving flowability of polycarbonate or polyarylate includes mixing the polycarbonate or the polyarylate with a flowability improver including a polyester. The polyester is a polycondensate of monomers including a bisphenol component (B) and a dicarboxylic acid component (C) at a molar ratio satisfying (B):(C)=45:55-55:45. The polyester includes a portion derived from the bisphenol component (B) and the dicarboxylic acid component (C) in an amount of 50 mol % or more.

公开(公告)号：US09809735B2

公开(公告)日：2017-11-07

申请号：US15101270

申请日：2014-11-13

Applicant: Kaneka Corporation

Inventor： Shusuke Yoshihara ,  Syoji Ubukata ,  Kazuaki Matsumoto

IPC: C08G64/00 ,  C09K5/14 ,  C08K3/04 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38 ,  C08G63/185 ,  C08G63/193 ,  C08G63/78 ,  C08J5/18 ,  C08K7/18 ,  C08G63/02

CPC classification number: C09K5/14 ,  C08G63/185 ,  C08G63/193 ,  C08G63/78 ,  C08J5/18 ,  C08J2367/02 ,  C08K3/04 ,  C08K3/041 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38 ,  C08K7/18 ,  C08K2003/222 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2003/385 ,  C08K2201/001 ,  C08K2201/005 ,  C08L67/02

Abstract: The present invention relates to: (i) a resin composition having excellent thermal conductivity and capable of being processed into a thin-walled and flexible molded article, the resin composition containing: (a) a resin consisting of 40 to 60 mol % of a unit (A) having a biphenyl group, and 5 to 40 mol % of a linear unit (B), and 5 to 40 mol % of a linear unit (C), where a thermal conductivity of the resin itself is not less than 0.4 W/(m·K); and (b) an inorganic filler having thermal conductivity of not less than 1 W/(m·K), (ii) a heat-dissipating or heat-transferring resin material containing the resin composition, and (iii) a thermally conductive membrane containing the resin composition.

公开(公告)号：US20160304762A1

公开(公告)日：2016-10-20

申请号：US15101270

申请日：2014-11-13

Applicant: KANEKA CORPORATION

Inventor： Shusuke Yoshihara ,  Syoji Ubukata ,  Kazuaki Matsumoto

IPC: C09K5/14 ,  C08G63/78 ,  C08J5/18 ,  C08K3/38 ,  C08K7/18 ,  C08G63/193 ,  C08K3/22

CPC classification number: C09K5/14 ,  C08G63/185 ,  C08G63/193 ,  C08G63/78 ,  C08J5/18 ,  C08J2367/02 ,  C08K3/04 ,  C08K3/041 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38 ,  C08K7/18 ,  C08K2003/222 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2003/385 ,  C08K2201/001 ,  C08K2201/005 ,  C08L67/02

Abstract: The present invention relates to: (i) a resin composition having excellent thermal conductivity and capable of being processed into a thin-walled and flexible molded article, the resin composition containing: (a) a resin consisting of 40 to 60 mol % of a unit (A) having a biphenyl group, and 5 to 40 mol % of a linear unit (B), and 5 to 40 mol % of a linear unit (C), where a thermal conductivity of the resin itself is not less than 0.4 W/(m·K); and (b) an inorganic filler having thermal conductivity of not less than 1 W/(m·K), (ii) a heat-dissipating or heat-transferring resin material containing the resin composition, and (iii) a thermally conductive membrane containing the resin composition.

Abstract translation: 本发明涉及：（i）具有优异导热性且能够加工成薄壁且柔性的模制品的树脂组合物，该树脂组合物含有：（a）由40至60摩尔％的 具有联苯基的单元（A）和5〜40摩尔％的线性单元（B），以及5〜40摩尔％的线性单元（C），其中树脂本身的导热率不小于0.4 W /（m·K）; 和（b）导热率不小于1W /（m·K）的无机填料，（ii）含有该树脂组合物的散热或传热树脂材料，和（iii）含有 树脂组合物。

公开(公告)号：US20150014603A1

公开(公告)日：2015-01-15

申请号：US14383020

申请日：2013-03-01

Applicant: KANEKA CORPORATION

Inventor： Shusuke Yoshihara ,  Toshiaki Ezaki ,  Mitsuru Nakamura

IPC: C08K3/38 ,  B29C45/00 ,  C08K3/04 ,  B29C31/04

CPC classification number: C08K3/38 ,  B29C31/04 ,  B29C45/0013 ,  B29C45/0046 ,  B29K2067/00 ,  B29K2105/0047 ,  B29K2105/0058 ,  B29K2105/16 ,  B29K2995/0013 ,  C08K3/04 ,  C08K3/041 ,  C08K3/346 ,  C08K7/14 ,  C08K2003/385 ,  C09K19/02 ,  C09K19/2007 ,  C09K2019/521 ,  C08L67/02

Abstract: A resin molded article of the present invention includes at least a resin and an inorganic filler that is in a plate form, a spheroidal form, or a fiber form, in a region of 50% or more of a volume of the resin molded article, the resin having resin molecular chains oriented in a thickness direction of the resin molded article and the inorganic filler having a long axis oriented in an in-plane direction of the resin molded article, the resin molecular chains having an orientation degree α in a range of 0.6 or more and less than 1.0, the orientation degree being calculated by the following Formula (1), from a half-value width W obtained by wide-angle X-ray scattering measurement: orientation degree α=(360°−ΣW)/360°  (1), wherein W is a half-value width of a scattering peak between the resin molecular chains, in an intensity distribution in directions of azimuth angles in a range of 0° to 360° in the wide-angle X-ray scattering measurement.

Abstract translation: 本发明的树脂成型体在树脂成型体的体积的50％以上的区域中至少含有树脂和无机填料，其为板状，球形或纤维状， 所述树脂具有在树脂成形体的厚度方向上取向的树脂分子链和具有沿着树脂成型体的面内方向取向的长轴的无机填料，所述树脂分子链的取向度α为 0.6以上且小于1.0，通过广角X射线散射测定得到的半值宽度W，由下式（1）计算取向度：取向度α=（360°〜Sgr·W ）/ 360°（1），其中W是在广角X中在0°至360°的范围内的方位角方向上的强度分布中的树脂分子链之间的散射峰的半值宽度 射线散射测量。