公开(公告)号：US5681614A

公开(公告)日：1997-10-28

申请号：US595785

申请日：1996-02-02

申请人： Tsutae Omori ,  Kouji Harada ,  Takami Satoh ,  Noriyuki Anai ,  Masafumi Nomura

发明人： Tsutae Omori ,  Kouji Harada ,  Takami Satoh ,  Noriyuki Anai ,  Masafumi Nomura

IPC分类号： G03F7/16 ,  C23C16/44 ,  C23C16/448 ,  H01L21/027 ,  H01L21/30 ,  C23C16/52

CPC分类号： C23C16/4485 ,  C23C16/4412 ,  Y10S427/101

摘要： An apparatus for hydrophobic treatment of a semiconductor wafer comprises a tank in which HMDS liquid is stored, a process chamber in which the wafer is treated, and a unit for supplying HMDS liquid from the tank into the process chamber in an amount needed at any desired time. The process chamber can be decompressed by an ejector which is connected to the process chamber through an exhaust pipe. A mount on which the wafer is mounted is arranged in the process chamber and it includes a heater embedded therein. A ring surrounds the mount and two liquid receiving recesses are formed on the top of the ring. Two HMDS liquid supply pipes extend just above their corresponding liquid receiving recesses. HMDS in liquid phase is supplied into the process chamber and vaporized in it. The density of HMDS gas in the process chamber is controlled by adjusting the amount of HMDS liquid supplied.

摘要翻译： 用于半导体晶片的疏水处理的设备包括其中存储HMDS液体的罐，处理所述晶片的处理室，以及用于将HMDS液体从所述罐供应到所述处理室中的单元，其以任何所需的量 时间。 处理室可以通过排气管连接到处理室的喷射器进行减压。 安装有晶片的安装件布置在处理室中，并且其包括嵌入其中的加热器。 一个环围绕安装座，两个液体接收凹口形成在环的顶部。 两个HMDS液体供应管正好在其相应的液体接收凹槽上方延伸。 液相中的HMDS被供应到处理室中并在其中蒸发。 通过调节供应的HMDS液体的量来控制处理室中的HMDS气体的密度。

公开(公告)号：US5505781A

公开(公告)日：1996-04-09

申请号：US189071

申请日：1994-01-28

申请人： Tsutae Omori ,  Kouji Harada ,  Takami Satoh ,  Noriyuki Anai ,  Masafumi Nomura

发明人： Tsutae Omori ,  Kouji Harada ,  Takami Satoh ,  Noriyuki Anai ,  Masafumi Nomura

IPC分类号： G03F7/16 ,  C23C16/44 ,  C23C16/448 ,  H01L21/027 ,  H01L21/30 ,  C23C16/00

CPC分类号： C23C16/4485 ,  C23C16/4412 ,  Y10S427/101

摘要： An apparatus for hydrophobic treatment of a semiconductor wafer comprises a tank in which HMDS liquid is stored, a process chamber in which the wafer is treated, and a unit for supplying HMDS liquid from the tank into the process chamber in an amount needed at any desired time. The process chamber can be decompressed by an ejector which is connected to the process chamber through an exhaust pipe. A mount on which the wafer is mounted is arranged in the process chamber and it includes a heater embedded therein. A ring surrounds the mount and two liquid receiving recesses are formed on the top of the ring. Two HMDS liquid supply pipes extend just above their corresponding liquid receiving recesses. HMDS in liquid phase is supplied into the process chamber and vaporized in it. The density of HMDS gas in the process chamber is controlled by adjusting the amount of HMDS liquid supplied.

摘要翻译： 用于半导体晶片的疏水处理的设备包括其中存储HMDS液体的罐，处理所述晶片的处理室，以及用于将HMDS液体从所述罐供应到所述处理室中的单元，其以任何所需的量 时间。 处理室可以通过排气管连接到处理室的喷射器进行减压。 安装有晶片的安装件布置在处理室中，并且其包括嵌入其中的加热器。 一个环围绕安装座，两个液体接收凹口形成在环的顶部。 两个HMDS液体供应管正好在其相应的液体接收凹槽上方延伸。 液相中的HMDS被供应到处理室中并在其中蒸发。 通过调节供应的HMDS液体的量来控制处理室中的HMDS气体的密度。