公开(公告)号：US06939741B2

公开(公告)日：2005-09-06

申请号：US10475257

申请日：2003-01-15

申请人： Masateru Fukuoka ,  Yasuhiko Oyama ,  Munehiro Hatai ,  Satoshi Hayashi ,  Shigeru Danjo ,  Masahiko Kitamura ,  Koichi Yajima

发明人： Masateru Fukuoka ,  Yasuhiko Oyama ,  Munehiro Hatai ,  Satoshi Hayashi ,  Shigeru Danjo ,  Masahiko Kitamura ,  Koichi Yajima

IPC分类号： B24B37/04 ,  C09J5/08 ,  C09J7/02 ,  H01L21/301 ,  H01L21/304 ,  H01L21/44 ,  H01L21/46 ,  H01L21/48 ,  H01L21/68 ,  H01L21/78

CPC分类号： C09J5/08 ,  C09J7/38 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/302 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68318 ,  H01L2221/68327

摘要： It is an object of the invention to provide a method for manufacturing an IC chip wherein a wafer is prevented from being damaged and the ease of handling thereof is improved so that the wafer can be appropriately processed into IC chips, even if a thickness of the wafer is extremely reduced to approximately 50 μm.The invention provides a method for manufacturing an IC chip comprising, at least: the step of securing a wafer to a support plate via a support tape having a surface layer comprising an adhesive (A) containing a gas generating agent for generating a gas due to stimulation and a surface layer comprising an adhesive (B); the step of polishing said wafer with securing said wafer to said support plate via said support tape; the step of adhering a dicing tape to said polished wafer; the step of providing said stimulation to said adhesive (A) layer; the step of removing said support tape from said wafer; and the step of dicing said wafer, which comprises adhering said surface layer comprising adhesive (A) to said wafer and adhering said surface layer comprising adhesive (B) to said support plate in the step of securing said wafer to said support plate via said support tape, providing said stimulation while uniformly sucking under reduced pressure the entirety of said wafer from the dicing tape side thereof, and then removing said support tape from said wafer in the step of providing stimulation to said adhesive (A) layer and in the step of removing said support tape from said wafer.

摘要翻译： 本发明的目的是提供一种制造IC芯片的方法，其中防止晶片损坏，并且其处理的便利性得到改善，使得晶片可以适当地加工成IC芯片，即使其厚度 晶片极大地减少到约50毫米。 本发明提供了一种制造IC芯片的方法，至少包括以下步骤：至少通过具有表面层的支撑带将晶片固定到支撑板的步骤，所述支撑带包括粘合剂（A），所述粘合剂（A）含有用于产生气体的气体发生剂， 刺激和包含粘合剂（B）的表面层; 通过所述支撑带将所述晶片固定到所述支撑板上来抛光所述晶片的步骤; 将切割带粘附到所述抛光晶片的步骤; 向所述粘合剂（A）层提供所述刺激的步骤; 从所述晶片去除所述支撑带的步骤; 以及切割所述晶片的步骤，其包括将包含粘合剂（A）的所述表面层粘附到所述晶片并且将包含粘合剂（B）的所述表面层粘附到所述支撑板上，在通过所述支撑件将所述晶片固定到所述支撑板的步骤中 提供所述刺激，同时在减压下均匀地从其切割带侧抽吸所述晶片的整体，然后在向所述粘合剂（A）层提供刺激的步骤中从所述晶片除去所述支撑带，并且在步骤 从所述晶片去除所述支撑带。

公开(公告)号：US5572292A

公开(公告)日：1996-11-05

申请号：US420004

申请日：1995-04-11

申请人： Kiyoshi Chatani ,  Masahiko Kitamura ,  Kazuhiro Yoshihara

发明人： Kiyoshi Chatani ,  Masahiko Kitamura ,  Kazuhiro Yoshihara

IPC分类号： G03G21/00 ,  G03G21/10 ,  G03G21/18 ,  H04N1/29 ,  G03G15/00

CPC分类号： G03G21/1889 ,  H04N1/295 ,  G03G2221/1663 ,  G03G2221/1823

摘要： The present invention provides a cartridge life detecting system which detects and manages the life of a cartridge by mounting a memory on a print cartridge comprising at least an image formation member removably mounted on a main body of an image formation apparatus, carrying out operation to obtain information about the life of the cartridge based on contents read from the memory and criterial information of the life of the cartridge, and writing information about the life in the memory, comprises the steps of setting a value corresponding to the life of the cartridge by selecting one among combination of the number of printed sheets and the number of rotations of the image formation member, combination of the number of printed sheets and the number of pixels of image information, and combination of the number of printed sheets, the number of rotations of the image formation member and the number of pixels of image information, storing the value in the memory in advance, and making determination as to the life of the cartridge based on the value.

摘要翻译： 本发明提供了一种盒式寿命检测系统，其通过将存储器安装在至少包括可拆卸地安装在图像形成装置的主体上的图像形成构件的打印盒上来检测和管理盒的寿命，执行操作以获得 基于从存储器读取的内容和盒的寿命的标准信息以及关于存储器中的使用寿命的信息的关于盒的寿命的信息包括以下步骤：通过选择来设置对应于盒的寿命的值 打印纸张数与图像形成部件的旋转数的组合中的一个，打印纸张数与图像信息的像素数的组合，以及打印纸张数， 图像形成构件和图像信息的像素数量，将该值预先存储在存储器中，并进行d 根据价值确定墨盒的使用寿命。